Patents by Inventor Hiromune Matsuoka

Hiromune Matsuoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11976851
    Abstract: A refrigeration cycle device that includes a main refrigerant circuit and a sub-refrigerant circuit cools or heats a main refrigerant that flows between a main heat-source-side heat exchanger and a main usage-side heat exchanger by causing a sub-usage-side heat exchanger to function as an evaporator or a radiator of a sub-refrigerant. A first main expansion mechanism and a second main expansion mechanism that decompress the main refrigerant are provided on an upstream side and a downstream side of the sub-usage-side heat exchanger of the main refrigerant circuit.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: May 7, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Ikuhiro Iwata, Eiji Kumakura, Kazuhiro Furusho, Ryusuke Fujiyoshi, Hiromune Matsuoka
  • Patent number: 11959667
    Abstract: A suction injection pipe and a subcooling heat exchanger are provided at a main refrigerant circuit in which a main refrigerant circulates. Further, a sub-refrigerant circuit that differs from the main refrigerant circuit and in which a sub-refrigerant circulates is provided. A controller performs control for switching between a cooling action of the subcooling heat-exchanger that cools the main refrigerant that is sent to a main use-side heat exchanger by using the suction injection pipe and the subcooling heat exchanger, and a cooling action of the sub-refrigerant-circuit that cools the main refrigerant that is sent to the main use-side heat exchanger by using the sub-refrigerant circuit.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: April 16, 2024
    Assignee: Daikin Industries, Ltd.
    Inventors: Ikuhiro Iwata, Eiji Kumakura, Kazuhiro Furusho, Ryusuke Fujiyoshi, Hiromune Matsuoka
  • Patent number: 11739995
    Abstract: A refrigeration cycle device includes a heat source, a first use unit, a second use unit, a first connection flow path, and a second connection flow path. The heat source has a compressor and a heat-source side heat exchanger. The first use unit is separated from the heat source unit and has a first use-side heat exchanger. The second use unit is separated from the heat source unit and has a second use-side heat exchanger. The first connection flow path connects the heat source unit to the first and the second use units and causes a first refrigerant to flow. The second connection flow path connects the heat source unit to the first and the second use units and causes a second refrigerant to flow. A specific enthalpy of the second refrigerant is smaller than a specific enthalpy of the first refrigerant.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: August 29, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Takuro Yamada, Atsushi Yoshimi, Eiji Kumakura, Ikuhiro Iwata, Takeru Miyazaki, Hiromune Matsuoka
  • Patent number: 11739990
    Abstract: A heat transport system includes: a refrigerant circuit that seals therein a fluid including HFC-32 and/or HFO refrigerant as a refrigerant and that includes a refrigerant booster that boosts the refrigerant, an outdoor air heat exchanger that exchanges heat between the refrigerant and outdoor air, a medium heat exchanger that exchanges heat between the refrigerant and a heat transfer medium, and a refrigerant flow path switch that switches between a refrigerant radiation state and a refrigerant evaporation state; and a medium circuit that seals carbon dioxide therein as the heat transfer medium.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: August 29, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiromune Matsuoka, Ryuusuke Fujiyoshi, Kyou Tomikawa, Yoshihiko Hagiwara
  • Patent number: 11585568
    Abstract: A drainage mechanism is connected to a drain pump that sucks water from a drain pan. The drainage mechanism includes a connecting part that connects to the drain pump, a first flow path, a folded part, and a second flow path. The first flow path extends upward from the connecting part. The folded part has a first end connected to an upper end of the first flow path and a second end on a side opposite to the first end. The folded part changes a direction of the water flowing therein from upward to downward. The second flow path extends from the second end. The second flow path is a pipe that has an inner diameter of 13 mm or less. The flow path area of the folded part is larger than the flow path area of the second flow path.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: February 21, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Keita Kitagawa, Hiromune Matsuoka, Akihiro Eguchi, Yoshito Matsuda, Tarou Yasumatsu, Takayoshi Yamamoto, Tsunehisa Sanagi, Seisuke Itou
  • Publication number: 20220325923
    Abstract: A refrigerant cycle system includes: a first refrigerant circuit that includes a first heat exchanger, a first compressor, and a first cascade heat exchanger and that is configured as a first vapor compression refrigeration cycle; a second refrigerant circuit that includes the first cascade heat exchanger, a second compressor, and a second heat exchanger and that is configured as a second vapor compression refrigeration cycle; a first unit that accommodates the first heat exchanger and the first compressor; a second unit that accommodates the first cascade heat exchanger and the second compressor; and a third unit that accommodates the second heat exchanger. The first unit, the second unit, and the third unit are disposed apart from each other. The first cascade heat exchanger performs heat exchange between a first refrigerant that flows through the first refrigerant circuit and a second refrigerant that flows through the second refrigerant circuit.
    Type: Application
    Filed: June 11, 2020
    Publication date: October 13, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Takuro Yamada, Atsushi Yoshimi, Eiji Kumakura, Ikuhiro Iwata, Kazuhiro Furusho, Mikio Kagawa, Michio Moriwaki, Tomoatsu Minamida, Hiromune Matsuoka, Junya Minami
  • Publication number: 20220221204
    Abstract: In a refrigeration cycle apparatus, a switching mechanism includes a first channel and performs switching among a first, second and third connection states. In the first connection state, the refrigeration cycle apparatus repeatedly performs a first cycle in which refrigerant flows through a compressor, a first heat exchanger, a second heat exchanger, and the compressor in that order. In the second connection state, the refrigeration cycle apparatus repeatedly performs a second cycle in which refrigerant flows through the compressor, the second heat exchanger, the first heat exchanger, and the compressor in that order. In the third connection state, a passage between the compressor and the first heat exchanger and a passage between the compressor and the second heat exchanger are closed, and the first channel in the refrigeration cycle apparatus provides interconnection between the first heat exchanger and the second heat exchanger.
    Type: Application
    Filed: March 29, 2022
    Publication date: July 14, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Takeru MIYAZAKI, Hiromune MATSUOKA, Atsushi YOSHIMI, Eiji KUMAKURA, Ikuhiro IWATA, Tomoatsu MINAMIDA, Takuro YAMADA
  • Publication number: 20220221189
    Abstract: A drainage mechanism is connected to a drain pump that sucks water from a drain pan. The drainage mechanism includes a connecting part that connects to the drain pump, a first flow path, a folded part, and a second flow path. The first flow path extends upward from the connecting part. The folded part has a first end connected to an upper end of the first flow path and a second end on a side opposite to the first end. The folded part changes a direction of the water flowing therein from upward to downward. The second flow path extends from the second end. The second flow path is a pipe that has an inner diameter of 13 mm or less. The flow path area of the folded part is larger than the flow path area of the second flow path.
    Type: Application
    Filed: March 30, 2022
    Publication date: July 14, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Keita Kitagawa, Hiromune Matsuoka, Akihiro Eguchi, Yoshito Matsuda, Tarou Yasumatsu, Takayoshi Yamamoto, Tsunehisa Sanagi, Seisuke Itou
  • Publication number: 20220221205
    Abstract: A refrigeration cycle device includes a heat source, a first use unit, a second use unit, a first connection flow path, and a second connection flow path. The heat source has a compressor and a heat-source side heat exchanger. The first use unit is separated from the heat source unit and has a first use-side heat exchanger. The second use unit is separated from the heat source unit and has a second use-side heat exchanger. The first connection flow path connects the heat source unit to the first and the second use units and causes a first refrigerant to flow. The second connection flow path connects the heat source unit to the first and the second use units and causes a second refrigerant to flow. A specific enthalpy of the second refrigerant is smaller than a specific enthalpy of the first refrigerant.
    Type: Application
    Filed: March 30, 2022
    Publication date: July 14, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Takuro Yamada, Atsushi Yoshimi, Eiji Kumakura, Ikuhiro Iwata, Takeru Miyazaki, Hiromune Matsuoka
  • Publication number: 20220178591
    Abstract: A heat transport system includes: a refrigerant circuit that seals therein a fluid including HFC-32 and/or HFO refrigerant as a refrigerant and that includes a refrigerant booster that boosts the refrigerant, an outdoor air heat exchanger that exchanges heat between the refrigerant and outdoor air, a medium heat exchanger that exchanges heat between the refrigerant and a heat transfer medium, and a refrigerant flow path switch that switches between a refrigerant radiation state and a refrigerant evaporation state; and a medium circuit that seals carbon dioxide therein as the heat transfer medium.
    Type: Application
    Filed: February 22, 2022
    Publication date: June 9, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiromune Matsuoka, Ryuusuke Fujiyoshi, Kyou Tomikawa, Yoshihiko Hagiwara
  • Patent number: 11293670
    Abstract: A heat transport system includes: a refrigerant circuit that seals therein a fluid including HFC-32 and/or HFO refrigerant as a refrigerant and that includes: a refrigerant booster that boosts the refrigerant; an outdoor air heat exchanger that exchanges heat between the refrigerant and outdoor air; a medium heat exchanger that exchanges heat between the refrigerant and a heat transfer medium; and a refrigerant flow path switch that switches between a refrigerant radiation state and a refrigerant evaporation state; and a medium circuit that seals carbon dioxide therein as the heat transfer medium.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: April 5, 2022
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiromune Matsuoka, Ryuusuke Fujiyoshi, Kyou Tomikawa, Yoshihiko Hagiwara
  • Publication number: 20220003461
    Abstract: In order to increase the evaporation capacity of a use-side heat exchanger regardless of operating conditions, a suction injection pipe and a subcooling heat exchanger are provided at a main refrigerant circuit in which a main refrigerant circulates. Further, a sub-refrigerant circuit that differs from the main refrigerant circuit and in which a sub-refrigerant circulates is provided. A controller performs control for switching between a cooling action of the subcooling heat-exchanger that cools the main refrigerant that is sent to a main use-side heat exchanger by using the suction injection pipe and the subcooling heat exchanger, and a cooling action of the sub-refrigerant-circuit that cools the main refrigerant that is sent to the main use-side heat exchanger by using the sub-refrigerant circuit 80.
    Type: Application
    Filed: September 27, 2019
    Publication date: January 6, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Ikuhiro IWATA, Eiji KUMAKURA, Kazuhiro FURUSHO, Ryusuke FUJIYOSHI, Hiromune MATSUOKA
  • Publication number: 20210372671
    Abstract: A refrigeration cycle device that includes a main refrigerant circuit and a sub-refrigerant circuit cools or heats a main refrigerant that flows between a main heat-source-side heat exchanger and a main usage-side heat exchanger by causing a sub-usage-side heat exchanger to function as an evaporator or a radiator of a sub-refrigerant. A first main expansion mechanism and a second main expansion mechanism that decompress the main refrigerant are provided on an upstream side and a downstream side of the sub-usage-side heat exchanger of the main refrigerant circuit.
    Type: Application
    Filed: September 30, 2019
    Publication date: December 2, 2021
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Ikuhiro IWATA, Eiji KUMAKURA, Kazuhiro FURUSHO, Ryusuke FUJIYOSHI, Hiromune MATSUOKA
  • Publication number: 20210356177
    Abstract: At a refrigeration cycle device, an injection pipe and an economizer heat exchanger are provided at a main refrigerant circuit. In addition, the refrigeration cycle device includes a sub-refrigerant circuit having a sub-usage-side heat exchanger. At the refrigeration cycle device, the sub-usage-side heat exchanger functions as an evaporator of a sub-refrigerant and cools a main refrigerant that has been cooled at the economizer heat exchanger, or functions as a radiator of the sub-refrigerant and heats the main refrigerant that has been cooled at the economizer heat exchanger.
    Type: Application
    Filed: September 30, 2019
    Publication date: November 18, 2021
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Eiji KUMAKURA, Ikuhiro IWATA, Kazuhiro FURUSHO, Ryusuke FUJIYOSHI, Hiromune MATSUOKA
  • Publication number: 20210333021
    Abstract: A heat transport system includes: a refrigerant circuit that seals therein a fluid including HFC-32 and/or HFO refrigerant as a refrigerant and that includes: a refrigerant booster that boosts the refrigerant; an outdoor air heat exchanger that exchanges heat between the refrigerant and outdoor air; a medium heat exchanger that exchanges heat between the refrigerant and a heat transfer medium; and a refrigerant flow path switch that switches between a refrigerant radiation state and a refrigerant evaporation state; and a medium circuit that seals carbon dioxide therein as the heat transfer medium.
    Type: Application
    Filed: June 19, 2018
    Publication date: October 28, 2021
    Applicants: DAIKIN INDUSTRIES, LTD., Daikin Applied Americas Inc.
    Inventors: Hiromune Matsuoka, Ryuusuke Fujiyoshi, Kyou Tomikawa, Yoshihiko Hagiwara
  • Publication number: 20210215398
    Abstract: Even if, in decompressing a refrigerant by an expansion mechanism, the temperature of the refrigerant cannot be sufficiently reduced, in order to increase the evaporation capacity of a use-side heat exchanger, a main expansion mechanism including an expansion element of a rotary or scroll type that causes power to be produced by decompressing a main refrigerant is provided at a main refrigerant circuit in which the main refrigerant circulates. Further, a sub-refrigerant circuit that differs from the main refrigerant circuit and in which a sub-refrigerant circulates is provided. A sub-use-side heat exchanger that is provided at the sub-refrigerant circuit and that functions as an evaporator of the sub-refrigerant is caused to function as a heat exchanger that cools the main refrigerant that flows between the main expansion mechanism and a main use-side heat exchanger.
    Type: Application
    Filed: March 31, 2021
    Publication date: July 15, 2021
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Ikuhiro IWATA, Eiji KUMAKURA, Kazuhiro FURUSHO, Ryusuke FUJIYOSHI, Hiromune MATSUOKA
  • Patent number: 10247448
    Abstract: A method of producing refrigeration includes compressing a refrigerant composition including R1233zd in a compressor having a magnetic bearing, within a chiller system.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: April 2, 2019
    Assignee: DAIKIN APPLIED AMERICAS INC.
    Inventors: Kenichi Masaki, Md Anwar Hossain, Hiromune Matsuoka
  • Patent number: 9869498
    Abstract: A refrigerant charging method includes installing, cooling, confirming, and moving steps. In the installing step, a refrigeration device is installed on site. In the cooling step, a container is cooled to 31° C. or below using a cooling medium. In the confirming step, it is confirmed that the container has reached 31° C. or below. In the moving step, the refrigerant is moved to the intended charging space from the container upon confirming that the container has reached 31° C. or below via the cooling step. When moving the refrigerant from the container to the intended charging space, first, refrigerant that is in a gas phase within the container is moved into the intended charging space, whereupon refrigerant that is in a liquid phase within the container is moved into the intended charging space.
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: January 16, 2018
    Assignee: Daikin Industries, Ltd.
    Inventors: Hiromune Matsuoka, Toshiyuki Kurihara
  • Publication number: 20160377326
    Abstract: A method of producing refrigeration includes compressing a refrigerant composition including R1233zd in a compressor having a magnetic bearing, within a chiller system.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Kenichi MASAKI, Md Anwar Hossain, Hiromune MATSUOKA
  • Patent number: 8844300
    Abstract: A method is disclosed that makes it possible to reduce the amount of refrigerant used and shorten the amount of time over which the new air conditioner must be run in a refrigerant pipe washing mode when an air conditioner that used a mineral-oil-based refrigerant oil is updated to or replaced with an air conditioner using an HFC refrigerant as the working refrigerant and the existing refrigerant piping is reused as is. Thus, the existing refrigerant piping of the air conditioner that used a mineral-oil-based refrigerant oil is reused in the air conditioner that uses an HFC refrigerant as the working refrigerant, the by washing the refrigerant piping using a cleaning agent comprising an HFC refrigerant containing at least 40 wt % of R32 to remove residual refrigerant oil in the refrigerant piping.
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: September 30, 2014
    Assignee: Daikin Industries, Ltd.
    Inventors: Kazuhide Mizutani, Hiromune Matsuoka, Atsushi Yoshimi, Manabu Yoshimi