Patents by Inventor Hironobu Fujimoto
Hironobu Fujimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11884596Abstract: The present invention aims to provide a method for producing granules for ceramic production, the method having high productivity and making it possible to obtain a ceramic which, when produced by press molding the granules and firing the resulting press molded product, has physical properties kept from lowering. The present invention is characterized by including: a slurry preparation step of preparing a slurry including a mixture containing a powder of an inorganic compound, a binder, and a solvent; a granulation step of introducing the slurry into a spray drying device to form a granulated substance containing the inorganic compound; an exhaust step of exhausting an atmospheric gas within the spray drying device via a cyclone having a surface made of ceramic; and a step of mixing a fine powder, which has been recovered by the cyclone during the exhaust step, with the granulated substance obtained in the granulation step.Type: GrantFiled: June 24, 2019Date of Patent: January 30, 2024Assignee: TOKUYAMA CORPORATIONInventors: Hironobu Fujimoto, Tsuyoshi Ikeda
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Publication number: 20210221745Abstract: The present invention aims to provide a method for producing granules for ceramic production, the method having high productivity and making it possible to obtain a ceramic which, when produced by press molding the granules and firing the resulting press molded product, has physical properties kept from lowering. The present invention is characterized by including: a slurry preparation step of preparing a slurry including a mixture containing a powder of an inorganic compound, a binder, and a solvent; a granulation step of introducing the slurry into a spray drying device to form a granulated substance containing the inorganic compound; an exhaust step of exhausting an atmospheric gas within the spray drying device via a cyclone having a surface made of ceramic; and a step of mixing a fine powder, which has been recovered by the cyclone during the exhaust step, with the granulated substance obtained in the granulation step.Type: ApplicationFiled: June 24, 2019Publication date: July 22, 2021Applicant: TOKUYAMA CORPORATIONInventors: Hironobu FUJIMOTO, Tsuyoshi IKEDA
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Patent number: 9534151Abstract: A sheet is produced by curing an energy ray curable composition which includes a urethane acrylate oligomer and a compound having a thiol group in the molecule. The sheet has heat resistance to prevent outgassing.Type: GrantFiled: September 20, 2010Date of Patent: January 3, 2017Assignees: LINTEC Corporation, Arakawa Chemical Industries, LTDInventors: Hironobu Fujimoto, Tsutomu Iida, Tomohide Fukuzaki
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Publication number: 20150303093Abstract: An adhesive sheet includes a substrate film and an adhesive layer which is provided on the substrate film, wherein the substrate film is composed of an energy ray curable composition being formed into a film and cured, the composition including an energy ray curable resin and an ion liquid having ethylenically unsaturated bonds.Type: ApplicationFiled: November 1, 2013Publication date: October 22, 2015Inventor: Hironobu Fujimoto
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Patent number: 9102833Abstract: Provided is a curable resin composition comprising a thermoplastic resin (A) that includes a cyclic structure in its main chain, and has a glass transition temperature (Tg) of 140° C. or more, and a monofunctional curable monomer (B). The present invention provides: a cured resin formed article that has heat resistance and low birefringence, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.Type: GrantFiled: December 11, 2012Date of Patent: August 11, 2015Assignee: LINTEC CORPORATIONInventors: Masaharu Ito, Wataru Iwaya, Hironobu Fujimoto, Naoki Taya
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Patent number: 9023913Abstract: The present invention is: a curable resin composition comprising a thermoplastic resin (A), a curable monomer (B), and a photoinitiator (C), the thermoplastic resin (A) including an aromatic ring in its molecule, and having a glass transition temperature (Tg) of 140° C. or more, and the photoinitiator (C) having an absorbance at 380 nm of 0.4 or more when measured in a 0.1 mass % acetonitrile solution; a curable resin formed article obtained by forming the curable resin composition; a cured resin formed article obtained by curing the curable resin formed article; a laminate comprising at least one layer that is formed of a cured resin obtained by curing the curable resin composition. The present invention provides: a cured resin formed article that exhibits excellent heat resistance, includes only a small amount of residual low-boiling-point substance (e.g.Type: GrantFiled: December 11, 2012Date of Patent: May 5, 2015Assignee: Lintec CorporationInventors: Masaharu Ito, Wataru Iwaya, Hironobu Fujimoto, Naoki Taya
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Publication number: 20150111032Abstract: A film is obtained by forming a film of and curing an energy ray-curable composition comprising a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S.Type: ApplicationFiled: March 19, 2013Publication date: April 23, 2015Applicant: LINTEC CORPORATIONInventor: Hironobu Fujimoto
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Publication number: 20140364531Abstract: The present invention is: a curable resin composition comprising a thermoplastic resin (A), a curable monomer (B), and a photoinitiator (C), the thermoplastic resin (A) including an aromatic ring in its molecule, and having a glass transition temperature (Tg) of 140° C. or more, and the photoinitiator (C) having an absorbance at 380 nm of 0.4 or more when measured in a 0.1 mass % acetonitrile solution; a curable resin formed article obtained by forming the curable resin composition; a cured resin formed article obtained by curing the curable resin formed article; a laminate comprising at least one layer that is formed of a cured resin obtained by curing the curable resin composition. The present invention provides: a cured resin formed article that exhibits excellent heat resistance, includes only a small amount of residual low-boiling-point substance (e.g.Type: ApplicationFiled: December 11, 2012Publication date: December 11, 2014Inventors: Masaharu Ito, Wataru Iwaya, Hironobu Fujimoto, Naoki Taya
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Publication number: 20140350187Abstract: Provided is a curable resin composition comprising a thermoplastic resin (A) that includes a cyclic structure in its main chain, and has a glass transition temperature (Tg) of 140° C. or more, and a monofunctional curable monomer (B). The present invention provides: a cured resin formed article that has heat resistance and low birefringence, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.Type: ApplicationFiled: December 11, 2012Publication date: November 27, 2014Applicant: LINTEC CORPORATIONInventors: Masaharu Ito, Wataru Iwaya, Hironobu Fujimoto, Naoki Taya
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Publication number: 20140308494Abstract: The present invention provides: a gas barrier film comprising a cured resin layer and a gas barrier layer, the gas barrier layer being provided on at least one side of the cured resin layer, the cured resin layer being a layer formed of a cured product of a curable resin composition that includes (A) a thermoplastic resin having a glass transition temperature (Tg) of 140° C. or more, and (B) a curable monomer, the gas barrier film having a water vapor transmission rate of 1 g/m2/day or less at a temperature of 40° C. and a relative humidity of 90%; a method for producing the gas barrier film; a gas barrier film laminate comprising the gas barrier film; an electronic device member comprising the gas barrier film; an electronic device member comprising the gas barrier film laminate; an electronic device comprising the electronic device member.Type: ApplicationFiled: November 2, 2012Publication date: October 16, 2014Inventors: Wataru Iwaya, Hironobu Fujimoto, Naoki Taya, Masaharu Ito, Takeshi Kondo
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Patent number: 8212345Abstract: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.Type: GrantFiled: November 12, 2010Date of Patent: July 3, 2012Assignees: Shin-Etsu Polymer Co., Ltd., Lintec CorporationInventors: Kiyofumi Tanaka, Satoshi Odashima, Noriyoshi Hosono, Hironobu Fujimoto, Takeshi Segawa
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Patent number: 8182649Abstract: It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.Type: GrantFiled: October 12, 2007Date of Patent: May 22, 2012Assignee: Lintec CorporationInventors: Kenichi Watanabe, Takeshi Segawa, Hironobu Fujimoto
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Publication number: 20110281509Abstract: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.Type: ApplicationFiled: November 12, 2010Publication date: November 17, 2011Applicants: Lintec Corporation, Shin-Etsu Polymer Co., Ltd.Inventors: KIYOFUMI TANAKA, Satoshi Odashima, Noriyoshi Hosono, Hironobu Fujimoto, Takeshi Segawa
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Publication number: 20110070433Abstract: A sheet is produced by curing an energy ray curable composition which includes a urethane acrylate oligomer and a compound having a thiol group in the molecule. The sheet has heat resistance to prevent outgassing.Type: ApplicationFiled: September 20, 2010Publication date: March 24, 2011Applicants: LINTEC CORPORATION, ARAKAWA CHEMICAL INDUSTRIES, LTD.Inventors: Hironobu Fujimoto, Tsutomu Iida, Tomohide Fukuzaki
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Patent number: 7875501Abstract: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.Type: GrantFiled: March 9, 2007Date of Patent: January 25, 2011Assignees: Shin-Etsu Polymer Co., Ltd., Lintec CorporationInventors: Kiyofumi Tanaka, Satoshi Odashima, Noriyoshi Hosono, Hironobu Fujimoto, Takeshi Segawa
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Publication number: 20100314894Abstract: It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.Type: ApplicationFiled: October 12, 2007Publication date: December 16, 2010Applicant: LINTEC CORPORATIONInventors: Kenichi Watanabe, Takeshi Segawa, Hironobu Fujimoto
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Publication number: 20100289283Abstract: A method is provided for picking up a chip 13 from a fixing jig 3 to which the chip 13 is fixed. The fixing jig 3 consists of a jig base 30 having a plurality of protrusions 36 on one side and a sidewall 35 having a height almost equivalent to that of the protrusion 36 at the outer circumference of the one side, and an contact layer 31 that is laminated on the surface of the jig base 30 having the protrusions 36 and that is bonded on the upper surface of the sidewall 35. A section space 37 is formed on the surface of the jig base 30 having the protrusions by the contact layer 31, the protrusions 36 and the sidewall 35, and at least one through hole 38 penetrating the outside and the section space 37 is provided in the jig base 30.Type: ApplicationFiled: October 12, 2007Publication date: November 18, 2010Applicant: LINTEC CORPORATIONInventors: Kenichi Watanabe, Takeshi Segawa, Hironobu Fujimoto
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Publication number: 20090081852Abstract: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.Type: ApplicationFiled: March 9, 2007Publication date: March 26, 2009Applicants: SHIN-ETSU POLYMER CO., LTD., LINTEC CORPORATIONInventors: Kiyofumi Tanaka, Satoshi Odashima, Noriyoshi Hosono, Hironobu Fujimoto, Takeshi Segawa