Patents by Inventor Hironori Sano

Hironori Sano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220311410
    Abstract: Aspects of this disclosure relate to bulk acoustic wave devices that have a raised frame structure, and filters that utilize the bulk acoustic wave devices. The raised frame structure can include a first raised frame layer that has a relatively low acoustic impedance. The raised frame structure can include a second raised frame layer that has a relatively high acoustic impedance. The first raised frame layer can extend inward further than the second raised frame layer. A width of the first raised frame layer that overlaps the first and second electrodes is between about 1.5 times to about 4 times larger than the combined thickness of the first electrode, the piezoelectric layer, and the second electrode.
    Type: Application
    Filed: March 24, 2022
    Publication date: September 29, 2022
    Inventors: Tomoya Komatsu, Yiliu Wang, Takashi Hayashi, Hironori Sano, Rei Goto, Kwang Jae Shin
  • Publication number: 20220311419
    Abstract: Aspects of this disclosure relate to bulk acoustic wave devices that have a raised frame structure, and filters that utilize the bulk acoustic wave devices. The raised frame structure can include a first raised frame layer that has a relatively low acoustic impedance. The raised frame structure can include a second raised frame layer that has a relatively high acoustic impedance. The first raised frame layer can extend inward further than the second raised frame layer. A width of the first raised frame layer that overlaps the first and second electrodes is between about 1.5 times to about 4 times larger than the combined thickness of the first electrode, the piezoelectric layer, and the second electrode.
    Type: Application
    Filed: March 24, 2022
    Publication date: September 29, 2022
    Inventors: Tomoya Komatsu, Yiliu Wang, Takashi Hayashi, Hironori Sano, Rei Goto, Kwang Jae Shin