Patents by Inventor Hiromu Nishitani

Hiromu Nishitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin
    Patent number: 6242287
    Abstract: Provided are a method for manufacturing a semiconductor device in which a sealing resin is prevented from being damaged and generation of a resin piece is suppressed, a press die for suppressing the generation of the resin piece, and a guide rail. A frame receiving die (11) includes a cavity (11d) having a rectangular contour shape seen on a plane which serves to house a sealing resin (3) therein, and a remaining gate housing section (11c) provided on any of four corners of the cavity (11d) corresponding to a remaining gate (3b) on a lower face of a corner (2a) of a lead frame (2). A lower gate punch (11a) is provided in a boundary portion between the cavity (11d) and the remaining gate housing section (11c). When the lead frame (2) is mounted on the frame receiving die (11), the sealing resin (3) is housed in the cavity (11d) and the remaining gate (3b) is housed in the remaining gate housing section (11c).
    Type: Grant
    Filed: March 20, 1998
    Date of Patent: June 5, 2001
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Engineering Co., Ltd.
    Inventors: Hideji Aoki, Hidenori Sekiya, Kenichirou Katou, Hiromu Nishitani