Abstract: A protective tape including an adhesive agent layer, a thermoplastic resin layer, and a matrix film layer in this order to a surface of a wafer on which a bump electrode is formed; grinding a surface of the wafer opposite to the surface on which the protective tape is pasted; pasting an adhesive tape to the ground surface of the wafer; peeling the protective tape so that the adhesive agent layer remains and other layers are removed; dicing the wafer to which the adhesive tape is pasted to obtain individual semiconductor chips; and curing the adhesive agent layer before dicing; the adhesive agent layer after curing has a shear storage modulus of 3.0E+08 Pa to 5.0E+09 Pa, and the ratio of the thickness of the adhesive agent layer of the protective tape before pasting to the height of the bump electrode is 1/30 to 1/6.

Abstract: A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3): Ga>Gb??(1) Ta<Tb??(2) (Ga*Ta+Gb*Tb)/(Ta+Tb)?1.4E+06 Pa.??(3) Ga represents a shear storage modulus of the first thermoplastic resin layer at a pasting temperature at which the protective tape is pasted; Gb represents a shear storage modulus of the second thermoplastic resin layer at the pasting temperature at which the protective tape is pasted; Ta represents a thickness of the first thermoplastic resin layer; and Tb represents a thickness of the second thermoplastic resin layer.

Abstract: A protective tape including an adhesive agent layer, a thermoplastic resin layer, and a matrix film layer in this order to a surface of a wafer on which a bump electrode is formed; grinding a surface of the wafer opposite to the surface on which the protective tape is pasted; pasting an adhesive tape to the ground surface of the wafer; peeling the protective tape so that the adhesive agent layer remains and other layers are removed; dicing the wafer to which the adhesive tape is pasted to obtain individual semiconductor chips; and curing the adhesive agent layer before dicing; the adhesive agent layer after curing has a shear storage modulus of 3.0E+08 Pa to 5.0E+09 Pa, and the ratio of the thickness of the adhesive agent layer of the protective tape before pasting to the height of the bump electrode is 1/30 to ?.

Abstract: An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240° C. calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.

Abstract: A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3): Ga>Gb??(1) Ta<Tb??(2) (Ga*Ta+Gb*Tb)/(Ta+Tb)?1.4E+06 Pa.??(3) Ga represents a shear storage modulus of the first thermoplastic resin layer at a pasting temperature at which the protective tape is pasted; Gb represents a shear storage modulus of the second thermoplastic resin layer at the pasting temperature at which the protective tape is pasted; Ta represents a thickness of the first thermoplastic resin layer; and Tb represents a thickness of the second thermoplastic resin layer.

Abstract: An underfill material achieving a wide margin for mounting and a method for manufacturing a semiconductor device using the same are provided. The underfill material contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, wherein a minimum melt viscosity attainment temperature and a minimum melt viscosity obtained when melt viscosity of the underfill material is measured under a temperature increase rate condition in a range of 5 to 50° C./min are in a range of 100° C. to 150° C. and in a range of 100 to 5000 Pa·s, respectively. Since variation in the minimum melt viscosity attainment temperature measured under different temperature increase conditions is small, voidless mounting and good solder bonding properties can be achieved without strict control on the temperature profile during thermocompression bonding, and a wide margin for mounting can be achieved.

Abstract: A protective tape and a method for manufacturing a semiconductor device using the same capable of achieving excellent connection properties. The protective tape includes an adhesive layer, a thermoplastic resin layer and a backing material film in that order; a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. This suppresses resin residue on bumps thereby achieving excellent connection properties.

Abstract: An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240° C. calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.

Abstract: An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240° C. calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.

Abstract: An underfill material achieving a wide margin for mounting and a method for manufacturing a semiconductor device using the same are provided. The underfill material contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, wherein a minimum melt viscosity attainment temperature and a minimum melt viscosity obtained when melt viscosity of the underfill material is measured under a temperature increase rate condition in a range of 5 to 50° C./min are in a range of 100° C. to 150° C. and in a range of 100 to 5000 Pa·s, respectively. Since variation in the minimum melt viscosity attainment temperature measured under different temperature increase conditions is small, voidless mounting and good solder bonding properties can be achieved without strict control on the temperature profile during thermocompression bonding, and a wide margin for mounting can be achieved.

Abstract: A protective tape and a method for manufacturing a semiconductor device using the same capable of achieving excellent connection properties. The protective tape includes an adhesive layer, a thermoplastic resin layer and a backing material film in that order; a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. This suppresses resin residue on bumps thereby achieving excellent connection properties.

Abstract: An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240° C. calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.

Abstract: Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.

Abstract: Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.

Abstract: An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet.

Abstract: An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet.

Abstract: A liquid absorbing sheet has a liquid-absorbing resin layer that can effectively absorb the nonaqueous electrolyte solution used in nonaqueous electrolyte secondary cells that make nonaqueous electrolyte battery packs (in particular, lithium ion-based nonaqueous secondary battery packs). The liquid-absorbing resin layer is obtained by irradiating a particular monomer composition with UV rays or other energy rays to polymerize the monomer composition. The monomer composition contains a monofunctional monomer component (A) having a polyethylene glycol acrylate monomer and an amide bond-containing acrylic monomer; and a polyfunctional monomer component (B).

Abstract: A liquid absorbing sheet has a liquid-absorbing resin layer that can effectively absorb the nonaqueous electrolyte solution used in nonaqueous electrolyte secondary cells that make nonaqueous electrolyte battery packs (in particular, lithium ion-based nonaqueous secondary battery packs). The liquid-absorbing resin layer is obtained by irradiating a particular monomer composition with UV rays or other energy rays to polymerize the monomer composition. The monomer composition contains a monofunctional monomer component (A) having a polyethylene glycol acrylate monomer and an amide bond-containing acrylic monomer; and a polyfunctional monomer component (B).

Abstract: In a battery pack including a battery case containing therein a battery cell, a wiring circuit board, and a liquid-absorbing element capable of absorbing the electrolyte leaking out from the battery cell, the liquid-absorbing element is inserted with looseness allowing for expansion in a gap formed by a retaining element on the inner wall surface of the battery case or retaining element on the wiring circuit board. Alternatively, a liquid-absorbing element consisting of a non-absorbent porous retaining element partially holding a liquid absorbent is used and the porous retaining element is fixed to the inner wall surface of the battery case or the wiring circuit board at an absorbent-free zone.

Abstract: A liquid absorbing sheet includes a liquid absorbing resin layer that can effectively absorb nonaqueous electrolyte solutions used in nonaqueous electrolyte secondary cells that make nonaqueous electrolyte battery packs (in particular, lithium ion-based nonaqueous secondary battery packs). The liquid absorbing resin layer is obtained by irradiating UV-rays onto a monomer composition to polymerize the monomer composition, the monomer composition containing: a monofunctional monomer component containing a monofunctional monomer capable of forming a homopolymer that is soluble in a nonaqueous solvent used in a nonaqueous electrolyte secondary battery; and a polyfunctional monomer component.