Abstract: A pressure-sensitive adhesive tape package is described in which while easiness in applying the adhesive tape is pursued, an effect of saving in resources can be obtained. The pressure-sensitive adhesive tape package accommodates an adhesive tape having a support and an adhesive agent layer provided on one surface of the support, and includes a release sheet releasably attached to the adhesive agent layer. Moreover, in the pressure-sensitive adhesive tape package, the release sheet is bent along a predetermined bending line with the adhesive tape, and the adhesive tape is sealed inside of the bent release sheet.

Abstract: A pressure-sensitive adhesive tape package is described in which while easiness in applying the adhesive tape is pursued, an effect of saving in resources can be obtained. The pressure-sensitive adhesive tape package accommodates an adhesive tape having a support and an adhesive agent layer provided on one surface of the support, and includes a release sheet releasably attached to the adhesive agent layer. Moreover, in the pressure-sensitive adhesive tape package, the release sheet is bent along a predetermined bending line with the adhesive tape, and the adhesive tape is sealed inside of the bent release sheet.

Abstract: A parasitic element extracting system includes: a classifying section configured to classify each of interconnection layers of a layout structure of a semiconductor device into one of an upper interconnection layer and an lower interconnection layer based on a predetermined criterion; and a marker producing section configured to generate a marker to indicate a via-contact connecting the upper interconnection layers and the lower interconnection layers. An upper layer parasitic element list producing section is configured to generate an upper layer parasitic element list by extracting parasitic elements in the upper interconnection layers based on a first criterion, and a lower layer parasitic element list producing section is configured to generate a lower layer parasitic element list by extracting parasitic elements in the lower interconnection layers based on a second criterion which is different from the first criterion.

Abstract: A pressure-sensitive adhesive tape package is described in which while easiness in applying the adhesive tape is pursued, an effect of saving in resources can be obtained. The pressure-sensitive adhesive tape package accommodates an adhesive tape having a support and an adhesive agent layer provided on one surface of the support, and includes a release sheet releasably attached to the adhesive agent layer. Moreover, in the pressure-sensitive adhesive tape package, the release sheet is bent along a predetermined bending line with the adhesive tape, and the adhesive tape is sealed inside of the bent release sheet.

Abstract: A parasitic element extracting system includes: a classifying section configured to classify each of interconnection layers of a layout structure of a semiconductor device into one of an upper interconnection layer and an lower interconnection layer based on a predetermined criterion; and a marker producing section configured to generate a marker to indicate a via-contact connecting the upper interconnection layers and the lower interconnection layers. An upper layer parasitic element list producing section is configured to generate an upper layer parasitic element list by extracting parasitic elements in the upper interconnection layers based on a first criterion, and a lower layer parasitic element list producing section is configured to generate a lower layer parasitic element list by extracting parasitic elements in the lower interconnection layers based on a second criterion which is different from the first criterion.