Abstract: As an electronic device cooling apparatus which allows refrigerant liquid to circulate and flow in a cooling system by using a pump so as to cool a heat generating portion of an electronic device, a heat generating portion cooling unit which is connected to the pump, which receives heat from the heat generating portion of the electronic device, and which releases the heat to the refrigerant liquid through a fin portion so as to cool the heat generating portion includes independently therein a first flow channel through which the refrigerant liquid discharged from a discharging port of the pump is drawn in to be guided to the outside of the heat generating portion cooling unit through the fin portion, and a second flow channel through which the refrigerant liquid cooled at the outside is drawn in to be guided towards a sucking port of the pump.

Abstract: An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.

Abstract: An electronic apparatus cooling device which cools an exothermic body by heat transfer of refrigerant, includes a heat receiving part having a base for receiving heat generated by the exothermic body, a pressure member with an opening, covering part of the base and being located opposite to the exothermic body, and a flow channel allowing the refrigerant to flow therein, a heat radiator for radiating heat absorbed by the refrigerant, and a pump for circulating the refrigerant between the heat receiving part and the heat radiator. In the flow channel of the heat receiving part, the refrigerant flows in through the opening of the pressure member and flows out from the periphery of the pressure member in places other than the opening.

Abstract: A compact, low-cost electronic apparatus cooling device which provides a high heat receiving performance with less transfer of the heat of an exothermic body to a pump. In the device, a heat receiving part has fins in a given area of a plate-like base and the height of the fins is almost equal to the thickness of the base which surrounds them. A pressure member with an opening covers part of the top of the fins and part of the base. Refrigerant flows in from part of the top of the fins in contact with the opening of the pressure member and flow out from part of the top of the fins not covered by the pressure member.

Abstract: In a liquid cooling system, comprising: a heat-receiving jacket for receiving heat from a heat-generation body therein; a heat-radiator for radiating the heat therefrom, which is received within the heat-receiving jacket; and a tank for accumulating refrigerant therein, which is connected with the heat-receiving jacket and the heat-radiator through flow passages, thereby enclosing a refrigerant within the heat-receiving jacket, the heat-radiator and the tank, including the flow passages provided therebetween, and further comprising: a liquid transfer means for generating a circulation flow of the refrigerant enclosed therein, wherein the tank is built up on one side surface of a substrate having superior heat-conductivity and heat-resistance, defined between a flexible film or sheet having superior heat-conductivity and heat-resistance, and the heat-radiator having a heat-radiation flow passage on the other side surface thereof, defined between the flexible film or sheet having superior heat-conductivity and

Abstract: As an electronic device cooling apparatus which allows refrigerant liquid to circulate and flow in a cooling system by using a pump so as to cool a heat generating portion of an electronic device, a heat generating portion cooling unit which is connected to the pump, which receives heat from the heat generating portion of the electronic device, and which releases the heat to the refrigerant liquid through a fin portion so as to cool the heat generating portion includes independently therein a first flow channel through which the refrigerant liquid discharged from a discharging port of the pump is drawn in to be guided to the outside of the heat generating portion cooling unit through the fin portion, and a second flow channel through which the refrigerant liquid cooled at the outside is drawn in to be guided towards a sucking port of the pump.

Abstract: An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.

Abstract: An electronic equipment is provided, which comprises a liquid-cooling system and a cooling fan as a cooling system, efficiently cools the liquid-cooling system, and reduces fan noise.

Abstract: A cooling device for an information equipment, comprises a heat receiving member composed of a base member thermally connected to a heat generating element, and a casing member, which are defined therebetween a closes space in which a coolant can flow, the base member is integrally incorporated with fins in a predetermined zone of its planar surface on the side remote from the heat generating element thermally connected to the base member, and the base member has a thickness which is thinner in the zone where the fins are formed than in the other zone where no fins are formed. With this configuration, the heat receiving member which can enhance the heat-exchanging performance of a liquid cooling system, can be manufactured at a low cost.

Abstract: A heat receiving jacket in a liquid cooling device for electronic equipment, for transferring a heat from a heating portion in the electronic equipment to liquid refrigerant, is composed of a fin piece having a base portion formed thereon with thin fins which rise up from one surface of the base portion, being curved, and a casing accommodating therein the fin piece in its center part so as to cause the liquid refrigerant to flow between the thin fins. Further, the cooling device includes a plurality of heat receiving jackets and a plurality of heat radiating portions which are alternately connected so as to constitute a passage for the liquid refrigerant, a part of the passage being connected with a circulation pump so as to constitute a closed circulation passage for the liquid refrigerant. With this configuration, it is possible to provide a liquid cooling device capable of decreasing the temperature rise of a heating element such as a CPU, having a high performance and being excellent in costs.

Abstract: A cooling module designed so that the following components are stacked above a CPU: a cooling jacket allowing a cooling liquid to absorb heat generated by the CPU, a pump causing the cooling liquid to circulate, a reserve tank used to provide a supplementary cooling liquid and to bleed air from the cooling liquid, and a first radiator that cools the cooling liquid, the cooling module being also designed so that a second radiator is located at a side of the first radiator to cool the cooling liquid, wherein the cooling liquid is driven by the pump so as to circulate from the cooling jacket, which absorbs heat generated by the CPU, through the radiators to the reserve tank.

Abstract: In a liquid cooling jacket, to improve the heat transfer coefficient, extensibility and assembling, the liquid cooling jacket comprises a base bonded to a heating element; a post standing perpendicularly to the base; a plurality of radiating fins attached to the post and arranged so as to be parallel to the base; a partition filling up intervals between the plurality of radiating fins at a predetermined width; and a case which surrounds the post and the radiating fins and is bonded to the base, and to which an inlet and an outlet for coolant are attached at positions where flow of the coolant is divided by the partition. The plurality of radiating fins may be arranged at intervals each of which is narrow in comparison with a thickness of each of the plurality of radiating fins. Therefore, because the coolant flow within the liquid cooling jacket ensures a plurality of passages, the passage resistance is low.

Abstract: A pump equipped with an impeller having a plurality of vanes is installed through a packing at an opening section formed on a wall surface of one of components in a liquid circulation passage, such as a radiator so that the impeller of the pump section may be disposed herein. Inside the component, there is provided a partition plate formed with a hole at such a position as to face the center of the impeller. A port is provided between a wall surface having the opening section and the partition plate. By the rotation of the impeller, a liquid flow is produced toward the port from the inside of the compartment through the hole.

Abstract: In a liquid cooling system, comprising: a heat-receiving jacket for receiving heat from a heat-generation body therein; a heat-radiator for radiating the heat therefrom, which is received within the heat-receiving jacket; and a tank for accumulating refrigerant therein, which is connected with the heat-receiving jacket and the heat-radiator through flow passages, thereby enclosing a refrigerant within the heat-receiving jacket, the heat-radiator and the tank, including the flow passages provided therebetween, and further comprising: a liquid transfer means for generating a circulation flow of the refrigerant enclosed therein, wherein the tank 14 is built up on one side surface of a substrate 15 having superior heat-conductivity and heat-resistance, defined between a flexible film or sheet 16 or 23 having superior heat-conductivity and heat-resistance, and the heat-radiator having a heat-radiation flow passage 9 on the other side surface thereof, defined between the flexible film or sheet 16 or 23 having super

Abstract: In a liquid cooling jacket, to improve the heat transfer coefficient, extensibility and assembling, the liquid cooling jacket comprises a base bonded to a heating element; a post standing perpendicularly to the base; a plurality of radiating fins attached to the post and arranged so as to be parallel to the base; a partition filling up intervals between the plurality of radiating fins at a predetermined width; and a case which surrounds the post and the radiating fins and is bonded to the base, and to which an inlet and an outlet for coolant are attached at positions where flow of the coolant is divided by the partition. The plurality of radiating fins may be arranged at intervals each of which is narrow in comparison with a thickness of each of the plurality of radiating fins. Therefore, because the coolant flow within the liquid cooling jacket ensures a plurality of passages, the passage resistance is low.

Abstract: A cooling module designed so that the following components are stacked above a CPU: a cooling jacket allowing a cooling liquid to absorb heat generated by the CPU, a pump causing the cooling liquid to circulate, a reserve tank used to provide a supplementary cooling liquid and to bleed air from the cooling liquid, and a first radiator that cools the cooling liquid, the cooling module being also designed so that a second radiator is located at a side of the first radiator to cool the cooling liquid, wherein the cooling liquid is driven by the pump so as to circulate from the cooling jacket, which absorbs heat generated by the CPU, through the radiators to the reserve tank.

Abstract: An electronic equipment is provided, which comprises a liquid-cooling system and a cooling fan as a cooling system, efficiently cools the liquid-cooling system, and reduces fan noise.

Abstract: In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.

Abstract: There is provided a technology for realizing an PCI expansion adapter for a PC card which is connectable to a desktop type personal computer PCI expansion connector using a low profile PCI. The PCI expansion adapter includes an expansion unit which is provided with an electrical connector to a PCI bus, a low profile PCI expansion board provided with a PC card control element and an electrical connector to the PC card, wherein the low profile PCI expansion board and the expansion unit are connected by the electrical connectors mounted on the respective boards.

Abstract: In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.