Abstract: Connection with a wiring structure can be reliably achieved, whereby a semiconductor sensor device and a semiconductor sensor device manufacturing method with increased reliability are provided. A semiconductor sensor device in which a multiple of signal lines and a sensor detection portion are disposed includes a conductive film, disposed on a substrate, that configures the signal lines and whose upper face is exposed by an aperture portion of a width smaller than a width of the signal lines, a conductive member formed on the conductive film and electrically connected to the conductive film via the aperture portion, and a wiring structure, formed on an upper face of the conductive member, of an air bridge structure that connects the signal lines or the signal lines and the sensor detection portion, wherein an upper surface of the conductive member is in contact with the wiring structure, and a side face is exposed.

Abstract: Connection with a wiring structure can be reliably achieved, whereby a semiconductor sensor device and a semiconductor sensor device manufacturing method with increased reliability are provided. A semiconductor sensor device in which a multiple of signal lines and a sensor detection portion are disposed includes a conductive film, disposed on a substrate, that configures the signal lines and whose upper face is exposed by an aperture portion of a width smaller than a width of the signal lines, a conductive member formed on the conductive film and electrically connected to the conductive film via the aperture portion, and a wiring structure, formed on an upper face of the conductive member, of an air bridge structure that connects the signal lines or the signal lines and the sensor detection portion, wherein an upper surface of the conductive member is in contact with the wiring structure, and a side face is exposed.

Abstract: There is provided a sensor element including: a semiconductor base member having a first main surface and a second main surface located opposite to the first main surface, and having a cavity structure formed on the second main surface side; and a detection element formed on the first main surface side in a region where the cavity structure is formed, the second main surface of the semiconductor base member including a convexly and concavely shaped portion, and a tip of a convex portion of the convexly and concavely shaped portion having a curved shape.

Abstract: A sensor element includes: a first substrate in which a diaphragm is configured on a main surface; a second substrate which is provided on the side opposite to the diaphragm of the first substrate; a cavity which is provided just below the diaphragm of the first substrate; a bonding position which is provided at a bonding position between the first substrate and the second substrate for airtight sealing of the cavity; and a bump portion which is provided at the fitting portion, and protects a fitted state between the first substrate and the second substrate.

Abstract: The flow rate detection device includes a sensor element and a support. The sensor element includes: a cavity which is formed in a rear surface of a plate-shaped semiconductor silicon substrate by removing part of the plate-shaped semiconductor silicon substrate; and a thin film portion which is disposed over the cavity and includes a detecting element. The support includes a fitting portion into which the sensor element is to be disposed. The sensor element is supported to the fitting portion by an adhesive in a floating manner. A gap formed between the sensor element and the fitting portion is filled with an anti-undercurrent material. The sensor element has a texture including protrusions and depressions formed on a surface opposed to the fitting portion, and the anti-undercurrent material is brought into contact with the texture.

Abstract: A sensor element includes: a first substrate in which a diaphragm is configured on a main surface; a second substrate which is provided on the side opposite to the diaphragm of the first substrate; a cavity which is provided just below the diaphragm of the first substrate; a bonding position which is provided at a bonding position between the first substrate and the second substrate for airtight sealing of the cavity; and a bump portion which is provided at the fitting portion, and protects a fitted state between the first substrate and the second substrate.

Abstract: The flow rate detection device includes a sensor element and a support. The sensor element includes: a cavity which is formed in a rear surface of a plate-shaped semiconductor silicon substrate by removing part of the plate-shaped semiconductor silicon substrate; and a thin film portion which is disposed over the cavity and includes a detecting element. The support includes a fitting portion into which the sensor element is to be disposed. The sensor element is supported to the fitting portion by an adhesive in a floating manner. A gap formed between the sensor element and the fitting portion is filled with an anti-undercurrent material. The sensor element has a texture including protrusions and depressions formed on a surface opposed to the fitting portion, and the anti-undercurrent material is brought into contact with the texture.

Abstract: There is provided a variable device circuit according to the present invention, including: a substrate; at least one movable switch device formed on a first principal surface of the substrate; at least one fixed capacitor device formed on the first principal surface of the substrate; at least one variable capacitor device formed on the first principal surface of the substrate; at least one variable inductor device formed on the first principal surface of the substrate; and wiring lines for electrically connecting the devices to one another, the wiring lines being formed on the first principal surface of the substrate; wherein electrical connections among the devices can be selected by operation of the movable switch device, whereby achieving stable, low-loss circuit characteristics with lower manufacturing cost.

Abstract: There is provided a variable device circuit according to the present invention, including: a substrate; at least one movable switch device formed on a first principal surface of the substrate; at least one fixed capacitor device formed on the first principal surface of the substrate; at least one variable capacitor device formed on the first principal surface of the substrate; at least one variable inductor device formed on the first principal surface of the substrate; and wiring lines for electrically connecting the devices to one another, the wiring lines being formed on the first principal surface of the substrate; wherein electrical connections among the devices can be selected by operation of the movable switch device, whereby achieving stable, low-loss circuit characteristics with lower manufacturing cost.

Abstract: A thermal infrared sensor device includes a substrate having a concave portion, a temperature detecting portion connected to the substrate via a supporting leg held at an upper portion of a space within the concave portion, an infrared reflecting film covering at least a portion of the supporting leg without being thermally connected to the temperature detecting portion, and an absorbing hood portion held opposite the infrared reflecting film and thermally connected to the temperature detecting portion, without being thermally connected to the infrared reflecting film, and extending laterally, in a plate shape, covering at least a portion of the infrared reflecting film.

Abstract: A liquid crystal display device which can, even in case where a vibration and an impact such as drop are exerted on a note type computer in which the liquid crystal display device is mounted, prevent a fitting portion for fixing a case body and an LCD cover from disengaging and a pawl portion of the fitting portion from being damaged, and which has fixing means whose maintenance performed by detaching the case body and the LCD cover is easy. A frame-like cushion material whose internal dimension is smaller than an external dimension of a liquid crystal display element and which is formed by using a material excellent in its elastic coefficient and having a high friction factor is mounted inside the case body 4 of the liquid crystal display device, and the liquid crystal display element is fitted into the frame.

Abstract: A thermal infrared sensor device includes a substrate having a concave portion, a temperature detecting portion connected to the substrate via a supporting leg held at an upper portion of a space within the concave portion, an infrared reflecting film covering at least a portion of the supporting leg without being thermally connected to the temperature detecting portion, and an absorbing hood portion held opposite the infrared reflecting film and thermally connected to the temperature detecting portion, without being thermally connected to the infrared reflecting film, and extending laterally, in a plate shape, covering at least a portion of the infrared reflecting film.

Abstract: A liquid crystal display device which can, even in case where a vibration and an impact such as drop are exerted on a note type computer in which the liquid crystal display device is mounted, prevent a fitting portion for fixing a case body and an LCD cover from disengaging and a pawl portion of the fitting portion from being damaged, and which has fixing means whose maintenance performed by detaching the case body and the LCD cover is easy. A frame-like cushion material whose internal dimension is smaller than an external dimension of a liquid crystal display element and which is formed by using a material excellent in its elastic coefficient and having a high friction factor is mounted inside the case body 4 of the liquid crystal display device, and the liquid crystal display element is fitted into the frame.

Abstract: A liquid crystal display device which can, even in case where a vibration and an impact such as drop are exerted on a note type computer in which the liquid crystal display device is mounted, prevent a fitting portion for fixing a case body and an LCD cover from disengaging and a pawl portion of the fitting portion from being damaged, and which has fixing means whose maintenance performed by detaching the case body and the LCD cover is easy. A frame-like cushion material whose internal dimension is smaller than an external dimension of a liquid crystal display element and which is formed by using a material excellent in its elastic coefficient and having a high friction factor is mounted inside the case body 4 of the liquid crystal display device, and the liquid crystal display element is fitted into the frame.

Abstract: A liquid crystal display device which can, even in case where a vibration and an impact such as drop are exerted on a note type computer in which the liquid crystal display device is mounted, prevent a fitting portion for fixing a case body and an LCD cover from disengaging and a pawl portion of the fitting portion from being damaged, and which has fixing means whose maintenance performed by detaching the case body and the LCD cover is easy. A frame-like cushion material whose internal dimension is smaller than an external dimension of a liquid crystal display element and which is formed by using a material excellent in its elastic coefficient and having a high friction factor is mounted inside the case body 4 of the liquid crystal display device, and the liquid crystal display element is fitted into the frame.