Patents by Inventor Hiromitsu Maejima

Hiromitsu Maejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate transfer apparatus, substrate transfer method, and non-transitory storage medium
    Patent number: 10256127
    Abstract: A substrate transfer apparatus to transfer a circular substrate provided with a cutout at an edge portion thereof, includes: a sensor part including three light source parts applying light to positions different from one another at the edge portion, and three light receiving parts paired with the light source parts; and a drive part for moving the substrate holding part, wherein the three light source parts apply light to the light receiving parts so that whether or not a detection range of the sensor part overlaps with the cutout of the substrate is determined on the basis of an amount of received light by each light receiving part, and when it is determined that there is an overlap at any position, positions of the edge portion of the substrate are further detected with the position of the substrate displaced with respect to the sensor part.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: April 9, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Tokutarou Hayashi, Yuichi Douki, Hiromitsu Maejima
  • SUBSTRATE TRANSFER APPARATUS, SUBSTRATE TRANSFER METHOD, AND NON-TRANSITORY STORAGE MEDIUM
    Publication number: 20170018444
    Abstract: A substrate transfer apparatus to transfer a circular substrate provided with a cutout at an edge portion thereof, includes: a sensor part including three light source parts applying light to positions different from one another at the edge portion, and three light receiving parts paired with the light source parts; and a drive part for moving the substrate holding part, wherein the three light source parts apply light to the light receiving parts so that whether or not a detection range of the sensor part overlaps with the cutout of the substrate is determined on the basis of an amount of received light by each light receiving part, and when it is determined that there is an overlap at any position, positions of the edge portion of the substrate are further detected with the position of the substrate displaced with respect to the sensor part.
    Type: Application
    Filed: September 28, 2016
    Publication date: January 19, 2017
    Inventors: Tokutarou HAYASHI, Yuichi DOUKI, Hiromitsu MAEJIMA
  • Substrate transfer apparatus, substrate transfer method, and non-transitory storage medium
    Patent number: 9507349
    Abstract: A substrate transfer apparatus to transfer a circular substrate provided with a cutout at an edge portion thereof, includes: a sensor part including three light source parts applying light to positions different from one another at the edge portion, and three light receiving parts paired with the light source parts; and a drive part for moving the substrate holding part, wherein the three light source parts apply light to the light receiving parts so that whether or not a detection range of the sensor part overlaps with the cutout of the substrate is determined on the basis of an amount of received light by each light receiving part, and when it is determined that there is an overlap at any position, positions of the edge portion of the substrate are further detected with the position of the substrate displaced with respect to the sensor part.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: November 29, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Tokutarou Hayashi, Yuichi Douki, Hiromitsu Maejima