Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.

Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.

Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Abstract: In an automatic developing machine in which a photographic film is dried by a drying unit after development, a method of controlling the temperature and/or humidity of the film drying air in order to prevent variation in the film size before and after the processes of development and drying, which comprises prior computation of the variations in the film size according to a temperature and humidity of outside air, thereby determining the optimum operating condition of the drying unit from a result of the prior computation, and thereafter setting the drying unit with the optimum operating condition so that the automatic developing machine may process the film without variation in the film size.

Abstract: In an automatic developing machine in which a photographic film is dried by a drying unit after development, a method of controlling the temperature and/or humidity of the film drying air in order to prevent variation in the film size before and after the processes of development and drying, which comprises prior computation of the variations in the film size according to a temperature and humidity of outside air, thereby determining the optimum operating condition of the drying unit from a result of the prior computation, and thereafter setting the drying unit with the optimum operating condition so that the automatic developing machine may process the film without variation in the film size.