Patents by Inventor Hironobu Okino

Hironobu Okino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing probing head for testing equipment of semi-conductor large scale integrated circuits
    Patent number: 4952272
    Abstract: A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.
    Type: Grant
    Filed: May 30, 1989
    Date of Patent: August 28, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Hironobu Okino, Akio Fujiwara, Yutaka Akiba, Susumu Kasukabe, Tsuyoshi Fujita, Masao Mitani, Kazuo Hirota