Patents by Inventor Hironari Aratani
Hironari Aratani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7196426Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: GrantFiled: November 24, 2004Date of Patent: March 27, 2007Assignee: Shinko Electric Industries Co., Ltd.Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Patent number: 7164198Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: GrantFiled: August 28, 2003Date of Patent: January 16, 2007Assignee: Shinko Electric Industres, Co., Ltd.Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Patent number: 6988312Abstract: The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the cType: GrantFiled: October 29, 2002Date of Patent: January 24, 2006Assignee: Shinko Electric Industries Co., Ltd.Inventors: Jyunichi Nakamura, Shunichiro Matsumoto, Tadashi Kodaira, Hironari Aratani, Takanori Tabuchi, Takeshi Chino, Kiyotaka Shimada
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Publication number: 20050087860Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: ApplicationFiled: November 24, 2004Publication date: April 28, 2005Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Patent number: 6759739Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: GrantFiled: October 28, 2002Date of Patent: July 6, 2004Assignee: Shinko Electric Industries Co., Ltd.Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Publication number: 20040074088Abstract: The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the cType: ApplicationFiled: November 14, 2003Publication date: April 22, 2004Inventors: Jyunichi Nakamura, Shunichiro Matsumoto, Tadashi Kodaira, Hironari Aratani, Takanori Tabuchi, Takeshi Chino, Kiyotaka Shimada
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Publication number: 20040046244Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: ApplicationFiled: August 28, 2003Publication date: March 11, 2004Applicant: Shinko Electric Industries Co., Ltd.Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Publication number: 20030080409Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: ApplicationFiled: October 28, 2002Publication date: May 1, 2003Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino