Patents by Inventor Hironori Shizuhata
Hironori Shizuhata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9562179Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.Type: GrantFiled: September 29, 2015Date of Patent: February 7, 2017Assignee: Lintec CorporationInventors: Naoya Saiki, Isao Ichikawa, Hironori Shizuhata, Osamu Yamazaki
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Publication number: 20160017188Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.Type: ApplicationFiled: September 29, 2015Publication date: January 21, 2016Inventors: Naoya Saiki, Isao Ichikawa, Hironori Shizuhata, Osamu Yamazaki
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Patent number: 9184082Abstract: An adhesive composition including an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group and a thermosetting agent. Also provided is an adhesive sheet having an adhesive layer including the above-mentioned adhesive composition.Type: GrantFiled: November 27, 2007Date of Patent: November 10, 2015Assignee: Lintec CorporationInventors: Naoya Saiki, Isao Ichikawa, Hironori Shizuhata, Osamu Yamazaki
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Patent number: 8247503Abstract: The object of the present invention is to provide an adhesive composition which can form a thinner adhesive layer, which has good storage stability and which can actualize high package reliability even when exposed to severe reflow conditions in a semiconductor package in which a semiconductor chip being reduced in a thickness is mounted, and an adhesive sheet having an adhesive layer comprising the adhesive composition. The adhesive composition of the present invention comprises an epoxy thermosetting resin (A), a thermosetting agent (B) and a thermosetting accelerating agent (C); the thermosetting accelerating agent (C) being soluble in methyl ethyl ketone and inactive as a thermosetting accelerating agent at room temperature.Type: GrantFiled: December 23, 2008Date of Patent: August 21, 2012Assignee: Lintec CorporationInventors: Naoya Saiki, Hironori Shizuhata, Isao Ichikawa
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Patent number: 7851335Abstract: The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness. The adhesive composition of the present invention comprises: (A) an acrylic polymer; (B) an epoxy resin; (C) a thermosetting agent; and (D) a silicone compound having a specific side chain.Type: GrantFiled: March 31, 2009Date of Patent: December 14, 2010Assignee: Lintec CorporationInventors: Isao Ichikawa, Naoya Saiki, Hironori Shizuhata
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Patent number: 7842551Abstract: The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group. According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.Type: GrantFiled: May 23, 2007Date of Patent: November 30, 2010Assignee: Lintec CorporationInventors: Naoya Saiki, Isao Ichikawa, Hironori Shizuhata, Osamu Yamazaki
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Publication number: 20100090323Abstract: The present invention provides a spacer sheet for a complex type semiconductor device provided between the semiconductor packages of a complex type semiconductor device formed by laminating plural semiconductor packages, comprising through holes of an array corresponding to electrodes which can be provided onto a substrate of one semiconductor package and which are formed in order to connect and wire one semiconductor package with the other semiconductor package and a space part corresponding to a principal part of the above one semiconductor package mounted on the substrate or a principal part of the other semiconductor package opposed to the substrate and a production process for a complex type semiconductor device in which the above spacer sheet is used.Type: ApplicationFiled: October 22, 2007Publication date: April 15, 2010Applicant: Lintec CorporationInventors: Tomonori Shinoda, Hironori Shizuhata, Hirofumi Shinoda, Yuji Kawamata, Takeshi Tashima, Masato Shimamura, Masako Watanabe, Masazumi Amagai
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Patent number: 7674859Abstract: An adhesive sheet which can actualize a high package reliability wherein there is no separation at the adhesive interface and no package cracking, in a package in which a semiconductor chip being reduced in thickness is mounted under severe reflow conditions after exposure to a hot and humid environment. The adhesive sheet includes a base material and, formed thereon, an adhesive layer having an adhesive composition including an acrylic copolymer (A) containing 20 to 95% by weight of a structural unit derived from a benzyl (meth)acrylate, an epoxy thermosetting resin (B), and a thermosetting agent (C).Type: GrantFiled: June 24, 2008Date of Patent: March 9, 2010Assignee: Lintec CorporationInventors: Naoya Saiki, Isao Ichikawa, Hironori Shizuhata
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Publication number: 20100025837Abstract: The present invention relates to a complex type semiconductor device formed by laminating plural semiconductor packages, wherein it comprises: an upper semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on a lower surface in the upper semiconductor package and a principal part of the upper semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively upper part, a lower semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on an upper surface in the lower semiconductor package and a principal part of the lower semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively lower part, a spacer sheet which comprises a space part corresponding to the principal part of the upper semiconductor package and/or the principal part of thType: ApplicationFiled: October 22, 2007Publication date: February 4, 2010Applicant: LINTEC CORPORATIONInventors: Tomonori Shinoda, Hironori Shizuhata, Hirofumi Shinoda, Yuji Kawamata, Takeshi Tashima, Masato Shimamura, Masako Watanabe, Masazumi Amagai
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Publication number: 20090246915Abstract: The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness. The adhesive composition of the present invention comprises: (A) an acrylic polymer; (B) an epoxy resin; (C) a thermosetting agent; and (D) a silicone compound, wherein the silicone compound (D) has one kind of reactive organic functional group and a kinematic viscosity within a specific range.Type: ApplicationFiled: March 31, 2009Publication date: October 1, 2009Applicant: LINTEC CORPORATIONInventors: Isao Ichikawa, Naoya Saiki, Hironori Shizuhata
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Publication number: 20090246913Abstract: The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness. The adhesive composition of the present invention comprises: (A) an acrylic polymer; (B) an epoxy resin; (C) a thermosetting agent; and (D) a silicone compound having a specific side chain.Type: ApplicationFiled: March 31, 2009Publication date: October 1, 2009Applicant: LINTEC CORPORATIONInventors: Isao Ichikawa, Naoya Saiki, Hironori Shizuhata
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Publication number: 20090170284Abstract: The object of the present invention is to provide an adhesive composition which can form a thinner adhesive layer, which has good storage stability and which can actualize high package reliability even when exposed to severe reflow conditions in a semiconductor package in which a semiconductor chip being reduced in a thickness is mounted, and an adhesive sheet having an adhesive layer comprising the adhesive composition. The adhesive composition of the present invention comprises an epoxy thermosetting resin (A), a thermosetting agent (B) and a thermosetting accelerating agent (C); the thermosetting accelerating agent (C) being soluble in methyl ethyl ketone and inactive as a thermosetting accelerating agent at room temperature.Type: ApplicationFiled: December 23, 2008Publication date: July 2, 2009Applicant: LINTEC CORPORATIONInventors: Naoya Saiki, Hironori Shizuhata, Isao Ichikawa
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Publication number: 20090004829Abstract: An adhesive sheet which can actualize a high package reliability wherein there is no separation at the adhesive interface and no package cracking, in a package in which a semiconductor chip being reduced in thickness is mounted under severe reflow conditions after exposure to a hot and humid environment. The adhesive sheet includes a base material and, formed thereon, an adhesive layer having an adhesive composition including an acrylic copolymer (A) containing 20 to 95% by weight of a structural unit derived from a benzyl(meth)acrylate, an epoxy thermosetting resin (B), and a thermosetting agent (C).Type: ApplicationFiled: June 24, 2008Publication date: January 1, 2009Applicant: LINTEC CORPORATIONInventors: Naoya Saiki, Isao Ichikawa, Hironori Shizuhata
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Publication number: 20080242058Abstract: The adhesive composition according to the present invention is characterized by including an acrylic polymer, an epoxy resin having an epoxy equivalent of 180 g/eq or less and a thermosetting agent. According to the present invention, provided are an adhesive composition which can achieve a high package reliability in a package in which a semiconductor chip being reduced in a thickness is mounted even when exposed to severe reflow conditions, an adhesive sheet having an adhesive layer comprising the above adhesive composition and a production process for a semiconductor device using the above adhesive sheet.Type: ApplicationFiled: March 26, 2008Publication date: October 2, 2008Applicant: LINTEC CORPORATIONInventors: Isao Ichikawa, Naoya Saiki, Hironori Shizuhata
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Publication number: 20080124839Abstract: An adhesive composition is characterized by including an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer comprising the above adhesive composition and a production process for a semiconductor device using the above adhesive sheet are also provided.Type: ApplicationFiled: November 27, 2007Publication date: May 29, 2008Applicant: LINTEC CORPORATIONInventors: Naoya Saiki, Isao Ichikawa, Hironori Shizuhata, Osamu Yamazaki
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Publication number: 20070276079Abstract: The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group. According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.Type: ApplicationFiled: May 23, 2007Publication date: November 29, 2007Applicant: Lintec CorporationInventors: Naoya Saiki, Isao Ichikawa, Hironori Shizuhata, Osamu Yamazaki