Patents by Inventor Hiromitsu Seitou

Hiromitsu Seitou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5115004
    Abstract: Polyester resin molding compositions exhibiting exceptional low temperature physical properties (i.e., flexibility and toughness) and satisfactory mold-release properties include a melt-blend of a polyester base resin (preferably one which predominantly contains polybutylene terephthalate units), a polyester elastomer (preferably a copolyester having hard and soft segments), and a mold-release effective amount of a sorbitan ester (preferably an ester reaction product of a sorbitan with fatty acid having at least 12 carbon atoms). The sorbitan ester most preferably has a hydroxyl value of between 50 to 400, exclusive, so that blooming during injection molding operations (e.g., a predrying stage) is minimized (if not eliminated entirely). Molded articles formed of the compositions of this invention may be used in a variety of applications, for example, as parts for the automotive and/or electronics industries.
    Type: Grant
    Filed: August 14, 1991
    Date of Patent: May 19, 1992
    Assignee: Polyplastics Co., Ltd.
    Inventors: Mitsuhiro Mochizuki, Mitsuo Wada, Hiromitsu Seitou