Patents by Inventor Hiromoto Sato

Hiromoto Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITION
    Publication number: 20240002688
    Abstract: The present invention relates to a composition comprising at least one light emitting moiety.
    Type: Application
    Filed: October 18, 2021
    Publication date: January 4, 2024
    Applicant: MERCK PATENT GMBH
    Inventors: Yuki HIRAYAMA, Tadashi KISHIMOTO, Tomohisa GOTO, Hiromoto SATO, Nils GREINERT, Teruaki SUZUKI
  • Organic light emitting materials as well as light emitting devices containing these materials
    Publication number: 20060278849
    Abstract: The present invention relates to an electro-luminescent material, which is characterized in that it comprises a liquid crystalline mixture containing at least one liquid crystalline compound with a negative dielectric anisotropy, to an electro-luminescent device containing such an electro-luminescent material as well as to a method of preparation such a device.
    Type: Application
    Filed: February 11, 2004
    Publication date: December 14, 2006
    Inventors: Masayoshi Suzuki, Hiromoto Sato, Atsushi Sawada
  • Method for producing a laminated object and apparatus for producing the same
    Patent number: 6054192
    Abstract: A method for producing a laminated object repeats a depositing step and an irradiating step alternatively. The irriating step comprises the operations of: covering a deposited layer with a mask having a pattern configuration for penetrating the laser beam; and scanning the lader beam on the desposited layer covered with the mask in such a manner that the laser beam depicts an irradiated continous wave trace being wider than the pattern configuration of the mask, by moving the laser beam in the Y-direction with a Y-rotating mirror, while repeating oscillations of the laser beam in the X-direction with a X-rotating nirror, The laminated object may be a casting mold.
    Type: Grant
    Filed: January 22, 1998
    Date of Patent: April 25, 2000
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yukio Otsuka, Motoaki Ozaki, Hiromoto Sato
  • Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits
    Patent number: 5633480
    Abstract: Conductive circuits (copper foil) are provided on both surfaces of a basefilm. A first prepreg is laminated onto both surfaces of the basefilm. A cover lay is provided at an opening portion of the basefilm. The cover lay may extend to a through-hole. The semirigid cover lay, made from polyimide-containing resin material, is placed to cover the opening portion, thermocompressed, and bonded to be laminated onto the surface of the basefilm. A second prepreg having an opening portion whose shape is substantially similar to the opening portion of the first prepreg, is laminated on the first prepreg.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: May 27, 1997
    Assignee: CMK Corporation
    Inventors: Hiromoto Sato, Junzaburo Shirai
  • Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay
    Patent number: 5629497
    Abstract: A prepreg having an opening portion is placed on a cover lay which covers conductive circuits formed on a basefilm. A copper foil sheet is placed on the prepreg in such a way that the copper foil sheet covers the opening portion. The copper foil sheet has no opening portion. Next, the basefilm, the prepreg, and the copper foil are thermocompressed to become one laminate. After making a hole in the laminate, the laminate is plated, and then a through-hole is formed. A conductive circuit is formed by etching the copper foil sheet.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: May 13, 1997
    Assignee: CMK Corporation
    Inventors: Hiromoto Sato, Junzaburo Shirai