Abstract: A wire cover includes an inner cover member covering a bent section of an electric wire from an inner peripheral side and an outer cover member covering the bent section from an outer peripheral side. One end portion of the wire cover sandwiches the electric wire along a first direction. The other end portion of the wire cover sandwiches the electric wire along a second direction. The inner cover member and the outer cover member move relative to each other along the first direction. When observed from a third direction intersecting a plane that includes the first direction and the second direction, a first attachment portion and a second attachment portion are positioned outward of the surface of the inner cover body on the innermost side of the bent section or inward of the surface of the outer cover body on the outermost side of the bent section.

Abstract: A technique makes it possible to prevent direct contact between a nozzle outer periphery and a nozzle adapter and to prevent generation of particles due to the direct contact. The technique includes: a nozzle that has an attaching portion formed on one end and discharges, into a processing chamber, a gas supplied to the attaching portion; a nozzle adapter that is disposed in the processing chamber and is clearance-fitted to an outer peripheral surface of the attaching portion with a predetermined gap; and a plurality of annular buffer members that is disposed in the attaching portion and abuts on the nozzle adapter, in which at least one of the annular buffer members is compressed and deformed in a radial direction of the corresponding annular buffer member in a state where the attaching portion of the nozzle is attached to the nozzle adapter.

Abstract: There is provided a technique capable of reducing a tilt of a nozzle. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process vessel constituted by a reaction tube and a manifold supporting the reaction tube from thereunder and in which a substrate is processed; a nozzle through which a process gas is supplied to the substrate; a metal adapter configured to hold the nozzle vertically in the process vessel; a support base arranged below the metal adapter and fixed to the manifold; and a fixing bolt engaging with the support base and screwed into the metal adapter.

Abstract: Disclosed is an optical information recording medium that can solve a problem that a BCA mark becomes unrecognizable in an optical recording medium including a recording layer using an organic coloring matter. A playback signal in a burst cut area comprises a bright-area amplitude level formed upon the playback of a part where no barcode-shaped mark has been formed, a dark-area amplitude level formed upon the playback of a part where a barcode-shaped mark has been formed, and a maximum amplitude level having a protruded waveform formed upon the reproduction of the edge of a barcode-shaped mark. When a portion intermediate between the maximum amplitude level and the dark-part amplitude level is defined as an intermediate level, the intermediate level is lower than the bright-area amplitude level.

Abstract: Contamination of a substrate can be prevented or suppressed. A substrate processing apparatus includes a reaction tube having an inner space divided by a barrier wall into a film forming space and a plasma generating space. When a desired film is formed on a substrate placed inside the reaction tube, first and second processing gases are supplied to the reaction tube through nozzles. On the other hand, when a part of the reaction tube constituting the plasma generating space is coated with a film, second and third processing gases are supplied to the plasma generating space through the nozzle.

Abstract: A substrate processing apparatus includes a processing chamber, a substrate holding part that holds substrates of required numbers in the processing chamber, a gas supply/exhaust part that supplies or exhausts required gas into the processing chamber, a rotation part that rotates the substrate holding part, a first heating part provided in the substrate holding part so as to face at least an upper surface of each substrate held by the substrate holding part, and a power supply part that supplies power to the first heating part in a non-contact state by electromagnetic coupling.

Abstract: Disclosed is an optical information recording medium that can solve a problem that a BCA mark becomes unrecognizable in an optical recording medium including a recording layer using an organic coloring matter. A playback signal in a burst cut area comprises a bright-area amplitude level formed upon the playback of a part where no barcode-shaped mark has been formed, a dark-area amplitude level formed upon the playback of a part where a barcode-shaped mark has been formed, and a maximum amplitude level having a protruded waveform formed upon the reproduction of the edge of a barcode-shaped mark. When a portion intermediate between the maximum amplitude level and the dark-part amplitude level is defined as an intermediate level, the intermediate level is lower than the bright-area amplitude level.

Abstract: A dye or dyes are selected, which are capable of absorbing a laser beam with a wavelength of 350 to 500 nm and are capable of recording sub-information using a laser beam with a wavelength of 640 to 680 nm or 750 to 830 nm. An optical information recording medium including the optical recording layer records sub-information (BCA information) of a type different from that of main information (data information) in a sub-information region (a BCA recording region) different from a main information area (a data area) using a laser beam.

Abstract: A substrate processing apparatus includes a processing chamber, a substrate holding part that holds substrates of required numbers in the processing chamber, a gas supply/exhaust part that supplies or exhausts required gas into the processing chamber, a rotation part that rotates the substrate holding part, a first heating part provided in the substrate holding part so as to face at least an upper surface of each substrate held by the substrate holding part, and a power supply part that supplies power to the first heating part in a non-contact state by electromagnetic coupling.

Abstract: A substrate processing apparatus includes a processing chamber, a substrate holding part that holds substrates of required numbers in the processing chamber, a gas supply/exhaust part that supplies or exhausts required gas into the processing chamber, a rotation part that rotates the substrate holding part, a first heating part provided in the substrate holding part so as to face at least an upper surface of each substrate held by the substrate holding part, and a power supply part that supplies power to the first heating part in a non-contact state by electromagnetic coupling.

Abstract: Contamination of a substrate can be prevented or suppressed. A substrate processing apparatus includes a reaction tube having an inner space divided by a barrier wall into a film forming space and a plasma generating space. When a desired film is formed on a substrate placed inside the reaction tube, first and second processing gases are supplied to the reaction tube through nozzles. On the other hand, when a part of the reaction tube constituting the plasma generating space is coated with a film, second and third processing gases are supplied to the plasma generating space through the nozzle.

Abstract: A substrate processing apparatus includes a processing chamber, a substrate holding part that holds substrates of required numbers in the processing chamber, a gas supply/exhaust part that supplies or exhausts required gas into the processing chamber, a rotation part that rotates the substrate holding part, a first heating part provided in the substrate holding part so as to face at least an upper surface of each substrate held by the substrate holding part, and a power supply part that supplies power to the first heating part in a non-contact state by electromagnetic coupling.

Abstract: In an optical information recording medium, a first sub-information area, a second sub-information area, and the main information area are provided in order from the center of the optical information recording medium in an outer peripheral direction. A first groove is formed in the first boundary area between the first sub-information area and the second sub-information area and a second groove is formed in the second boundary area between the second sub-information area and the main information area.

Abstract: A dye or dyes are selected, which are capable of absorbing a laser beam with a wavelength of 350 to 500 nm and are capable of recording sub-information using a laser beam with a wavelength of 640 to 680 nm or 750 to 830 nm. An optical information recording medium including the optical recording layer records sub-information (BCA information) of a type different from that of main information (data information) in a sub-information region (a BCA recording region) different from a main information area (a data area) using a laser beam.

Abstract: An optical information recording/reproducing method and a device are provided, which can optimally record and reproduce information onto and from an optical information recording medium such as CD-R or DVD-R for high-density recording. A reproducing signal corresponding to a pit-land pattern recorded on the optical information recording medium is obtained by irradiating laser light to the optical information recording medium to judge a relative effective spot diameter of the laser light corresponding to a standard length T according to the reproducing signal, a correction range at recording of information is specified according to the judged effective spot diameter, a recording pulse is corrected according to the specified correction range, and a correction range of the reproducing signal at reproduction of information is specified to correct the reproducing signal according to the specified correction range.

Abstract: In a semiconductor device, a second wiring layer 7 is formed via an inter-layer insulation film 6 on a first wiring layer 2 connected to an active region of a silicon substrate 1, and a bonding pad 14 is placed on the second wiring layer 7 via a protection film 8 and a polyimide film 10, so as to overlie the active region of the silicon substrate 1. The second wiring layer 7 has a plurality of wires 7a and 7b in a region underlying the bonding pad 14: the wire 7a is joined to the bonding pad 14 via opening sections 9 and 11 provided in the protection film 8 and the polyimide film 10, respectively, and the protection film 8 and the polyimide film 10 are placed between the wires 7b and the bonding pad 14.

Abstract: In a semiconductor device, a second wiring layer 7 is formed via an inter-layer insulation film 6 on a first wiring layer 2 connected to an active region of a silicon substrate 1, and a bonding pad 14 is placed on the second wiring layer 7 via a protection film 8 and a polyimide film 10, so as to overlie the active region of the silicon substrate 1. The second wiring layer 7 has a plurality of wires 7a and 7b in a region underlying the bonding pad 14: the wire 7a is joined to the bonding pad 14 via opening sections 9 and 11 provided in the protection film 8 and the polyimide film 10, respectively, and the protection film 8 and the polyimide film 10 are placed between the wires 7b and the bonding pad 14.