Abstract: The present invention relates to a photosensitive resin composition excellent in pliability, ultraviolet sensitivity for development, developability with an aqueous alkali solution, and storage stability at room temperature and a circuit substrate employing the same. The photosensitive resin composition includes a siloxane-containing polyamic acid resin having structural units respectively represented by the following formulae (1), (2), and (3) and a photopolymerization initiator incorporated therein. The circuit substrate is coated with the photosensitive resin composition.

Abstract: The present invention relates to a photosensitive resin composition excellent in pliability, ultraviolet sensitivity for development, developability with an aqueous alkali solution, and storage stability at room temperature and a circuit substrate employing the same. The photosensitive resin composition includes a siloxane-containing polyamic acid resin having structural units respectively represented by the following formulae (1), (2), and (3) and a photopolymerization initiator incorporated therein. The circuit substrate is coated with the photosensitive resin composition.

Abstract: The present invention aims to provide a polyimide resin excellent in heat resistance, dimensional stability, and toughness as an insulating layer, and to obtain a laminate suitable for a flexible wiring board by using the polyimide resin, the laminate being excellent in resistance to rupture and flexibility even when the thickness of a polyimide resin layer is small. Provided is a laminate for a wiring board having a metal layer on at least one surface of a polyimide resin layer, in which a polyimide resin layer (A) obtained by imidating a polyimide precursor resin having a weight average molecular weight of 150,000 to 800,000 is a main polyimide resin layer, and a polyimide resin of which the main polyimide resin layer is constituted has structural units represented by the following general formulae (1) and (2) where R represents a lower alkyl group, a phenyl group, or a halogen atom, and Ar1 represents a residue of bis(aminophenoxy)benzene or bis(aminophenoxy)naphthalene.

Abstract: The present invention relates to an aromatic polyimide which has excellent heat resistance and excellent thermal dimensional stability, and which realizes low hygroscopic property, and an aromatic polyamic acid as a precursor for the aromatic polyimide. Provided are an aromatic polyamic acid including a structural unit represented by the following general formula (1), and an aromatic polyimide obtained by imidating the aromatic polyamic acid. The aromatic polyamic acid or the aromatic polyimide can be a copolymerization-type aromatic polyamic acid or aromatic polyimide having another structural unit: where, Ar1 represents a tetravalent organic group produced from a tetracarboxylic acid having one or more aromatic rings, and R represents a hydrocarbon having 2 to 6 carbon atoms.

Abstract: This invention relate to a copper-clad laminate with good adhesion between a copper foil and a layer of polyimide resin useful for high-density printed wiring boards. The copper-clad laminate having a copper foil treated with a heterocyclic compound containing nitrogen and sulfur as an organic surface treating agent and a layer of polyimide resin satisfying either of the following requirements: the concentration of sulfur atoms derived from the organic surface treating agent in the interface of copper and polyimide is in the range of 0.01-0.24 wt % as determined by an Energy dispersive X-ray spectroscopy (EDX); the weight of sulfur atoms derived from the organic surface treating agent per unit area of the copper foil is in the range of 2.5-3.1 mg/m2; and the concentration of sulfur atoms derived from the organic surface treating agent existing in the range from the surface to a depth of 16 nm of the copper foil is in the range of 1.73-2.30 atom % as determined by X-ray photoelectron spectroscopy (XPS).

Abstract: This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of the resin-forming component containing a photo- or heat-polymerizable unsaturated compound and 0.01-5 parts by weight of an inorganic filler such as silica sol with its average particle diameter controlled in the range 5 nm-0.5 &mgr;m. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.

Abstract: This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of (A) photo- or heat-polymerizable unsaturated compound composed of a polycarboxylic acid adduct of bisphenol-epoxy (meth)acrylate, 10-100 parts by weight of (B) alkylene oxide-modified product of (meth)acrylate or oligomers thereof, 0-50 parts by weight of (C) compound containing epoxy group and 0-50 parts by weight of (D) photopolymerization initiator or sensitizer. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.

Abstract: A method of making a multilayer buildup printed circuit board and mounting substrate wherein a resin laminated wiring sheet, which has a copper foil, an epoxy-acrylate photosensitive resin composition having a fluorene structure, and a conductive pattern, are overlaid on the conductive pattern side of a supporting substrate at 100° C. and 3 kg/cm2, and adhered thereto at 200 to 300° C. and 10 kg/cm2. The copper foil is entirely etched by wet-etching or is etched into a predetermined pattern so as to form a wiring structure. Since the epoxy-acrylate photosensitive resin composition is not treated at 100° C. or more, and hence is in a semi-cured state, the epoxy-acrylate photosensitive resin composition can be heat-bonded onto the supporting substrate.

Abstract: This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of (A) photo- or heat-polymerizable unsaturated compound composed of a polycarboxylic acid adduct of bisphenol-epoxy (meth)acrylate , 10-100 parts by weight of (B) alkylene oxide-modified product of (meth)acrylate or oligomers thereof, 0-50 parts by weight of (C) compound containing epoxy group and 0-50 parts by weight of (D) photopolymerization initiator or sensitizer. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.

Abstract: This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of the resin-forming component containing a photo- or heat-polymerizable unsaturated compound and 0.01-5 parts by weight of an inorganic filler such as silica sol with its average particle diameter controlled in the range 5 nm-0.5 &mgr;m. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.

Abstract: This invention relates to an aromatic ester (meth)acrylate dendrimer composed of the core formed by an aromatic polycarboxylic acid and the branches formed by an aromatic compound containing one hydroxyl group and two carboxyl groups and represented by the following general formula (1) and also to a curable resin composition which contains the dendrimer and a polymerization initiator as essential components, is low in viscosity and highly curable, and forms a coating film with excellent heat and moisture resistance.

Abstract: This invention relates to separation membranes composed of a mixture of two kinds or more of polymers containing at least one kind of polymer selected from polyesters, polyethers, polycarbonates, polyamides, and polyimides with a fluorene skeleton and possessing a spongy structure throughout and the membranes can be made by a known simple process, have not only excellent separatory ability but also good mechanical properties, and are particularly useful for ultrafiltration membranes and gas separation membranes.