Patents by Inventor Hiromu Miyashita

Hiromu Miyashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11461903
    Abstract: Accurate and rapid identification can be performed even when feature vectors of input pixels and background pixels are close.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: October 4, 2022
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Hirokazu Kakinuma, Yoshihide Tonomura, Hiromu Miyashita, Hidenobu Nagata, Kota Hidaka
  • Publication number: 20220180475
    Abstract: Provided is a panoramic video composition apparatus that suppresses a double image or a defect of an object even when the object moves to traverse an overlap region between cameras.
    Type: Application
    Filed: April 10, 2020
    Publication date: June 9, 2022
    Inventors: Hiromu Miyashita, Masayoshi CHIKADA, Megumi Isogai
  • Publication number: 20210158534
    Abstract: Accurate and rapid identification can be performed even when feature vectors of input pixels and background pixels are close.
    Type: Application
    Filed: May 23, 2019
    Publication date: May 27, 2021
    Inventors: Hirokazu Kakinuma, Yoshihide TONOMURA, Hiromu Miyashita, Hidenobu Nagata, Kota HIDAKA
  • Patent number: 6592986
    Abstract: The present invention presents an SMC with which the electrically conductive layer does not break down or become non-uniform during molding and with which molded articles with excellent electromagnetic wave shielding capability and electric conductivity can be produced. This SMC is a thermosetting resin sheet molding compound having at least one continuous layer of electrically conductive fibers with a fiber length of 50 &mgr; to 5 mm, and it is further preferred that electrically conductive powder is uniformly dispersed throughout the entire molding compound. These SMCs can be produced by impregnating a reinforcing material with a thermosetting resin composition which is combined with the above-mentioned electrically conductive fibers, or the electrically conductive fibers and electrically conductive powder, and forming at least one continuous layer of these electrically conductive fibers adjacent to this reinforcement layer.
    Type: Grant
    Filed: November 24, 2000
    Date of Patent: July 15, 2003
    Assignee: Mitsui Takeda Chemicals Inc.
    Inventors: Masahiro Hakotani, Koichi Akiyama, Hiromu Miyashita, Takashi Shibata
  • Patent number: 5447676
    Abstract: The unsaturated polyester resin molding composition of the invention comprising an unsaturated polyester, a vinyl monomer, a stabilizer, a thermoplastic resin, an organic peroxide, a fluidity modifier, a thickening agent, a filler and a fibrous reinforcement material possesses curability at low temperatures of about 50.degree. to 120.degree. C., good fluidity and filling property on the occasion of molding at low pressures of about 0.1 to 20 kgf/cm.sup.2, and good storage stability at room temperature.
    Type: Grant
    Filed: October 19, 1993
    Date of Patent: September 5, 1995
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Yoshihiro Fukuda, Haruyuki Yonehara, Hiromu Miyashita
  • Patent number: 5412003
    Abstract: Resin compositions containing (a) unsaturated polyester, (b) polymerizable monomer, (c) thermoplastic resin, (d) a polymerization initiator, and (e) hollow glass microspheres with a true density of 0.5 to 1.3 g/cm.sup.3 and an elution alkalinity of 0.05 meq/g or less; molding materials obtained by impregnating glass fibers with such resin compositions; and molded products obtained by curing such molding materials.The molding materials have a superior workability and are useful for the production of parts to be coated, such as automotive external body panels. The molded products are light in weight and are highly resistant to water. Defective adhesion of coating or blisters does not occur.
    Type: Grant
    Filed: January 22, 1993
    Date of Patent: May 2, 1995
    Assignees: Takeda Chemical Industries, Ltd., Toyota Jidosha Kabushiki Kaisha
    Inventors: Koichi Akiyama, Hiromu Miyashita, Sanji Aoki, Ken Hatta, Takashi Ino, Yasuhiro Mishima
  • Patent number: 5246983
    Abstract: A resin composition comprising (a) an unsaturated polyester, (b) a vinyl monomer, (c) a thermoplastic resin, (d) a curing agent and (e) a hollow filler with a number average particle diameter of not more than 20 .mu., wherein (e) occurs in a proportion of 10 to 150 parts by weight to 100 parts by weight of (a), (b) and (c) combined, and the molding compounds obtainable by impregnating glass fiber with the said resin composition are very useful in that, because of their lower specific gravity, they provide lightweight products with excellent surface quality which are great use as automotive exterior body panels and other parts.
    Type: Grant
    Filed: June 19, 1991
    Date of Patent: September 21, 1993
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Takashi Shibata, Hiromu Miyashita, Sanzi Aoki, Koichi Akiyama
  • Patent number: 4603181
    Abstract: One-package type composition for in-mold coating is disclosed which contains (a) a urethane compound having at least two acryloyloxy or methacryloyloxy groups at the terminal and at least one 1-oxa-3,5-diazine-2,4,6-trione ring in the molecule, (b) an ester resin having at least one reactive double bond prepared by the reaction of an epoxy compound with an unsaturated carboxylic acid and (c) a vinyl monomer. The composition is useful for coating the molded product from fiberglass reinforced thermosetting polyester resin compounds within a mold. The composition, when coated, shows excellent adherence to the molded product and excellent water resistance.
    Type: Grant
    Filed: April 3, 1985
    Date of Patent: July 29, 1986
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Kenichi Nishino, Hiromu Miyashita, Tadao Fukui