Patents by Inventor Hironori Hayakawa

Hironori Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150282386
    Abstract: A heat source unit of a refrigerating apparatus includes a heat exchanger, an actuator, an electrical component controlling the actuator, a casing, and a partitioning plate. The casing has bottom and top plates with a vent on the top plate. The heat exchanger has first, second, third and fourth side face parts. The actuator is disposed in a first space surrounded by the first to fourth side face parts, and the partitioning plate. The electronic component is disposed in a second space partitioned from the first space by the partitioning plate. The second space is in a corner formed by the first and second side face parts. The partitioning plate is positioned between end parts of the first and fourth side face parts, and at least a portion is inserted between the bottom and top plates and fixed in a placed state.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 1, 2015
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventor: Hironori HAYAKAWA
  • Publication number: 20150225837
    Abstract: A resin substrate with a transparent electrode having a low resistance, and a manufacturing method thereof including: a deposition step wherein a transparent electrode layer of indium tin oxide is formed on a transparent film substrate by a sputtering method, and a crystallization step wherein the transparent electrode layer is crystallized. In the deposition step, a sputtering deposition is performed using a sputtering target containing indium oxide and tin oxide, while a sputtering gas containing argon and oxygen is introduced into a chamber. It is preferable that an effective exhaust rate S, calculated from a rate Q of the sputtering gas introduced into the chamber and a pressure P in the chamber by a formula S (L/second)=1.688×Q (sccm)/P (Pa), is 1,200-5,000 (L/second). It is also preferable that a resistivity of the transparent electrode layer is less than 3×10?4 ?cm.
    Type: Application
    Filed: August 23, 2013
    Publication date: August 13, 2015
    Inventors: Hironori Hayakawa, Takashi Kuchiyama, Hiroaki Ueda
  • Publication number: 20140370275
    Abstract: The present invention relates to a substrate with a transparent electrode, which has a transparent electrode layer on at least one surface of a transparent film base material. The transparent film base material has a transparent dielectric material layer containing an oxide as a main component on a surface at the transparent electrode layer side. In one embodiment of the present invention, the transparent electrode layer is a crystalline transparent electrode layer that has a crystallinity degree of 80% or more. In this embodiment, the crystalline transparent electrode layer has a resistivity of 3.5×10?4 ?·cm or less, a thickness of 15 nm to 40 nm, an indium oxide content of 87.5% to 95.5%, and a carrier density of 4×1020/cm3 to 9×1020/cm3, and the substrate with the transparent electrode preferably has a heat shrinkage start temperature of 75° C. to 120° C. as measured by thermomechanical analysis.
    Type: Application
    Filed: January 18, 2013
    Publication date: December 18, 2014
    Applicant: KANEKA CORPORATION
    Inventors: Takashi Kuchiyama, Hironori Hayakawa, Hiroaki Ueda, Takahisa Fujimoto, Kenji Yamamoto