Abstract: Substrates can be suppressed from being separated from supporting grooves. A substrate processing apparatus includes a substrate holding unit and a processing tub. The substrate holding unit is configured to hold multiple substrates. The processing tub is configured to store a processing liquid therein. The substrate holding unit comprises a supporting body, an elevating device and a restriction unit. The supporting body has multiple supporting grooves and is configured to support the multiple substrates with a vertically standing posture from below in the multiple supporting grooves, respectively. The elevating device is configured to move the supporting body between a standby position above the processing tub and a processing position within the processing tub. The restriction unit is configured to be moved up and down along with the supporting body by the elevating device and configured to restrict an upward movement of the substrates with respect to the supporting body.

Abstract: A semiconductor switch circuit comprises: a first switch pair including two MOSFETs having gates connected one another and sources connected to one another, and a zener diode reversely connected between the gates and sources of the MOSFETs; a second switch pair including two MOSFETs having gates connected one another and sources connected to one another, and a zener diode reversely connected between the gates and sources of the MOSFETs; and a third switch pair comprising two MOSFETs having gates connected to one another and sources connected to one another. The first switch pair and the second switch pair are connected in series between two input/output terminals through a connecting node. The third switch pair is connected to the connecting node between the first switch pair and the second switch pair.

Abstract: A semiconductor switch circuit comprises: a first switch pair including two MOSFETs having gates connected one another and sources connected to one another, and a zener diode reversely connected between the gates and sources of the MOSFETs; a second switch pair including two MOSFETs having gates connected one another and sources connected to one another, and a zener diode reversely connected between the gates and sources of the MOSFETs; and a third switch pair comprising two MOSFETs having gates connected to one another and sources connected to one another. The first switch pair and the second switch pair are connected in series between two input/output terminals through a connecting node. The third switch pair is connected to the connecting node between the first switch pair and the second switch pair.