Patents by Inventor Hironori KANEKO

Hironori KANEKO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer polishing apparatus and polishing head used for same
    Patent number: 10710209
    Abstract: A wafer polishing apparatus is provided with a rotating platen to which a polishing pad is affixed and a polishing head that holds a wafer placed on the polishing pad while pressing the wafer. The polishing head has a membrane that contacts the upper surface of the wafer and applying a pressing force thereto and a support plate that supports the membrane. The membrane has a main surface part facing the bottom surface of the support plate and a side surface part facing the outer peripheral edge surface of the support plate. The vertical tension due to the side surface part of the membrane is larger than the lateral tension due to the main surface part of the membrane.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: July 14, 2020
    Assignee: SUMCO CORPORATION
    Inventors: Ryoya Terakawa, Ryuichi Tanimoto, Hironori Kaneko
  • WAFER POLISHING APPARATUS AND POLISHING HEAD USED FOR SAME
    Publication number: 20180311783
    Abstract: A wafer polishing apparatus is provided with a rotating platen to which a polishing pad is affixed and a polishing head that holds a wafer placed on the polishing pad while pressing the wafer. The polishing head has a membrane that contacts the upper surface of the wafer and applying a pressing force thereto and a support plate that supports the membrane. The membrane has a main surface part facing the bottom surface of the support plate and a side surface part facing the outer peripheral edge surface of the support plate. The vertical tension due to the side surface part of the membrane is larger than the lateral tension due to the main surface part of the membrane.
    Type: Application
    Filed: October 12, 2016
    Publication date: November 1, 2018
    Applicant: SUMCO CORPORATION
    Inventors: Ryoya TERAKAWA, Ryuichi TANIMOTO, Hironori KANEKO