Patents by Inventor Hironori Urasawa

Hironori Urasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of soldering semiconductor part and mounted structure of semiconductor part
    Patent number: 7199329
    Abstract: A semiconductor part 1 in which a metal terminal 2 is formed on its back surface and side surface is mounted so that only the back surface portion of the metal terminal 2 is in contact with a cream solder 3. When the side surface portion of the metal terminal 2 is irradiated with laser beams, the back surface portion of the metal terminal 2 is heated by thermal conduction from the side surface portion to the back surface portion of the metal terminal 2 and the cream solder 3 in contact with the back surface portion of the metal terminal 2 is melted, whereby soldering is performed.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: April 3, 2007
    Assignee: Niigata Seimitsu Co., Ltd.
    Inventors: Akihiro Mano, Yukihiro Ueno, Hironori Urasawa, Yuki Oishi, Tadashi Miyazaki
  • Circuit board transferring apparatus and method and solder ball mounting method
    Patent number: 6976616
    Abstract: By photographing pad forming faces of CSPs 400 to recognize a pad arrangement through image processing so as to transfer and position the CSPs 400 in accordance with the recognition result of the pad arrangement, even if pads 401 are formed in any arrangement state in the CSPs 400 to be transferred, the positional relation between the pads 401 included in the CSPs 400 is made to always accurately coincide with the positional region between a plurality of solder ball attracting nozzles of a solder ball mounting apparatus.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: December 20, 2005
    Assignee: Niigata Seimitsu Co., Ltd.
    Inventors: Akihiro Mano, Yukihiro Ueno, Hironori Urasawa, Akihiro Tanaka
  • CIRCUIT BOARD TRANSFERRING APPARATUS AND METHOD AND SOLDER BALL MOUNTING METHOD
    Publication number: 20050035182
    Abstract: By photographing pad forming faces of CSPs 400 to recognize a pad arrangement through image processing so as to transfer and position the CSPs 400 in accordance with the recognition result of the pad arrangement, even if pads 401 are formed in any arrangement state in the CSPs 400 to be transferred, the positional relation between the pads 401 included in the CSPs 400 is made to always accurately coincide with the positional region between a plurality of solder ball attracting nozzles of a solder ball mounting apparatus.
    Type: Application
    Filed: August 10, 2004
    Publication date: February 17, 2005
    Applicant: NIIGATA SEIMITSU CO., LTD.
    Inventors: Akihiro Mano, Yukihiro Ueno, Hironori Urasawa, Akihiro Tanaka
  • METHOD OF SOLDERING SEMICONDUCTOR PART AND MOUNTED STRUCTURE OF SEMICONDUCTOR PART
    Publication number: 20050035184
    Abstract: A semiconductor part 1 in which a metal terminal 2 is formed on its back surface and side surface is mounted so that only the back surface portion of the metal terminal 2 is in contact with a cream solder 3. When the side surface portion of the metal terminal 2 is irradiated with laser beams, the back surface portion of the metal terminal 2 is heated by thermal conduction from the side surface portion to the back surface portion of the metal terminal 2 and the cream solder 3 in contact with the back surface portion of the metal terminal 2 is melted, whereby soldering is performed.
    Type: Application
    Filed: August 10, 2004
    Publication date: February 17, 2005
    Applicant: NIIGATA SEIMITSU CO., LTD.
    Inventors: Akihiro Mano, Yukihiro Ueno, Hironori Urasawa, Yuki Oishi, Tadashi Miyazaki