Abstract: The present invention relates to a resin composition containing a transparent resin and a light absorber, wherein a cured product of the resin composition has an absorption maximum wavelength in a wavelength range of 550 to 720 nm.

Abstract: A ceramic plate having a flat plate shape includes a cut-out portion that is cut out inwardly from a peripheral end surface. An end surface defining the cut-put portion inclines in a thickness direction of the ceramic plate.

Abstract: Described herein are devices, compositions, and methods for improving color discernment.

Abstract: The phosphor ceramic has pores with a pore diameter of 3.0 ?m or more and 12.0 ?m or less. In the phosphor ceramic, a pore volume percentage of pores with a pore diameter of 3.0 ?m or more and 12.0 ?m or less is 1.5% by volume or more and 9.5% by volume or less.

Abstract: The method for producing a phosphor plate includes, in sequence, a step (1), in which a phosphor sheet is prepared, a step (2), in which through holes and penetration faces fronting the through holes are formed in the phosphor sheet, and a step (3), in which the phosphor sheet is cut to form a plurality of phosphor plates including the penetration faces.

Abstract: Some phosphor powders can be difficult to form into ceramic compacts because they are difficult to sinter. As described herein, phosphor powders that can degrade under conventional sintering temperatures can be sintered by heating the powder at a lower temperature, such as less than 800° C., while the powder is under greater than atmospheric pressure, such as at least 0.05 GPa. Phosphor ceramic compacts prepared by this method, and light-emitting devices incorporating these phosphor ceramic compacts, are also described.

Abstract: The phosphor ceramic has pores with a pore diameter of 3.0 ?m or more and 12.0 ?m or less. In the phosphor ceramic, a pore volume percentage of pores with a pore diameter of 3.0 ?m or more and 12.0 ?m or less is 1.5% by volume or more and 9.5% by volume or less.

Abstract: The present invention relates to a semiconductor light emitting device including: a substrate for element mounting; a wiring provided on the substrate; an LED element provided on the substrate and electrically connected to the wiring; an encapsulating resin layer for encapsulating the LED element; and a wavelength conversion layer which contains a phosphor material and converts a wavelength of light emitted by the LED element, in which the wavelength conversion layer is provided on an upper side of the LED element, and a diffusive reflection resin layer is provided in a state that side faces of the LED element are surrounded therewith, and an area at the LED element face side of the wavelength conversion layer is at least twice larger by area ratio than an area of light emitting area on an upper surface of the LED element.

Abstract: A method for producing a wavelength conversion member includes preparing an element-disposed substrate including a substrate, a plurality of phosphor ceramic elements disposed on the substrate in spaced-apart relation in a direction perpendicular to the thickness direction of the substrate; embedding the plurality of phosphor ceramic elements in a curable layer containing the inorganic substance; producing a cover layer by curing the curable layer; and cutting the cover layer and the substrate in the thickness direction so as to include at least one of the phosphor ceramic elements.

Abstract: A wavelength conversion bonding member includes a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element, wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, and the bonding layer has a reflectivity of 90% or more.

Abstract: A method for producing a wavelength conversion member includes disposing a phosphor ceramic layer on a substrate; removing a portion of the phosphor ceramic layer so that a plurality of phosphor ceramic elements are disposed in a direction perpendicular to the thickness direction of the substrate in spaced-apart relation; forming a cover layer containing an inorganic substance on the substrate so as to cover the surface of the phosphor ceramic element; and cutting the cover layer and the substrate in the thickness direction so as to include at least one of the phosphor ceramic elements.

Abstract: A method and apparatus for sintering flat ceramics using a mesh or lattice is described herein.

Abstract: A circuit board includes a phosphor-containing board for mounting an optical semiconductor element at one side thereof in a thickness direction and an electrode wire laminated at the one side in the thickness direction of the phosphor-containing board so as to be electrically connected to the optical semiconductor element.

Abstract: A method and apparatus for sintering flat ceramics using a mesh or lattice is described herein.

Abstract: A method and apparatus for sintering flat ceramics using a mesh or lattice is described herein.

Abstract: Some embodiments disclosed herein include a lighting apparatus having a composite. The composite may include a first emissive layer and a second emissive layer. The first emissive layer may include a first garnet phosphor having a common dopant. The second emissive layer may include a second garnet phosphor having the common dopant. In some embodiments, the first emissive layer and the second emissive layer are fixed together. Some embodiments disclosed herein include efficient and economic methods of making the composite. The method may include, in some embodiments, sintering an assembly that includes pre-cursor materials for the first emissive layer and the second emissive layer.

Abstract: Disclosed herein are emissive ceramic materials having a dopant concentration gradient along a thickness of a yttrium aluminum garnet (YAG) region. The dopant concentration gradient may include a maximum dopant concentration, a half-maximum dopant concentration, and a slope at or near the half-maximum dopant concentration. The emissive ceramics may, in some embodiments, exhibit high internal quantum efficiencies (IQE). The emissive ceramics may, in some embodiments, include porous regions. Also disclosed herein are methods of make the emissive ceramic by sintering an assembly having doped and non-doped layers.

Abstract: A phosphor layer attaching kit includes a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package. A percentage of the peel strength of the silicone pressure-sensitive adhesion composition is 30% or more.

Abstract: Electric sintering of precursor materials to prepare phosphor ceramics is described herein. The phosphor ceramics prepared by electric sintering may be incorporated into devices such as light-emitting devices, lasers, or for other purposes.

Abstract: Some phosphor powders can be difficult to form into ceramic compacts because they are difficult to sinter. As described herein, phosphor powders that can degrade under conventional sintering temperatures can be sintered by heating the powder at a lower temperature, such as less than 800° C., while the powder is under greater than atmospheric pressure, such as at least 0.05 GPa. Phosphor ceramic compacts prepared by this method, and light-emitting devices incorporating these phosphor ceramic compacts, are also described.