Abstract: There is provided a gas supply device for vaporizing a raw material inside a raw material container and supplying a raw material gas into a processing vessel together with a carrier gas, including: a mass flow controller connected to an upstream side of the raw material container and configured to control a flow rate of the carrier gas; a flow meter connected to a downstream side of the raw material container; and a control part configured to perform a control so as not to supply the raw material gas into the processing vessel until a detection value of the flow meter with respect to the carrier gas controlled to have a constant flow rate by the mass flow controller is stabilized after replacing the raw material container.

Abstract: There is provided a gas supply method for temporarily storing a raw material gas generated by vaporizing a raw material accommodated in a raw material container inside a buffer tank together with a carrier gas and subsequently supplying the raw material gas into a processing container. The gas supply method includes: controlling a flow rate of a gas exhausted from the buffer tank and a flow rate of the raw material gas and the carrier gas filled in the buffer tank, so that a second internal pressure of the buffer tank becomes equal to a first internal pressure of the buffer tank when a process is performed by supplying the raw material gas into the processing container, before supplying the raw material gas into the processing container.

Abstract: A raw material gas supply apparatus includes a raw material container, a carrier gas inlet line and a raw material gas line. The raw material container is configured to accommodate the solid raw material. The carrier gas inlet line is configured to discharge the carrier gas to the raw material gas originated from the solid raw material. The raw material gas is transferred to the consumption area together with the carrier gas through the raw material gas line. A flow rate of the carrier gas is set such that a variation rate of a gas flow rate of the raw material gas flowing in the raw material gas line obtained by subtracting a gas flow rate in the carrier gas inlet line from a gas flow rate in the raw material gas line becomes 10% or less.

Abstract: In a raw material gas supply apparatus, a remaining amount of the raw material is calculated by subtracting, from an amount of the raw material filled in a new raw material, a cumulative consumption amount including a consumption amount of the raw material calculated based on an actual flow rate of the raw material gas obtained from an offset value, (m3?(m1+m2)), m1, m2 and m3 being respective measurement values of first and second mass controller, and a mass flow meter, obtained by supplying a carrier gas and a dilution gas in a state where the carrier gas flows through a bypass channel, and an actual flow rate measurement value of the raw material obtained by subtracting the offset value from a value of (m3?(m1+m2)) obtained by supplying the carrier gas and dilution gas in a state where the carrier gas flows through the inside of a raw material container.

Abstract: In a raw material gas supply apparatus, a control unit obtains an offset value of (m3?(m1+m2)), m1, m2 and m3 being respective measurement values of first and second mass controllers, and a mass flow meter, by supplying a carrier gas and a dilution gas in a state where the carrier gas flows through a bypass channel. Further, the control unit obtains an actual measurement value of a flow rate of the raw material by subtracting the offset value from (m3?(m1+m2)) obtained by supplying the carrier gas and dilution gas in a state where the carrier gas flows through the inside of a raw material container and calculating a difference between a target value of the flow rate of the raw material and the actual measurement value, and adjusts a set value of the first mass flow controller such that the flow rate of the raw material becomes.

Abstract: A gas supply apparatus is capable of intermittently supplying a source gas into a processing container via a buffer tank and a first high speed opening/closing valve. The gas supply apparatus includes: an evacuation line connected to a second side of the buffer tank and configured to evacuate the inside of the buffer tank; and a second high speed opening/closing valve provided on the evacuation line.

Abstract: There is provided a gas supply device for vaporizing a raw material inside a raw material container and supplying a raw material gas into a processing vessel together with a carrier gas, including: a mass flow controller connected to an upstream side of the raw material container and configured to control a flow rate of the carrier gas; a flow meter connected to a downstream side of the raw material container; and a control part configured to perform a control so as not to supply the raw material gas into the processing vessel until a detection value of the flow meter with respect to the carrier gas controlled to have a constant flow rate by the mass flow controller is stabilized after replacing the raw material container.

Abstract: A gas supply device for vaporizing a raw material inside a raw material container and supplying a raw material gas into a processing container together with a carrier gas, which includes: a buffer tank provided between the raw material container and the processing container; an Evac line for exhausting interiors of the buffer tank and the raw material container; a memory part that stores a first internal pressure of the buffer tank when a process is performed by supplying the raw material gas into the processing container; and a control part configured to control a flow rate of a gas exhausted to the Evac line and a flow rate of the raw material gas and the carrier gas filled in the buffer tank, so that a second internal pressure of the buffer tank becomes equal to the first internal pressure before supplying the raw material gas into the processing container.

Abstract: A trap mechanism is provided in the middle of an exhaust passage through which an exhaust gas, which is exhausted from a film formation device body that forms a thin film on the surface of a workpiece (W), flows, and recovers a gas to be collected that is contained in the exhaust gas by cooling and liquefying the gas to be collected. The trap mechanism includes: a housing having a gas inlet and a gas outlet; a partitioning member that partitions the inside of the housing into retention spaces; communication paths that communicate the retention spaces with one another; and cooling jackets that cool the communication paths to cool the exhaust gas. With this structure, the exhaust gas is adiabatically expanded while being cooled, and the gas to be collected is efficiently cooled and liquefied.

Abstract: In a raw material gas supply apparatus, a remaining amount of the raw material is calculated by subtracting, from an amount of the raw material filled in a new raw material, a cumulative consumption amount including a consumption amount of the raw material calculated based on an actual flow rate of the raw material gas obtained from an offset value, (m3?(m1+m2)), m1, m2 and m3 being respective measurement values of first and second mass controller, and a mass flow meter, obtained by supplying a carrier gas and a dilution gas in a state where the carrier gas flows through a bypass channel, and an actual flow rate measurement value of the raw material obtained by subtracting the offset value from a value of (m3?(m1+m2)) obtained by supplying the carrier gas and dilution gas in a state where the carrier gas flows through the inside of a raw material container.

Abstract: In a raw material gas supply apparatus, a control unit obtains an offset value of (m3?(m1+m2)), m1, m2 and m3 being respective measurement values of first and second mass controllers, and a mass flow meter, by supplying a carrier gas and a dilution gas in a state where the carrier gas flows through a bypass channel. Further, the control unit obtains an actual measurement value of a flow rate of the raw material by subtracting the offset value from (m3?(m1+m2)) obtained by supplying the carrier gas and dilution gas in a state where the carrier gas flows through the inside of a raw material container and calculating a difference between a target value of the flow rate of the raw material and the actual measurement value, and adjusts a set value of the first mass flow controller such that the flow rate of the raw material becomes.

Abstract: A raw material gas supply apparatus includes a raw material container, a carrier gas inlet line and a raw material gas line. The raw material container is configured to accommodate the solid raw material. The carrier gas inlet line is configured to discharge the carrier gas to the raw material gas originated from the solid raw material. The raw material gas is transferred to the consumption area together with the carrier gas through the raw material gas line. A flow rate of the carrier gas is set such that a variation rate of a gas flow rate of the raw material gas flowing in the raw material gas line obtained by subtracting a gas flow rate in the carrier gas inlet line from a gas flow rate in the raw material gas line becomes 10% or less.

Abstract: A trap mechanism is provided in the middle of an exhaust passage through which an exhaust gas, which is exhausted from a film formation device body that forms a thin film on the surface of a workpiece (W), flows, and recovers a gas to be collected that is contained in the exhaust gas by cooling and liquefying the gas to be collected. The trap mechanism includes: a housing having a gas inlet and a gas outlet; a partitioning member that partitions the inside of the housing into retention spaces; communication paths that communicate the retention spaces with one another; and cooling jackets that cool the communication paths to cool the exhaust gas. With this structure, the exhaust gas is adiabatically expanded while being cooled, and the gas to be collected is efficiently cooled and liquefied.

Abstract: Electronic equipment (3) has an electronic equipment main body (1) and an external device (2) attached to this electronic equipment main body (1). A first side face (21B) of a housing (21) for the external device (2) adjoins an exhaust port (112) of the electronic equipment main body (1). A first opening (211B) is formed on this first side face (21B). A second opening (211D) is formed on a third side face (21D) facing the first side face (21B). Because of the rotation of an exhaust fan (113) and the air exhausted from the exhaust port (112), negative pressure is generated near the first opening (211B), and air flows from the second opening (211D) to the first opening (211B).

Abstract: A receiver (2) includes tuner units (1) and (3), and a circuit board (21). The tuner unit (1) includes a connector (11), a tuner board (12), and a housing (13) for accommodating them. The tuner board (12) is positioned within the limit of a height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11). In addition, a recess (141B) is formed in the housing (13), in which the circuit board (21) disposed on the recess (141B) is also positioned within the limit of the height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11).

Abstract: A socket (333) of a connector (33) of an adapter (2) has a projecting portion (loose-fit portion) (333B) inserted into a hole (353A) of a base member (35) to support the connector (33) in loosely fitted manner. A diameter (L3) of the projecting portion (333B) is smaller than a diameter L4 of a hole (353A) of the base member (35). A length (L5) along an insertion direction into the hole (353A) is greater than a thickness of the connector attachment side (353). The connector (32) of the adapter (2) has an insertion portion (323) inserted into a cutout portion (353B) of the base member (35). A length (L8) of an extending direction of an insertion body (323A) of the insertion portion (323) is greater than the thickness (L9) of the connector attachment side, while its width (L6) is smaller than a width (L7) of the cutout portion (353B).

Abstract: A receiver (2) includes tuner units (1) and (3), and a circuit board (21). The tuner unit (1) includes a connector (11), a tuner board (12), and a housing (13) for accommodating them. The tuner board (12) is positioned within the limit of a height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11). In addition, a recess (141B) is formed in the housing (13), in which the circuit board (21) disposed on the recess (141B) is also positioned within the limit of the height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11).

Abstract: Electronic equipment (3) has an electronic equipment main body (1) and an external device (2) attached to this electronic equipment main body (1). A first side face (21B) of a housing (21) for the external device (2) adjoins an exhaust port (112) of the electronic equipment main body (1). A first opening (211B) is formed on this first side face (21B). A second opening (211D) is formed on a third side face (21D) facing the first side face (21B). Because of the rotation of an exhaust fan (113) and the air exhausted from the exhaust port (112), negative pressure is generated near the first opening (211B), and air flows from the second opening (211D) to the first opening (211B).

Abstract: A socket (333) of a connector (33) of an adapter (2) has a projecting portion (loose-fit portion) (333B) inserted into a hole (353A) of a base member (35) to support the connector (33) in loosely fitted manner. A diameter (L3) of the projecting portion (333B) is smaller than a diameter L4 of a hole (353A) of the base member (35). A length (L5) along an insertion direction into the hole (353A) is greater than a thickness of the connector attachment side (353). The connector (32) of the adapter (2) has an insertion portion (323) inserted into a cutout portion (353B) of the base member (35). A length (L8) of an extending direction of an insertion body (323A) of the insertion portion (323) is greater than the thickness (L9) of the connector attachment side, while its width (L6) is smaller than a width (L7) of the cutout portion (353B).

Abstract: A semiconductor wafer is mounted on a susceptor disposed in a processing chamber, the wafer is heated at a temperature on the order of 1000° C. for annealing, and a gas is supplied from a gas supply device disposed opposite to the wafer. When raising the temperature of the wafer and/or when lowering the temperature of the wafer, intra-surface temperature difference is limited to a small value to suppress the occurrence of slips. A gas supply device is divided into sections corresponding to a central part and a peripheral part, respectively, of the wafer to supply the gas at different flow rates onto the central part and the peripheral part, respectively. When raising the temperature of the wafer, for example, a gas of a temperature higher (lower) than that of the wafer is supplied at a flow rate per unit area greater (lower) than that at which the gas is supplied to the peripheral part to the central part.