Abstract: A manufacturing method of an electronic device includes forming a support layer that is provided to extend from a first surface of a functional layer formed on a first substrate via a first layer, as a surface on a side opposite to the first substrate, to the first substrate and supports the functional layer with respect to the first substrate, forming a thin film holding layer on at least one of the support layer and the first surface of the functional layer, removing the first layer, joining a transfer member to a surface of the thin film holding layer on a side opposite to the functional layer, separating the functional layer, the support layer and the thin film holding layer from the first substrate, transferring the functional layer, the support layer and the thin film holding layer to a different second substrate, and removing the thin film holding layer.

Abstract: An economical heat pipe type cooling device with high performance and stable start at low environmental temperatures below 0° C., and a railcar control equipment using the invented heat pipe type cooling device are provided. The midsection between two bents formed on a heat pipe is used as an evaporator; lengths of two distal sections to be used as the condenser sections are intentionally differentiated each from the other; and the condenser section of greater length is provided with heat radiating fins more than those on the condenser section of shorter length. This configuration permits each of two condenser sections to be provided with mutually different condensing capacity and accordingly the condenser section of shorter length works to cool heat-generating elements even though the condenser section of greater length would suffer from freezing problem at low temperatures. A sufficient cooling effect is rendered at ordinary temperature.

Abstract: A heat sink includes a laminated body disposed in a flow path for circulating a refrigerant. The laminated body includes a metallic tube body enclosing the flow path therein, an insulation layer formed on a periphery of the tube body, and a conductor that is formed on a periphery of the insulation layer and includes a bonding surface bonded to an electrode of a semiconductor device to be cooled.

Abstract: An economical heat pipe type cooling device with high performance and stable start at low environmental temperatures below 0° C., and a railcar control equipment using the invented heat pipe type cooling device are provided. The midsection between two bents formed on a heat pipe is used as an evaporator; lengths of two distal sections to be used as the condenser sections are intentionally differentiated each from the other; and the condenser section of greater length is provided with heat radiating fins more than those on the condenser section of shorter length. This configuration permits each of two condenser sections to be provided with mutually different condensing capacity and accordingly the condenser section of shorter length works to cool heat-generating elements even though the condenser section of greater length would suffer from freezing problem at low temperatures. A sufficient cooling effect is rendered at ordinary temperature.

Abstract: A heat pipe heat exchanger and a method for fabricating the same are disclosed. A heat pipe heat exchanger 1 is provided with a heat pipe 2, and a heat block 3 having a heat pipe-holding hole 3A, and a fin 4 having a fin base portion 4A, to which the heat pipe 2 is joined by a heating tube expansion method. The heat pipe 2 is plastically deformable and in which a predetermined amount of hydraulic fluid 2a is sealed. The heat pipe 2 is composed of a pipe having a cross section except a perfect circle. The heat pipe-holding hole 3A and the fin base portion 4A are composed of holes each having a cross section except the perfect circle.

Abstract: A heat pipe heat sink and a method for making the same are disclosed. A heat pipe heat sink 1 has a heat block 2 which is heat exchangeably mounted to a heat exchange object, and the heat block 2 is composed of a first heat block unit 5 and a second heat block unit 6 for sandwiching a heat pipe 3. A first concave groove 5A and a second concave groove 6A are provided to form a pipe holding hole 2A between the first heat block unit 5 and the second heat block unit 6. The pipe holding hole 2A is configured as a space for accommodating one end of the heat pipe 3 by plastically deforming a cross section of the heat pipe 3 by sandwiching between the first heat block unit 5 and the second heat block unit 6. According to the heat pipe heat sink, reduction in cost, high heat transfer between the heat pipe and heat block, and stability in the heat pipe retention can be obtained.

Abstract: A heat pipe heat exchanger and a method for fabricating the same are disclosed. A heat pipe heat exchanger 1 is provided with a heat pipe 2, and a heat block 3 having a heat pipe-holding hole 3A, and a fin 4 having a fin base portion 4A, to which the heat pipe 2 is joined by a heating tube expansion method. The heat pipe 2 is plastically deformable and in which a predetermined amount of hydraulic fluid 2a is sealed. The heat pipe 2 is composed of a pipe having a cross section except a perfect circle. The heat pipe-holding hole 3A and the fin base portion 4A are composed of holes each having a cross section except the perfect circle.

Abstract: A liquid circulation type cooling system includes a circulating pump for circulating a liquid, a heat exchanger disposed in a heat radiation space and for radiating heat outside the system. The heat exchanger contains a core unit, a liquid reservoir for storing the liquid positioned on the upstream side of the core unit and having a liquid opening, another liquid reservoir for storing the liquid and positioned on the downstream side of the core unit, the other liquid reservoir having a liquid opening, a heat-receiving member, a piping, and a fan for supplying air to the heat exchanger to effect forced air-cooling.