Patents by Inventor Hironori Ikeno

Hironori Ikeno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220025123
    Abstract: A condensation-curable resin composition which contains: (A) an organosilicon compound containing a structural unit (i) represented by the following formula (i) and a structural unit (ii) represented by the following formula (ii), having a SiOH group at both ends of the molecular chain, and having a weight average molecular weight of 10,000 or more and 10,000,000 or less; and (B) an organometallic compound having three or more condensation-reactive groups. In formula (i), each R1 is independently a hydrocarbon group having 1 to 8 carbon atoms. In formula (ii), each R2 is independently a hydrocarbon group having 1 to 8 carbon atoms.
    Type: Application
    Filed: November 22, 2019
    Publication date: January 27, 2022
    Applicant: JNC CORPORATION
    Inventors: Hironori IKENO, Kazuya SUWA, Keisuke NISHIZAWA, Ayaka KIYA, Kiichi KAWABATA
  • Publication number: 20190375896
    Abstract: Provided is a new compound which can provide a cured film obtained from a resin composition with low cure shrinkage while suppressing reduction of hardness (scratch resistance) thereof. A silsesquioxane derivative having a radically polymerizable functional group, which is represented by formula (1), (2) or (3). In the formulas (1) to (3), R1 is a group independently selected from alkyl having 1 to 45 carbons, cycloalkyl having 4 to 8 carbons, aryl having 6 to 14 carbons and arylalkyl having 7 to 24 carbons, R2 and R3 are a group independently selected from alkyl having 1 to 10 carbons, cyclopentyl, cyclohexyl and phenyl, and X is independently hydrogen or a monovalent organic group, in which at least one of X is a radically polymerizable functional group represented by formula (4).
    Type: Application
    Filed: January 9, 2018
    Publication date: December 12, 2019
    Inventors: Kazuya SUWA, Hironori IKENO, Tomoyuki OOBA
  • Publication number: 20190185711
    Abstract: An epoxy resin composition which is suppressed in curing shrinkage upon being cured to obtain a cured film having low warpage and high adhesion. The epoxy resin composition contains epoxy resin (A), compound (B) represented by formula (1) and nanosilica filler (C). In formula (1), R1 and R2 are independently an alkyl group having 1 to 10 carbons or a phenyl group, and X is independently hydrogen or a monovalent organic group, and in one molecule of the compound, at least one of X includes an epoxy group.
    Type: Application
    Filed: August 26, 2016
    Publication date: June 20, 2019
    Applicants: JNC CORPORATION, JNC PETROCHEMICAL CORPORATION
    Inventors: Kazuya SUWA, Masaru EGUCHI, Hironori IKENO, Tomoyuki OBA
  • Patent number: 9753186
    Abstract: Disclosed is a glass fiber-silsesquioxane composite molded article containing glass fibers and a cured material of a silsesquioxane polymer composited therewith, wherein the silsesquioxane has a polyhedral structure or a partially polyhedral structure. The glass fiber-silsesquioxane composite molded article is preferably obtained by impregnating glass fibers with a composition containing at least one of silsesquioxanes represented by formula (A-1) to (A-3) and at least one of a curing agent, a polymerization initiator, and a hydrosilylation catalyst, or the silsesquioxane polymer and allowing a curing reaction to proceed.
    Type: Grant
    Filed: April 14, 2010
    Date of Patent: September 5, 2017
    Assignee: JNC CORPORATION
    Inventors: Hironori Ikeno, Kazuhiro Yoshida
  • Publication number: 20120052296
    Abstract: Disclosed is a glass fiber-silsesquioxane composite molded article containing glass fibers and a cured material of a silsesquioxane polymer composited therewith, wherein the silsesquioxane has a polyhedral structure or a partially polyhedral structure. The glass fiber-silsesquioxane composite molded article is preferably obtained by impregnating glass fibers with a composition containing at least one of silsesquioxanes represented by formula (A-1) to (A-3) and at least one of a curing agent, a polymerization initiator, and a hydrosilylation catalyst, or the silsesquioxane polymer and allowing a curing reaction to proceed.
    Type: Application
    Filed: April 14, 2010
    Publication date: March 1, 2012
    Inventors: Hironori Ikeno, Kazuhiro Yoshida