Abstract: According to the invention, there is provided a wafer washing and drying apparatus for accurately and reliably effecting the washing of wafers after slicing, mainly the removal of foreign particles attached to the wafer end faces. The apparatus comprises a washing unit including a pluralitys of brush roller pairs for washing wafers, arranged in a row in a wafer conveying direction such that they are rotated in different directions, that is, some of them being rotated in the wafer conveying direction, and the others being rotated in the opposite direction to the wafer conveying direction, their brush bundles being arranged helically in the axial direction, at least tips of the brush hair constituting the brush hair bundles being non-linear, and a drying unit including air stream blow-out nozzles for blowing out air streams upstream with respect to the wafer conveying direction.