Patents by Inventor Hiromitsu Miyai

Hiromitsu Miyai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Internally reinforced bond pads
    Patent number: 7273804
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: September 25, 2007
    Assignee: International Business Machines Corporation
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
  • Internally reinforced bond pads
    Publication number: 20050121803
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Application
    Filed: January 6, 2005
    Publication date: June 9, 2005
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel McKnight, Hiromitsu Miyai, Kevin Petrarca, Wolfgang Sauter, Richard Volant, Caitlin Weinstein
  • Internally reinforced bond pads
    Patent number: 6864578
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: March 8, 2005
    Assignee: International Business Machines Corporation
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
  • Internally reinforced bond pads
    Publication number: 20040195642
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Application
    Filed: April 3, 2003
    Publication date: October 7, 2004
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein