Abstract: The present invention provides a coating liquid for forming an insulation film, which has a small shrinkage in the calcination step in water vapor and is not likely to cause cracking of a resulting silica coating film or detachment thereof from a semiconductor substrate; an insulation film using the same; and a method of producing a compound used in the same. The coating liquid of comprises an inorganic polysilazane whose ratio of a peak area at 4.5 to 5.3 ppm attributed to SiH1 group and SiH2 group with respect to a peak area at 4.3 to 4.5 ppm attributed to SiH3 group in 1H-NMR spectrum is 4.2 to 50; and an organic solvent. The insulation film is obtained using the coating liquid.

Abstract: Disclosed is an inorganic polysilazane that undergoes less shrinkage during a calcination step in an oxidizing agent such as water vapor and is less prone to allow a silica film to suffer from the formation of cracks or peel off from a semiconductor substrate, and a silica film-forming coating liquid containing the inorganic polysilazane, and also provides an inorganic polysilazane and a silica film-forming coating liquid containing the same. The value of A/(B+C) is 0.9-1.5 and the value of (A+B)/C is 4.2-50. A=peak area within the range of from 4.75 ppm to less than 5.4 ppm. B=peak area within the range of from 4.5 ppm to less than 4.75 ppm. Peak area within the range of from 4.2 ppm to less than 4.5 ppm is represented by C in a 1H-NMR spectrum; and the polystyrene-equivalent mass average molecular weight is 2000 to 20000.

Abstract: The present invention provides a coating liquid for forming an insulation film, which has a small shrinkage in the calcination step in water vapor and is not likely to cause cracking of a resulting silica coating film or detachment thereof from a semiconductor substrate; an insulation film using the same; and a method of producing a compound used in the same. The coating liquid of comprises an inorganic polysilazane whose ratio of a peak area at 4.5 to 5.3 ppm attributed to SiH1 group and SiH2 group with respect to a peak area at 4.3 to 4.5 ppm attributed to SiH3 group in 1H-NMR spectrum is 4.2 to 50; and an organic solvent. The insulation film is obtained using the coating liquid.