Patents by Inventor Hiromitsu Kobayashi
Hiromitsu Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200088830Abstract: The disclosure describes embodiments for modifying an operation of a vehicle component based on a Vehicle-to-Everything (V2X) communication. In some embodiments, a method includes receiving, by a V2X receiver, a V2X message including context data that describes a context of a V2X transmitter in an environment, wherein the V2X receiver is not sufficiently able to identify the V2X transmitter as an originator of the V2X message within the environment. The method includes determining, by the V2X receiver, digital data describing an identity of the V2X transmitter as the originator of the V2X message within the environment based on the context data. The method includes modifying the operation of the vehicle component of the V2X receiver based on the digital data describing the identity of the V2X transmitter. The vehicle component includes, for example, one or more of an autonomous driving system and an Advanced Driver Assistance System (ADAS system).Type: ApplicationFiled: September 13, 2018Publication date: March 19, 2020Inventors: Hiromitsu Kobayashi, Zhihao Jiang
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Patent number: 10396020Abstract: A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.Type: GrantFiled: April 19, 2018Date of Patent: August 27, 2019Assignee: FUJITSU LIMITEDInventors: Kei Fukui, Youichi Hoshikawa, Hiromitsu Kobayashi, Hidehiko Fujisaki, Seigo Yamawaki, Masateru Koide, Manabu Watanabe, Daisuke Mizutani, Tomoyuki Akahoshi
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Publication number: 20180315687Abstract: A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.Type: ApplicationFiled: April 19, 2018Publication date: November 1, 2018Applicant: FUJITSU LIMITEDInventors: Kei FUKUI, Youichi Hoshikawa, Hiromitsu KOBAYASHI, Hidehiko Fujisaki, Seigo Yamawaki, Masateru Koide, MANABU WATANABE, Daisuke Mizutani, Tomoyuki AKAHOSHI
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Publication number: 20170020000Abstract: A component-mounted board includes: a substrate; an electronic component disposed over the substrate; and a conductive via formed in the substrate to be in contact with a bottom surface and a side surface of an electrode of the electronic component in a state where the electronic component is disposed over the substrate.Type: ApplicationFiled: July 11, 2016Publication date: January 19, 2017Applicant: FUJITSU LIMITEDInventors: TAKATOYO YAMAKAMI, Naoki Ishikawa, Kimio Nakamura, Kenji Iida, Hiromitsu Kobayashi, Kei Fukui
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Patent number: 9192058Abstract: A method for manufacturing a component built-in substrate is disclosed, which can attain high densities of components and wirings. The method includes: mounting electronic components on a predetermined member with its surface being provided with a first layer enabled to be exfoliated; stacking a second layer to fill the electronic components further on the first layer; exfoliating and removing the predetermined member from a stacked body configured by stacking the second layer on the first layer; and forming a via to penetrate the first layer and conduct to the electronic components from a surface of the surfaces of the stacked body, from which the predetermined member is removed.Type: GrantFiled: December 19, 2014Date of Patent: November 17, 2015Assignee: FUJITSU LIMITEDInventors: Kei Fukui, Koji Komemura, Hiromitsu Kobayashi, Mitsuo Denda
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Publication number: 20150195918Abstract: A method for manufacturing a component built-in substrate is disclosed, which can attain high densities of components and wirings. The method includes: mounting electronic components on a predetermined member with its surface being provided with a first layer enabled to be exfoliated; stacking a second layer to fill the electronic components further on the first layer; exfoliating and removing the predetermined member from a stacked body configured by stacking the second layer on the first layer; and forming a via to penetrate the first layer and conduct to the electronic components from a surface of the surfaces of the stacked body, from which the predetermined member is removed.Type: ApplicationFiled: December 19, 2014Publication date: July 9, 2015Inventors: Kei FUKUI, Koji Komemura, Hiromitsu KOBAYASHI, Mitsuo DENDA
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Publication number: 20120132464Abstract: A method for manufacturing a printed wiring board includes filling material in through holes formed in first lands on a first substrate, forming projection portions projecting from the first lands on the surface of the material of the through holes, placing a conductive material on the first lands, and electrically connecting the first lands of the first substrate and second lands of second substrate by pressing the conductive material under melting filled between the first and second lands in the lamination direction of the substrates by the projection portions when laminating the substrates in such a manner that the lands of the other substrate face the lands of the substrate for aggregation of the conductive material.Type: ApplicationFiled: November 16, 2011Publication date: May 31, 2012Applicant: FUJITSU LIMITEDInventors: Hideaki YOSHIMURA, Naohito MOTOOKA, Yasuhiro KARAHASHI, Asami HONDO, Satoshi YAMAGISHI, Hiromitsu KOBAYASHI
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Patent number: 7131830Abstract: The present invention provides a blow molding machine comprising a plurality of pillars 5 set up facing on a seat 4 above a base 3 located above a blow mold 2; a stationary platen 6 provided bridging on the top portions of the pillars 5; a moving cylinder 7 set on both side of the stationary platen 6; and a holding plate 9 of blow-core members, which is connected with a piston rod 7a of the moving cylinder 7, and in which the pillars 5 are inserted vertically movable; and a clamp plate 15 projecting at both ends from the holding plate 9 outwardly, and a clamp block 16, which includes internally a pair of hydraulic cylinders 18 to clamp the clamp plate 15 from both sides with rams when the holding plate 9 is in the lower limit position, which is provided on both sides of the seat 4.Type: GrantFiled: February 27, 2004Date of Patent: November 7, 2006Assignee: A.K. Technical Laboratory, Inc.Inventors: Hiromitsu Kobayashi, Masahiro Miyashita, Hidetoshi Tatebe, Makoto Kifune
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Patent number: 6981943Abstract: Disclosed is a respiration leading system which can leads a living body to respire so that relaxation is effectively induced without any physiological load even if a respiration exercise feedback is not employed. This system comprises a control unit and a sense-stimulating unit. The control unit makes the sense-stimulating unit change the output energy for stimulating a sense of the living body so that the living body is induced to inhale and exhale as a physiological reaction. The energy change is done within the range of a respiration period x(sec) and a parameter y defined as 2 sec<x<12 sec and 0.85<y<1.45 (a region x?4 sec and y?1.3 is excluded). The parameter y is a ratio of exhaling time to inhaling time. The energy output in the first half period corresponding to either inhaling or exhaling and the energy output in the latter half corresponding to the other, induce the living body to respire.Type: GrantFiled: November 6, 2002Date of Patent: January 3, 2006Assignees: Matsushita Electric Works, Ltd., Matsushita Electric Industrial Co., Ltd.Inventors: Hiroki Noguchi, Manabu Inoue, Wataru Iwai, Hiromitsu Kobayashi, Katsushige Amano, Tadashi Yano, Yoshinori Tanabe
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Patent number: 6931752Abstract: An aligning mechanism having stage mechanisms, each of which is composed of a first stage capable of moving in the direction in which a fiber array b advances to and retreats from a waveguide type optical member a, a holding section sustaining member 2 for the fiber array and a second stage 5 capable of moving in the direction perpendicular to the direction in which the fiber array spreads, wherein angle adjusting mechanisms 6 and 7 capable rotating around the rotation axis perpendicular to both the said directions are provided between the first and second stages and the holding section sustaining member and the second stage. One aligning unit can be used for aligning either of two fiber arrays and a waveguide type optical member respectively having orthogonally ground end faces or either of fiber arrays and a waveguide type optical member respectively having obliquely ground end faces, and also allows the angle to be easily changed in response to the angle of the end faces.Type: GrantFiled: March 7, 2003Date of Patent: August 23, 2005Assignee: Moritex CorporationInventors: Naohiro Tsuda, Hiromitsu Kobayashi
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Publication number: 20050155514Abstract: A plating bath additive and a plating bath using the said additive are provided, which plating bath contains a hydroxyalkanesulfonic acid and which even when applied to an electronic part such as a semiconductor device does not give rise to a problem such as circuit-to-circuit insulation becoming defective. The plating bath additive contains a hydroxyalkanesulfonic acid as a main component and has an alkali metal content of less than 0.05 mass % relative to the hydroxyalkanesulfonic acid. The plating bath incorporates the said additive therein.Type: ApplicationFiled: January 14, 2005Publication date: July 21, 2005Applicant: Asahi Denka Co. Ltd.Inventors: Hiromitsu Kobayashi, Hirohisa Nito, Hiromasa Kawamata
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Publication number: 20040224052Abstract: A movable platen 5 which is provided between a base platen and a stationary platen, is connected to a mold clamping ram13 of a mold clamping cylinder 8. A pair of mold clamping cylinders 8 include a cylinder of which the inner diameter of their lower end portions is smaller than the inner diameter of the other portions, the mold clamping ram 13 having a piston 14 which fits to the lower end, a booster ram 16 which is inserted into the mold clamping ram, and a circulation device 20 which is provided to a side portion of the mold clamping cylinder.Type: ApplicationFiled: March 30, 2004Publication date: November 11, 2004Inventors: Hiromitsu Kobayashi, Masahiro Miyashita, Hidetoshi Tatebe, Makoto Kifune
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Publication number: 20040219254Abstract: The present invention provides a blow molding machine comprising a plurality of pillars 5 set up facing on a seat 4 above a base 3 located above a blow mold 2; a stationary platen 6 provided bridging on the top portions of the pillars 5; a moving cylinder 7 set on both side of the stationary platen 6; and a holding plate 9 of blow-core members, which is connected with a piston rod 7a of the moving cylinder 7, and in which the pillars 5 are inserted vertically movable; and a clamp plate 15 projecting at both ends from the holding plate 9 outwardly, and a clamp block 16, which includes internally a pair of hydraulic cylinders 18 to clamp the clamp plate 15 from both sides with rams when the holding plate 9 is in the lower limit position, which is provided on both sides of the seat 4.Type: ApplicationFiled: February 27, 2004Publication date: November 4, 2004Inventors: Hiromitsu Kobayashi, Masahiro Miyashita, Hidetoshi Tatebe, Makoto Kifune
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Publication number: 20030230000Abstract: An aligning mechanism having stage mechanisms, each of which is composed of a first stage capable of moving in the direction in which a fiber array b advances to and retreats from a waveguide type optical member a, a holding section sustaining member 2 for the fiber array and a second stage 5 capable of moving in the direction perpendicular to the direction in which the fiber array spreads, wherein angle adjusting mechanisms 6 and 7 capable rotating around the rotation axis perpendicular to both the said directions are provided between the first and second stages and the holding section sustaining member and the second stage.Type: ApplicationFiled: March 7, 2003Publication date: December 18, 2003Inventors: Naohiro Tsuda, Hiromitsu Kobayashi
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Publication number: 20030171643Abstract: Disclosed is a respiration leading system which can leads a living body to respire so that relaxation is effectively induced without any physiological load even if a respiration exercise feedback is not employed. This system comprises a control unit and a sense-stimulating unit. The control unit makes the sense-stimulating unit change the output energy for stimulating a sense of the living body so that the living body is induced to inhale and exhale as a physiological reaction. The energy change is done within the range of a respiration period x(sec) and a parameter y defined as 2 sec<x<12 sec and 0.85<y<1.45 (a region x≦4 sec and y≧1.3 is excluded). The parameter y is a ratio of exhaling time to inhaling time. The energy output in the first half period corresponding to either inhaling or exhaling and the energy output in the latter half corresponding to the other, induce the living body to respire.Type: ApplicationFiled: November 6, 2002Publication date: September 11, 2003Applicant: MATSUSHITA ELECTRIC WORKS, LTD.Inventors: Hiroki Noguchi, Manabu Inoue, Wataru Iwai, Hiromitsu Kobayashi, Katsushige Amano, Tadashi Yano, Yoshinori Tanabe
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Patent number: 5912385Abstract: This invention relates to a process for the production of an alkanesulfionic acid such as isethionic acid with a high purity in a high yield and at a low cost by oxidation of a (hydroxy)alkylmercaptan with hydrogen peroxide characterized in that a whole amount beyond a stoichiometric amount of a solution of hydrogen peroxide having a H.sub.2 O.sub.2 concentration of not less than 50% by weight is charged into a reaction vessel, said mercaptan is continuously fed at a temperature of 50.degree. C. or lower, aging is carried out, distillation with boiling is carried out and then the reaction mixture is contacted with an anion exchanger.Type: GrantFiled: January 20, 1998Date of Patent: June 15, 1999Assignee: Tokai Denka Kogyo Kabushiki KaishaInventors: Kazuyoshi Kushibe, Hiromitsu Kobayashi, Hirohisa Nitoh, Hirotsugu Kitamura
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Patent number: 4360127Abstract: An apparatus for supplying fluid of predetermined quantity comprises a supplying passage for supplying fluid, an opening and closing valve provided within the supplying passage, mechanism for opening the opening and closing valve, locking mechanism for locking the opening and closing valve in an open state, negative pressure generating mechanism for generating negative pressure upon supply of the fluid outside through the supplying passage, lock releasing mechanism for releasing the lock of the locking mechanism by the introduction of the negative pressure generated by the negative pressure generating mechanism atmosphere introducing mechanism for introducing atmosphere into the lock releasing mechanism to neutralize the negative pressure, solenoid valve for interrupting the atmosphere introduction by the atmosphere introducing mechanism, measuring device for measuring the flow rate of the fluid supplied through the supplying passage, and control signal transmitting device for transmitting and supplying the cType: GrantFiled: October 17, 1980Date of Patent: November 23, 1982Assignees: Tokico Ltd., Tokico Yuki Ltd.Inventors: Eisuke Maruyama, Hiromitsu Kobayashi, Masakazu Mitsuhashi, Hiromichi Takeuchi, Yoshiki Futamura, Naohito Suzuki
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Patent number: 4359074Abstract: A fuel supplying apparatus comprises a fuel supplying nozzle having an ejection pipe for ejecting fuel and a supplying passage for supplying the fuel to the ejection pipe, an opening and closing valve provided in the supply passage, a nozzle lever for opening the opening and closing valve, locking mechanism for locking the opening and closing valve in an open state, negative pressure generating mechanism for generating negative pressure upon supply of the fuel outside through the ejection pipe, lock releasing mechanism for releasing the lock of the locking mechanism by the introduction of the negative pressure generated by the negative pressure generating mechanism, atmosphere introducing mechanism for introducing atmosphere into the lock releasing mechanism to neutralize the negative pressure, solenoid valve for interrupting the introduction of the atmosphere by the atmosphere introducing mechanism when no current is introduced, and allowing the introduction of the atmosphere by the atmosphere introducing meType: GrantFiled: October 17, 1980Date of Patent: November 16, 1982Assignees: Tokico Ltd., Tokico Yuki Ltd.Inventors: Eisuke Maruyama, Hiromitsu Kobayashi, Masakazu Mitsuhashi, Hiromichi Takeuchi, Yoshiki Futamura, Naohito Suzuki