Patents by Inventor Hironori Uno

Hironori Uno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing package lid member and method for manufacturing package
    Patent number: 11264534
    Abstract: A method for manufacturing a package lid member includes a metalizing step of forming a metalized layer on a surface of a glass member, a paste applying step of applying an Au—Sn paste on the metalized layer in a frame shape, a reflow step of heating the glass member to which the Au—Sn paste was applied after the paste applying step and reflowing the Au—Sn paste, and a cooling step of cooling the glass member after the reflow step to form an Au—Sn layer. The cooling step includes a holding step of holding the glass member in a temperature range of 150° C. or higher and 190° C. or lower for 2 minutes or longer.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: March 1, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Satoru Daido, Hironori Uno
  • Lid material for packages including reflowed gold-tin layers, and method for manufacturing package
    Patent number: 11158766
    Abstract: This lid material for packages is a lid material for packages which is bonded to a package substrate, and the lid material for packages includes: a glass member including a bonding portion provided in a planar frame shape and a light transmitting portion provided inside the bonding portion; one or more metallized layers formed in a frame shape at the bonding portion of the glass member; and one or more Au—Sn layers provided on the metallized layers and having a frame shape having a width of 250 ?m or less.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: October 26, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Satoru Daido, Hironori Uno
  • LID MATERIAL FOR PACKAGES, AND PACKAGE
    Publication number: 20210249567
    Abstract: This lid material for packages is a lid material for packages which is bonded to a package substrate, and the lid material for packages includes: a glass member including a bonding portion provided in a planar frame shape and a light transmitting portion provided inside the bonding portion; one or more metallized layers formed in a frame shape at the bonding portion of the glass member; and one or more Au—Sn layers provided on the metallized layers and having a frame shape having a width of 250 ?m or less.
    Type: Application
    Filed: October 9, 2019
    Publication date: August 12, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Satoru Daido, Hironori Uno
  • METHOD FOR MANUFACTURING PACKAGE LID MEMBER AND METHOD FOR MANUFACTURING PACKAGE
    Publication number: 20210249559
    Abstract: A method for manufacturing a package lid member includes a metalizing step of forming a metalized layer on a surface of a glass member, a paste applying step of applying an Au—Sn paste on the metalized layer in a frame shape, a reflow step of heating the glass member to which the Au—Sn paste was applied after the paste applying step and reflowing the Au—Sn paste, and a cooling step of cooling the glass member after the reflow step to form an Au—Sn layer. The cooling step includes a holding step of holding the glass member in a temperature range of 150° C. or higher and 190° C. or lower for 2 minutes or longer.
    Type: Application
    Filed: October 24, 2019
    Publication date: August 12, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Satoru Daido, Hironori Uno