Abstract: A semiconductor chip constituting an image pickup device is provided on a substrate and includes a connection terminal and an image pickup portion. A lens sheet having a lens portion is provided on the semiconductor chip. A groove is formed in at least the substrate to expose the connection terminal. A conductor pattern is formed in the groove and has one end electrically connected to the connection terminal.

Abstract: An image sensor is mounted on a substrate. A base is further formed on the substrate. The base has an opening above the image sensor. A filter is fixed to the opening of the base. The filter has a projecting dam member in a peripheral portion thereof. A lens barrel holding lenses is disposed on the filter.

Abstract: A compact camera module is disclosed that is capable of preventing adhesion of dust to an image pickup device in the compact camera module. The compact camera module includes a lens unit including a lens and a lens holder holding the lens therein and an image pickup unit attached to the lens unit. The image pickup unit includes a circuit board, an image pickup device on the circuit board, a cover member arranged on the circuit board to cover the image pickup device, and an optical filter arranged with respect to the cover member to face the image pickup device. The image pickup device is disposed in a substantially closed space formed by the circuit board, the cover member, and the optical filter. After the image pickup device is mounted on the circuit board, the image pickup device is disposed in the substantially closed space, and therefore, the compact camera module can be assembled with no occurrence of dust adhesion to the image pickup device.

Abstract: An image sensor is mounted on a substrate. A base is further formed on the substrate. The base has an opening above the image sensor. A filter is fixed to the opening of the base. The filter has a projecting dam member in a peripheral portion thereof. A lens barrel holding lenses is disposed on the filter.

Abstract: A semiconductor chip constituting an image pickup device is provided on a substrate and includes a connection terminal and an image pickup portion. A lens sheet having a lens portion is provided on the semiconductor chip. A groove is formed in at least the substrate to expose the connection terminal. A conductor pattern is formed in the groove and has one end electrically connected to the connection terminal.

Abstract: Multi-drive optical disk apparatus and a method and a label for easily confirming the respective performance characteristics for the different kinds of optical disks are provided. The respective performances, such as a data transfer rate are indicated by multiple-fold speed forms, respectively. The performance indication label is affixed on one surface of the optical disk drive. The performance indication label is constructed by arranging an indication for a data reading performance from a CD-ROM disk and a DVD-ROM disk, an indication for a data writing performance to a CD-RW disk, a DVD-RAM disk, a DVD-RW disk, a DVD-R disk, and a CD-R disk, and an indication for a data writing and reading performances to and from a DVD-RAM disk in a hypothetical circle.

Abstract: A mounting structure is disclosed that is capable of reliably installing a compact camera module into a socket while maintaining a good electrical connection between them. The mounting structure includes an electrode pad formed in a lower portion of the compact camera module, a contacting member having a contacting end and a springy portion disposed in the socket, and a depressed portion formed on the lower portion of the compact camera module to accommodate the springy portion of the contacting member so that the lower portion of the compact camera module does not make contact with the springy portion of the contacting member when the lower portion of the compact camera module is inserted into the socket. Therefore, the springy portion supplies a sufficiently large springy force to reliably bright the contacting end into contact with the electrode pad, and this maintains a good electrical connection between the contacting end and the electrode pad.

Abstract: A compact camera module is disclosed that is capable of preventing adhesion of dust to an image pickup device in the compact camera module. The compact camera module includes a lens unit including a lens and a lens holder holding the lens therein and an image pickup unit attached to the lens unit. The image pickup unit includes a circuit board, an image pickup device on the circuit board, a cover member arranged on the circuit board to cover the image pickup device, and an optical filter arranged with respect to the cover member to face the image pickup device. The image pickup device is disposed in a substantially closed space formed by the circuit board, the cover member, and the optical filter. After the image pickup device is mounted on the circuit board, the image pickup device is disposed in the substantially closed space, and therefore, the compact camera module can be assembled with no occurrence of dust adhesion to the image pickup device.

Abstract: Multi-drive optical disk apparatus and a method and a label for easily confirming the respective performance characteristics for the different kinds of optical disks are provided. The respective performances, such as a data transfer rate are indicated by multiple-fold speed forms, respectively. The performance indication label is affixed on one surface of the optical disk drive. The performance indication label is constructed by arranging an indication for a data reading performance from a CD-ROM disk and a DVD-ROM disk, an indication for a data writing performance to a CD-RW disk, a DVD-RAM disk, a DVD-RW disk, a DVD-R disk, and a CD-R disk, and an indication for a data writing and reading performances to and from a DVD-RAM disk in a hypothetical circle.