Abstract: A light irradiating medical device 1 includes a catheter shaft 2 extending in a longitudinal direction; a balloon 5 disposed at a distal portion of the catheter shaft 2; a light guiding tool 10 disposed in a lumen of the catheter shaft 2 and movable in the longitudinal direction, the light guiding tool 10 including an optical fiber 11 extending in the longitudinal direction and a tubular member 15 covering the optical fiber 11 and having light transparency, the optical fiber 11 including a core 12, a cladding 13 and a cladding absent portion 14 disposed at a part of a distal portion of the core 12; a first radiopaque marker 21 disposed at the distal portion of the catheter shaft 2; and a second radiopaque marker 22 disposed at the tubular member 15 at a position distal to a distal end 12a of the core 12.

Abstract: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.

Abstract: A method of manufacturing a semiconductor device includes spraying fluid onto a surface of a treatment target substrate including a semiconductor substrate; forming a protection layer on the surface of the treatment target substrate after spraying the fluid; selectively removing the protection layer and a part of the treatment target substrate by an energy beam; and conducting removal processing on an area of the treatment target substrate from which the protection layer and the part of the treatment target substrate are selectively removed.

Abstract: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.

Abstract: A semiconductor device including a plurality of circuit regions formed in a semiconductor substrate and a scribe region formed around the circuit regions for separating the respective circuit regions, the scribe region having a plurality of laminated interlayer films including a plurality of metal films and an optically-transparent insulation film formed between and on the plurality of metal films, wherein a first metal film included in a first upper interlayer film of the plurality of interlayer films is positionally offset in a vertical direction to a second metal film included in a second lower interlayer film under the first interlayer film.

Abstract: A method of manufacturing a semiconductor device includes spraying fluid onto a surface of a treatment target substrate including a semiconductor substrate; forming a protection layer on the surface of the treatment target substrate after spraying the fluid; selectively removing the protection layer and a part of the treatment target substrate by an energy beam; and conducting removal processing on an area of the treatment target substrate from which the protection layer and the part of the treatment target substrate are selectively removed.