Patents by Inventor Hiromitsu Seitoh

Hiromitsu Seitoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060049544
    Abstract: The present invention provides a combined injection molding product including a primary resin molding product (1) and a secondary injection molding product (2), which attain improved adhesion to each other and enhanced air tightness therebetween. The present invention enables selective and local application of compression pressure upon shaping a combined injection molding product by forming, through injection, a secondary resin molding product (2) onto a primary resin molding product (1). The method includes applying a compression pressure on a secondary resin molding product (2) side, to thereby improve adhesion between the primary resin molding product (1) and the secondary resin molding product (2) and air tightness therebetween, wherein portions at which the secondary resin molding product (2) is united with the primary resin molding product (1) with poor adhesion are compressed selectively and locally.
    Type: Application
    Filed: September 2, 2003
    Publication date: March 9, 2006
    Applicant: POLYPLASTICS CO., LTD.
    Inventors: Hiromitsu Seitoh, Katsumasa Miwa
  • Patent number: 5128399
    Abstract: Polybutylene terephthalate (PBT) injection-molding compositions exhibit improved mold-release properties and sufficient extruder screw "bite" during injection molding. The PBT compositions are a polyblend of a PBT base resin with an effective amount (preferably between about 0.01 to 10 parts by weight) of a processing aid which is a sorbitan ester of a fatty acid having at least 12 carbon atoms. The PBT injection molding compositions of the invention may be used in a variety of end-use applications (e.g., the automotive and/or electronic industries) to form stable injection-molded thin-walled and/or complex-shaped articles.
    Type: Grant
    Filed: July 11, 1991
    Date of Patent: July 7, 1992
    Assignee: Polyplastics Co., Ltd.
    Inventors: Mitsuhiro Mochizuki, Mitsuo Wada, Hiromitsu Seitoh