Abstract: A pre-array temporary placement area A2 and a post-return temporary placement area A3 are set along with a lower receiving area A1. Temporary placement positions TP for lower receiving pins 22 in the pre-array temporary placement area A2 and the post-return temporary placement area A3 are previously assigned in consideration of requirements for preventing occurrence of interference between the lower receiving pins 22, which would otherwise occur during transfer of the lower receiving pins 22, and in accordance with array positions AP of the lower receiving pins 22 in the lower receiving area A1. Further, a transfer sequence is set in accordance with array positions AP.

Abstract: A nozzle placement history data management method is accomplished by an electronic component mounting apparatus having an adsorption nozzle detachably placed on a mount head. The presence or absence of the adsorption nozzle is detected by a flow rate sensor. A board recognition camera provides identification information of the nozzle with the result that the nozzle placement history data can be updated, managed and updated.

Abstract: A pre-array temporary placement area A2 and a post-return temporary placement area A3 are set along with a lower receiving area A1. Temporary placement positions TP for lower receiving pins 22 in the pre-array temporary placement area A2 and the post-return temporary placement area A3 are previously assigned in consideration of requirements for preventing occurrence of interference between the lower receiving pins 22, which would otherwise occur during transfer of the lower receiving pins 22, and in accordance with array positions AP of the lower receiving pins 22 in the lower receiving area A1. Further, a transfer sequence is set in accordance with array positions AP.

Abstract: An electronic component mounting apparatus and a nozzle placement history data management method for making it possible to correctly manage nozzle placement history data and ensure data reliability are provided. In an electronic component mounting apparatus for mounting an electronic component on a board with an adsorption nozzle detachably placed on a mount head, a determination section 27 detects the presence or absence of the adsorption nozzle in the mount head based on the flow rate measurement result of a flow rate sensor 24, and an again-placing detection section 38 detects that the adsorption nozzle is once removed and then is again placed by a machine operator based on the nozzle presence/absence detection result.