Patents by Inventor Hironri Sasaki

Hironri Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7203391
    Abstract: An optical module 100 comprises a substrate 110 at which V-shaped groove 110a and 110b are formed through etching to extend along directions perpendicular to each other and a cube-type wavelength division multiplexer 150 that allows light to be transmitted or reflected on a 90° angle depending upon the wavelength of the light, lens elements 140a and 140b constituted of silicon, a light emitting element 120 that emits light to be directed to the outside via a lens element and the wavelength division multiplexer and a light receiving element 130 that receives incoming light from the outside via the wavelength division multiplexer and a lens element, all disposed on the substrate. The components, which contribute to miniaturization of the module, can be mounted all together on a single substrate and thus, the mass productivity is greatly improved and the module can be offered at a more affordable price.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: April 10, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Masahiro Uekawa, Takeshi Takamori, Hironri Sasaki
  • Publication number: 20060115207
    Abstract: An optical module 100 comprises a substrate 110 at which V-shaped groove 110a and 110b are formed through etching to extend along directions perpendicular to each other and a cube-type wavelength division multiplexer 150 that allows light to be transmitted or reflected on a 90° angle depending upon the wavelength of the light, lens elements 140a and 140b constituted of silicon, a light emitting element 120 that emits light to be directed to the outside via a lens element and the wavelength division multiplexer and a light receiving element 130 that receives incoming light from the outside via the wavelength division multiplexer and a lens element, all disposed on the substrate. The components, which contribute to miniaturization of the module, can be mounted all together on a single substrate and thus, the mass productivity is greatly improved and the module can be offered at a more affordable price.
    Type: Application
    Filed: November 14, 2005
    Publication date: June 1, 2006
    Applicant: Oki Electric Industry Co., Ltd.
    Inventors: Masahiro Uekawa, Takeshi Takamori, Hironri Sasaki