Patents by Inventor Hiroo H. Mahtani

Hiroo H. Mahtani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering of saddles to low expansion alloy heat pipes
    Patent number: 6810944
    Abstract: A heat pipe structure is provided for facilitating temperature stability of heat generating devices residing in a spacecraft. The heat generating structure comprises wall tubing made of a low thermal expansion alloy and a low thermal expansion saddle joined together and embedded into composite panel face sheets or face skins with minimal to no coefficient of thermal expansion (CTE) mismatch. The saddle to composite radiating panel interface employs an adhesive as the joining material. The saddle to heat pipe interface is joined together employing a higher conductivity joining media, such as tin-lead solder, which improves the thermal performance of the heat pipe assembly and minimize the temperature drop across the interface.
    Type: Grant
    Filed: January 30, 2003
    Date of Patent: November 2, 2004
    Assignee: Northrop Grumman Corporation
    Inventors: Chris R. Wiacek, Hiroo H. Mahtani
  • SOLDERING OF SADDLES TO LOW EXPANSION ALLOY HEAT PIPES
    Publication number: 20040149421
    Abstract: A heat pipe structure is provided for facilitating temperature stability of heat generating devices residing in a spacecraft. The heat generating structure comprises wall tubing made of a low thermal expansion alloy and a low thermal expansion saddle joined together and embedded into composite panel face sheets or face skins with minimal to no coefficient of thermal expansion (CTE) mismatch. The saddle to composite radiating panel interface employs an adhesive as the joining material. The saddle to heat pipe interface is joined together employing a higher conductivity joining media, such as tin-lead solder, which improves the thermal performance of the heat pipe assembly and minimize the temperature drop across the interface.
    Type: Application
    Filed: January 30, 2003
    Publication date: August 5, 2004
    Inventors: Chris R. Wiacek, Hiroo H. Mahtani