Abstract: An optical disc production apparatus for producing a disc substrate with one or two signal layers including: a first signal layer forming mechanism for forming a first signal layer on a disc substrate (hereinafter, substrate); a layer forming mechanism which selectively forms a first reflection layer on the first signal layer and forms a second reflection layer on a second signal layer; a second signal layer forming mechanism which forms the second signal layer on the substrate on which the first reflection layer is formed on the first signal layer; a light transmission layer forming mechanism which forms a light transmission layer on the first/second reflection layer; a first transportation mechanism in a loop shape which is arranged close to each of the above-described constitutional element; a second transportation mechanism which is arranged closed to the first transportation mechanism, and which transports the substrate on which the first/second reflection layer is formed on the first signal layer to the

Abstract: The object of the present invention is to considerably reduce the amount of heat generated in comparison with a conventional lamp to decrease the thermal effects on an optical disc in an adhesive curing method suitable for curing adhesive supplied between the substrates of a DVD or other optical disc in particular. In the adhesive curing method as claimed in the present invention, an adhesive is cured by irradiating with ultraviolet rays using semiconductor elements that emit ultraviolet rays instead of a lamp. In this case, light-emitting semiconductor elements are used that emit ultraviolet rays having a wavelength within a range in which the transmittance relative to the adhesive before curing is lower than the transmittance relative to the adhesive after curing.

Abstract: An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing device includes; a support mechanism which supports the first substrate and second substrate after the adhesive is spread by the spinner, a semiconductor light emitting apparatus having a plurality of light emitting semiconductor elements arranged facing a region where the adhesive is cured, and a positioning mechanism which positions the semiconductor light emitting apparatus such that the light emitting semiconductor elements are a predetermined distance away from the adhesive. The adhesive is cured or semi-cured by ultraviolet light emitted from the plurality of light emitting semiconductor elements.

Abstract: A molding machine 1 which molds two sheets of disc substrates on which the information is recorded simultaneously, a cooling mechanism 3 for cooling each of the disc substrates, first movably mounting means 2 for movably mounting the disc substrate from the molding machine onto the cooling mechanism, and a second movably mounting means 4 for mounting each of the disc substrates onto a receiving portion of the turn table 5 are provided.

Abstract: As to a reactor which is used in a process for producing hydrogen fluoride through a reaction of fluorite with sulfuric acid, and which comprises means for applying a shearing force to a content therein between the means and an inner surface thereof, a metal material is used for at least a portion of a part of the means which part is opposed to the inner surface, the metal material comprising tungsten carbide and a material comprising at least one element, or an alloy comprising two or more elements, selected from the group consisting of nickel, chromium, cobalt, iron, tungsten and carbon, the metal material comprising 30 to 90% by weight of tungsten carbide. Thereby, it becomes possible to reduce the wear of an edge of the means for applying the shearing force to the content (the reaction mixture) between the means and the inner surface.

Abstract: An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing device includes; a support mechanism which supports the first substrate and second substrate after the adhesive is spread by the spinner, a semiconductor light emitting apparatus having a plurality of light emitting semiconductor elements arranged facing a region where the adhesive is cured, and a positioning mechanism which positions the semiconductor light emitting apparatus such that the light emitting semiconductor elements are a predetermined distance away from the adhesive. The adhesive is cured or semi-cured by ultraviolet light emitted from the plurality of light emitting semiconductor elements.

Abstract: A method and apparatus for manufacturing an optical disc, a transparent disc substrate having two relatively wide-area surfaces thereof on at least one of which an information is recorded and a first reflective film is formed onto a dummy disc having similar relatively wide-area surfaces thereof on at least one which another information is recorded and a second reflective film having a light semi-transmissive characteristic is formed are bonded via an adhesive layer and, thereafter, an external force is applied between the dummy disc and the disc substrate through an integrated center hole penetrated through the dummy disc and the disc substrate at center positions thereof to peel off the dummy disc at a first interface between the dummy disc and the second reflective film thereof.

Abstract: The object of the present invention is to considerably reduce the amount of heat generated in comparison with a conventional lamp to decrease the thermal effects on an optical disc in an adhesive curing method suitable for curing adhesive supplied between the substrates of a DVD or other optical disc in particular. In the adhesive curing method as claimed in the present invention, an adhesive is cured by irradiating with ultraviolet rays using semiconductor elements that emit ultraviolet rays instead of a lamp. In this case, light-emitting semiconductor elements are used that emit ultraviolet rays having a wavelength within a range in which the transmittance relative to the adhesive before curing is lower than the transmittance relative to the adhesive after curing.

Abstract: As to a reactor which is used in a process for producing hydrogen fluoride through a reaction of fluorite with sulfuric acid, and which comprises means for applying a shearing force to a content therein between the means and an inner surface thereof, a metal material is used for at least a portion of a part of the means which part is opposed to the inner surface, the metal material comprising tungsten carbide and a material comprising at least one element, or an alloy comprising two or more elements, selected from the group consisting of nickel, chromium, cobalt, iron, tungsten and carbon, the metal material comprising 30 to 90% by weight of tungsten carbide. Thereby, it becomes possible to reduce the wear of an edge of the means for applying the shearing force to the content (the reaction mixture) between the means and the inner surface.

Abstract: A molding machine 1 which molds two sheets of disc substrates on which the information is recorded simultaneously, a cooling mechanism 3 for cooling each of the disc substrates, first movably mounting means 2 for movably mounting the disc substrate from the molding machine onto the cooling mechanism, and a second movably mounting means 4 for mounting each of the disc substrates onto a receiving portion of the turn table 5 are provided.

Abstract: In method and apparatus for manufacturing an optical disc, a transparent disc substrate having two relatively wide-area surfaces thereof on at least one of which an information is recorded and a first reflective film is formed onto a dummy disc having the similar relatively wide-area surfaces thereof on at least one which another information is recorded and a second reflective film having a light semi-transmissive characteristic is formed are bonded via an adhesive layer and, thereafter, an external force is applied between the dummy disc and the disc substrate through an integrated center hole penetrated through the dummy disc and the disc substrate at center positions thereof to peel off the dummy disc at a first interface between the dummy disc and the second reflective film thereof.

Abstract: A method and apparatus for manufacturing an optical disc, a transparent disc substrate having two relatively wide-area surfaces thereof on at least one of which an information is recorded and a first reflective film is formed onto a dummy disc having similar relatively wide-area surfaces thereof on at least one which another information is recorded and a second reflective film having a light semi-transmissive characteristic is formed are bonded via an adhesive layer and, thereafter, an external force is applied between the dummy disc and the disc substrate through an integrated center hole penetrated through the dummy disc and the disc substrate at center positions thereof to peel off the dummy disc at a first interface between the dummy disc and the second reflective film thereof In a preferred embodiment, a partial peeling off of the dummy disc from the second reflective film is carried out through a mechanical force and a complete peeling off of the dummy disc from the second reflective film is carried out

Abstract: A disk bonding system or method comprises a first element for forming an annular adhesive layer on an upwardly facing joint surface of a lower side disk, and a second element for forming a dotted adhesive layer on a downwardly facing joint surface of an upper side disk. Then, a third element sets the upper and lower side disks in a confronting state, and reduces the spacing between the upper and lower side disks until the annular adhesive layer and the dotted adhesive layer are sandwiched between the upper and lower side disks. During this, the annular adhesive layer and the dotted adhesive layer are brought into contact with each other, and the contact region expands in a manner to prevent occurrence of bubbles.

Abstract: A system for fabricating a bonded disk, comprises an adhesive supplying section for supplying a liquid adhesive on a first disk, a disk handling section for mating the first disk with a second disk, a spin coating section for spreading the adhesive between the first and second disks and a curing section for curing the adhesive. The disk handling section comprises a disk transfer mechanism for arranging the first and second disks in a confronting state in which the first and second disks confront each other and the adhesive supplied to the first disk is interposed between the first and second disks, and for transferring the first and second disks to the spin coating section so that the first and second disks remain in the confronting state.

Abstract: To improve the reliability, operating speed, size of equipment and economy, a disk coating system for forming a coating on a disk such as a compact disk is arranged to transfer disks to and from a pair of spinners with first and second disk transfer mechanisms. The coating system further has an intermittently rotating turntable, an apparatus for supplying a coating material to each disk on the turntable at a predetermined position, and a system for curing a coating layer on each disk. The spinners for removing an excess amount of the coating material are placed between the turntable and the curing system. The first transfer mechanism is for transferring disks from the turntable to the spinners, and the second transfer mechanism is for transferring disks from the spinners to the curing system. The two spinners are substantially equidistant from a predetermined disk position on the turntable. The first transfer mechanism has two arms extending in two directions diverging from a pivot at a predetermined angle.