Abstract: A package member includes a first cushioning member and a bottom supporting member that supports the first cushioning member. The first cushioning member includes concave portions in which bottoms of a plurality of packaged articles are fitted, and a convex portion that is inserted between the packaged articles. A predetermined space is formed at backsides of the concave portions. The bottom supporting member is arranged in the predetermined space in contact with the backside of any of the concave portions of the first cushioning member and is inflatable when filled with air.

Abstract: A manufacturing method for a multilayer ceramic substrate superior in adhesion between the substrate and thick film pads formed on the surface of the substrate. Copper paste is screen-printed on a glass-ceramics green sheet for forming a surface layer to form a plurality of surface thick film pads respectively connected to a plurality of vias formed in the green sheet. Each of the surface thick film pads is partially covered with a dielectric material. Then, a plurality of green sheets for forming inner layers and the surface-layer green sheet are laminated together so that the surface-layer green sheet forms an uppermost layer. The laminated sheets are bonded integrally with each other by applying heat and pressure, and are then fired at a predetermined temperature for a predetermined time.

Abstract: A composition for the formation of vias on a ceramic substrate, the composition including (a) at least one powder containing copper, gold, silver, tungsten, molybdenum, nickel, palladium, platinum, aluminium, or an alloy thereof; and (b) 5 to 40 wt %, based on the weight of the powder in the composition, of one or more of an organosilicic compound, an organoaluminium compound, an organozirconium compound, and an organomagnesium compound. A further embodiment of a composition for the formation of vias includes (a) and (b) above and, in addition, (c) a binder material including a cellulose derivative or a heat decomposable polymethamethyl acrylate binder, and (d) a high boiling point organic solvent. The invention also includes a method for use in the formation of vias on a substrate having perforating holes therein. Such a substrate could be a glass ceramic composite substrate, an alumina substrate, a magnesia substrate, a zirconia substrate, or green sheets thereof.

Abstract: A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

Abstract: A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

Abstract: A method for producing a ceramic circuit board comprising the steps of (i) forming a conductor portion of the ceramic circuit board by printing a conductive paste composition on a ceramic base plate for the circuit board and then (ii) firing the ceramic base plate and the conductive paste composition together, wherein a copper-base composition comprising a copper powder and 0.5 to 5 parts by weight, based on 100 parts by weight of copper powder, of at least one organo metallic compound capable of forming an inorganic compound or compounds, respectively, when fired in an inert atmosphere, is used as the conductive paste composition.The combined use of isopropyl tridodecylbenzene sulfonyl titanate and isopropyl triisostearoyl titanate greatly improve the flowability of the copper-base conductive paste composition.

Abstract: A multi-layer superconducting circuit substrate, including insulating layers, and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material are preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.

Abstract: A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

Abstract: A process for producing a multilayer ceramic circuit board with copper including the steps of:forming green sheets by doctoring a slurry which includes 100 parts by weight of glass ceramic particles, 5 to 20 parts by weight of a thermally depolymerizable resin binder, 2 to 10 parts by weight of a plasticizer, and up to 2 parts by weight of a fatty acid ethylene oxide adduct type, deflorculant. The glass ceramic includes 20 to 70% by weight of alumina, and 30 to 80% by weight of SiO.sub.2 -B.sub.2 O.sub.3 glass. The process further includes the steps of forming via holes through the green sheets, screen-printing a copper paste on the green sheets, and laminating the green sheets, thereby forming a multilayer structure and firing the multilayer structure in a non-oxidizable atmosphere.

Abstract: A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

Abstract: A method of forming a ceramic circuit substrate allowing mounting of high integration density semiconductor elements. The method provides a multilayered ceramic circuit substrate having via holes formed with high accuracy and high integration density wiring patterns by forming metallic conductive balls to connect the conductive wiring patterns of upper and lower layers; a ball arranging plate having many holes placing on a green sheet uniformly in close contact; filling the holes of the plate with the embedding the conductive balls by pressure into the green sheet; and thereafter baking the green sheet individually or in a stacked layered arrangement.

Abstract: A multilayer circuit board (10) for putting semiconductor devices thereon consists of conductor layers (6, 60, 61, 62, 63) made of a metal selected from the group consisting of Au, Ag, Cu and an alloy thereof, insulating material (2, 7) made of glass-ceramic and an alumina sintered plate (1). The glass-ceramic is comprised of borosilicate glass and alumina and has a low dielectric constant and a thermal expansion coefficient approaching that of the semiconductor devices. The alumina sintered plate (1) is placed between the ground and supply voltage conductor layers (62, 63) and the signal conductor layers (60).