Patents by Inventor Hiromori Tobase

Hiromori Tobase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flat package for semiconductor IC
    Patent number: 5616954
    Abstract: In a flat package for a semiconductor IC (Integrated Circuit), a substrate has internal ground wirings respectively connecting a cavity and a seal metallized portion to respective suspension leads. The suspension leads are connected to ground for a shielding purpose. With this configuration, the package eliminates the need for exclusive ground leads which would limit the number of available valid leads. In addition, a single standard type of ICs can implement various shield configurations as desired by users.
    Type: Grant
    Filed: August 16, 1995
    Date of Patent: April 1, 1997
    Assignee: NEC Corporation
    Inventor: Hiromori Tobase