Abstract: The object of the present invention is to provide a method of manufacturing vinegar with high extract content that keeps the original flavor of raw materials and has favorable flavor for vinegar under the circumstance of high extract content. The present invention provides a method of manufacturing vinegar by submerged fermentation, characterized by including: performing acetate fermentation using a fermentation solution which has an extract content of 0.1 w/v % or more and less than 6.0 w/v % and continues the acetate fermentation at a generation rate of acetic acid of 0.5 g/L·hr or more; raising the extract content to reach 6.0 w/v % or more and 55.0 w/v % or less at the time of completion of fermentation; and suppressing an induction period so that the induction period does not appear or is 10 hours or less, whereby obtaining vinegar with extract content of 6.0 w/v % or more and 55.0 w/v % or less.

Abstract: An in-circuit emulator comprising CPUs (microprocessors) of different types, portions of constituent elements thereof being different from each other, a control circuit connected to the CPUs and an external actual apparatus for controlling the operation of the in-circuit emulator, and an identifier circuit connected to the CPUs and the control circuit for identifying differences among the CPUs based upon feature signals from the CPUs inputted thereinto, the in-circuit emulator switching the control circuit to an operation mode suited to the CPU by making use of an output from the CPU identifier circuit.

Abstract: A probe for an in-circuit emulator comprising a flexible substrate composed of a base film, a pattern provided on a central portion of the base film, plastic parts mounted on both ends of the base film, a connecting element detachably provided at one end of the flexible substrate, and reinforcing members mounted on the plastic parts.

Abstract: A probe for an in-circuit emulator comprises flexible substrates, pins provided at one end of the substrates for connecting the flexible substrates with an LSI package, a base mounted on the flexible substrates and having a penetration hole for holding the pins, and a presser plate mounted on the flexible substrates and having a hole, characterized in that the base and presser plate sandwich the flexible substrates and pins for connecting the flexible substrates with the pins.