Patents by Inventor Hironao Fujiki
Hironao Fujiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10483011Abstract: A transparent conductive film with fewer problems originating from amine compounds is provided using a conductive composition stably and pseudo-solubly dispersed in a solvent consisting mainly of an organic solvent. This invention relates to: a conductive composition which is pseudo-solubly dispersed in a solvent consisting mainly of an organic solvent and which contains (a) a ?-conjugated conductive polymer, (b) polyanions doping the ?-conjugated conductive polymer (a), and (c) a reaction product of those anions of the polyanions (b) that were not needed for doping, and an oxirane group- and/or oxetane group-containing organic compound; a production method of said conductive composition; an anti-static resin composition formed by mixing said conductive composition and a resin solution dissolved in an organic solvent; and antistatic resin film formed by curing said antistatic resin composition.Type: GrantFiled: August 11, 2015Date of Patent: November 19, 2019Assignee: SHIN-ETSU POLYMER CO., LTD.Inventors: Hironao Fujiki, Takanori Suzuki
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Publication number: 20150348671Abstract: A transparent conductive film with fewer problems originating from amine compounds is provided using a conductive composition stably and pseudo-solubly dispersed in a solvent consisting mainly of an organic solvent. This invention relates to: a conductive composition which is pseudo-solubly dispersed in a solvent consisting mainly of an organic solvent and which contains (a) a ?-conjugated conductive polymer, (b) polyanions doping the ?-conjugated conductive polymer (a), and (c) a reaction product of those anions of the polyanions (b) that were not needed for doping, and an oxirane group- and/or oxetane group-containing organic compound; a production method of said conductive composition; an anti-static resin composition formed by mixing said conductive composition and a resin solution dissolved in an organic solvent; and antistatic resin film formed by curing said antistatic resin composition.Type: ApplicationFiled: August 11, 2015Publication date: December 3, 2015Inventors: Hironao FUJIKI, Takanori SUZUKI
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Publication number: 20150348670Abstract: A curable antistatic organopolysiloxane composition capable of alleviating problems originating from amine compounds and problems originating from water and an antistatic silicone film formed by curing said composition is provided. The curable antistatic organopolysiloxane composition includes: (I) a conductive polymer composition which is pseudo-solubly dispersed in a solvent consisting mainly of an organic solvent and which includes (a) a ?-conjugated conductive polymer, (b) polyanions doping the ?-conjugated conductive polymer (a), and (c) a reaction product of those anions of the polyanions (b) that were not needed for doping, and an oxirane group and/or oxetane group-containing organic compound; and (II) a curable organopolysiloxane composition including an antistatic silicone film which is formed by supplying said composition onto a substrate and curing the same.Type: ApplicationFiled: August 11, 2015Publication date: December 3, 2015Inventors: Hironao FUJIKI, Sou MATSUBAYASHI, Kohei KANTO, Takanori SUZUKI
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Publication number: 20130177701Abstract: A capacitor manufacturing method that enables a capacitor having a high withstand voltage, a high electrostatic capacitance and a satisfactorily small ESR to be manufactured simply and at a high level of productivity. In the capacitor manufacturing method, a film-formation treatment of applying a conductive polymer solution containing a ?-conjugated conductive polymer, a polyanion and a solvent to the dielectric layer side of a capacitor substrate having a dielectric layer formed on the surface of an anode, and then performing drying to form a conductive polymer film, is performed at least twice, and the conductive polymer solution used in at least one film-formation treatment among the second film-formation treatment and subsequent film-formation treatments is a high viscosity solution having a higher viscosity than the conductive polymer solution used in the first film-formation treatment.Type: ApplicationFiled: February 21, 2013Publication date: July 11, 2013Inventors: Tailu NING, Hironao FUJIKI, Kazuyoshi YOSHIDA, Michiko SHINGAI
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Patent number: 8339770Abstract: A capacitor having a high degree of electric strength, a high electrostatic capacity, and a low ESR, which can be readily downsized, is provided. The capacitor according to the present invention includes an anode made of porous valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer. The solid electrolyte layer includes a ? conjugated conductive polymer, a polyanion, and an ion-conductive compound.Type: GrantFiled: February 21, 2007Date of Patent: December 25, 2012Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Kazuyoshi Yoshida, Tailu Ning, Hironao Fujiki, Mitsuaki Negishi
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Publication number: 20110171366Abstract: A capacitor manufacturing method that enables a capacitor having a high withstand voltage, a high electrostatic capacitance and a satisfactorily small ESR to be manufactured simply and at a high level of productivity. In the capacitor manufacturing method, a film-formation treatment of applying a conductive polymer solution containing a ?-conjugated conductive polymer, a polyanion and a solvent to the dielectric layer side of a capacitor substrate having a dielectric layer formed on the surface of an anode, and then performing drying to form a conductive polymer film, is performed at least twice, and the conductive polymer solution used in at least one film-formation treatment among the second film-formation treatment and subsequent film-formation treatments is a high-viscosity solution having a higher viscosity than the conductive polymer solution used in the first film-formation treatment.Type: ApplicationFiled: October 2, 2009Publication date: July 14, 2011Inventors: Tailu Ning, Hironao Fujiki, Kazuyoshi Yoshida, Michiko Shingai
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Patent number: 7887911Abstract: An electromagnetic noise suppressor of the present invention includes a base material containing a binding agent and a composite layer formed by integrating the binding agent that is a part of the base material and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer on the surface of the base material by physical vapor deposition of the magnetic material onto the surface of the base material. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.Type: GrantFiled: August 31, 2009Date of Patent: February 15, 2011Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Toshiyuki Kawaguchi, Hironao Fujiki, Atsushi Taniguchi, Takashi Gonda, Kazutoki Tahara
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Publication number: 20100182734Abstract: A capacitor including an anode composed of a valve metal and having unevenness formed in the surface thereof, a dielectric layer formed by oxidizing the surface of the anode, and a cathode formed on the surface of the dielectric layer and having a solid electrolyte layer containing a ?-conjugated conductive polymer and a polyanion, wherein a portion of, or all of, the cathode-side surface of the dielectric layer is treated with a salt.Type: ApplicationFiled: June 19, 2008Publication date: July 22, 2010Inventors: Tailu Ning, Hironao Fujiki, Kazuyoshi Yoshida
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Publication number: 20100165546Abstract: A capacitor having a high degree of electric strength, a high electrostatic capacity, and a low ESR, which can be readily downsized, is provided. The capacitor according to the present invention includes an anode made of porous valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer. The solid electrolyte layer includes a ? conjugated conductive polymer, a polyanion, and an ion-conductive compound.Type: ApplicationFiled: February 21, 2007Publication date: July 1, 2010Applicant: SHIN-ETSU POLYMER CO., LTD.Inventors: Kazuyoshi Yoshida, Tailu Ning, Hironao Fujiki, Mitsuaki Negishi
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Publication number: 20090314539Abstract: An electromagnetic noise suppressor of the present invention includes a base material containing a binding agent and a composite layer formed by integrating the binding agent that is a part of the base material and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer on the surface of the base material by physical vapor deposition of the magnetic material onto the surface of the base material. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.Type: ApplicationFiled: August 31, 2009Publication date: December 24, 2009Inventors: Toshiyuki Kawaguchi, Hironao Fujiki, Atsushi Taniguchi, Takashi Gonda, Kazutoki Tahara
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Publication number: 20090314411Abstract: An electromagnetic noise suppressor of the present invention includes a base material containing a binding agent and a composite layer formed by integrating the binding agent that is a part of the base material and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer on the surface of the base material by physical vapor deposition of the magnetic material onto the surface of the base material. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.Type: ApplicationFiled: August 31, 2009Publication date: December 24, 2009Inventors: Toshiyuki Kawaguchi, Hironao Fujiki, Atsushi Taniguchi, Takashi Gonda, Kazutoki Tahara
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Patent number: 7625633Abstract: An electromagnetic noise suppressor of the present invention includes a base material 2 containing a binding agent and a composite layer 3 formed by integrating the binding agent that is a part of the base material 2 and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer 3 on the surface of the base material 2 by physical vapor deposition of the magnetic material onto the surface of the base material 2. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.Type: GrantFiled: March 23, 2004Date of Patent: December 1, 2009Assignee: Shin-Etsu Polymer., Ltd.Inventors: Toshiyuki Kawaguchi, Hironao Fujiki, Atsushi Taniguchi, Takashi Gonda, Kazutoki Tahara
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Patent number: 7484556Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.Type: GrantFiled: September 27, 2006Date of Patent: February 3, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiko Mita, Kazuhiko Tomaru, Yoshitaka Aoki, Hironao Fujiki
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Patent number: 7417078Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.Type: GrantFiled: March 20, 2002Date of Patent: August 26, 2008Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hironao Fujiki, Kazuhiko Tomaru, Ikuo Sakurai, Akio Suzuki, Kunihiko Mita
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Publication number: 20070023179Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.Type: ApplicationFiled: September 27, 2006Publication date: February 1, 2007Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiko Mita, Kazuhiko Tomaru, Yoshitaka Aoki, Hironao Fujiki
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Patent number: 7125236Abstract: Replicas are molded by curing a photo-curable liquid silicone rubber composition to form a transparent mother mold having a cavity corresponding to the outer contour of a master model, casting a photo-curable liquid resin into the mold cavity, and irradiating light to the liquid resin through the mold wall. Replicas can be fabricated by simple steps and within a short time.Type: GrantFiled: December 19, 2001Date of Patent: October 24, 2006Assignee: Shin - Etsu Chemical Co. Ltd.Inventors: Yasuhiko Matsuoka, Tarou Kita, Hironao Fujiki, Takafumi Sakamoto, Shohei Nakamura, Kousi Anai
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Publication number: 20060083948Abstract: An electromagnetic noise suppressor of the present invention includes a base material 2 containing a binding agent and a composite layer 3 formed by integrating the binding agent that is a part of the base material 2 and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer 3 on the surface of the base material 2 by physical vapor deposition of the magnetic material onto the surface of the base material 2. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.Type: ApplicationFiled: March 23, 2004Publication date: April 20, 2006Inventors: Toshiyuki Kawaguchi, Hironao Fujiki, Atsushi Taniguchi, Takashi Gonda, Kazutoki Tahara
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Patent number: 6875534Abstract: A rubber composition comprising (A) a polyisobutylene polymer having an allyl radical at an end, (B) an optional organpolysiloxane, (C) an organohydrogenpolysiloxane having at least two SiH radicals per molecule, and (D) a platinum group metal catalyst forms a seal member on a periphery of one side of a polymer electrolyte fuel-cell separator. Due to improved acid resistance, weather resistance, creep resistance and gas permeability, the seal member remains effective for a long period of time.Type: GrantFiled: June 20, 2002Date of Patent: April 5, 2005Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tsutomu Nakamura, Noriyuki Meguriya, Hironao Fujiki
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Patent number: 6869683Abstract: An electromagnetic wave (EM) absorber is constructed by integrally laminating an EM-absorbing layer having an EM-absorbing filler dispersed in a silicone resin on at least one surface of an EM-reflecting layer having an electrically conductive filler dispersed in a silicone resin. It has satisfactory EM-absorbing and shielding abilities and is workable, flexible, weather resistant and heat resistant due to the nature of the silicone resin itself. The use of the silicone resin in both the EM-absorbing and reflecting layers ensures that a firm bond is established between the layers. In a preferred embodiment wherein a heat conductive filler is blended, the absorber has a satisfactory heat transfer ability as well.Type: GrantFiled: May 1, 2002Date of Patent: March 22, 2005Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Ikuo Sakurai, Hironao Fujiki
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Patent number: RE40519Abstract: A conductive fluoro-resin composition of the addition reaction curing type is provided comprising (A) a reactive fluorinated polyether compound comprising fluorinated polyether units and having at least two aliphatic unsaturated hydrocarbon radicals in a molecule, (B) a compound having at least two hydrogen atoms each directly attached to a silicon atom, (C) a platinum group metal catalyst, and (D) silver particles. The composition cures into rubbery parts having improved heat resistance, weather resistance and solvent resistance and optionally forming firm bonds to various substrates.Type: GrantFiled: September 19, 2002Date of Patent: September 23, 2008Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hironao Fujiki, Hiroyasu Hara, Kenichi Fukuda