Abstract: A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.

Abstract: A solid polymer electrolyte membrane and a catalytic layer are properly assembled even when the solid polymer electrolyte membrane and an ion exchange resin in the catalytic layer are formed of different materials. In a fuel cell, a solid polymer electrolyte membrane 20 is provided with a first solid polymer electrolyte membrane 200, and second solid polymer electrolyte membranes 202 and 204 provided at respective sides thereof. The second solid polymer electrolyte membranes 202 and 204 are formed of the same material as the ion exchange resin (not shown) included in a catalytic layer 26 and a catalytic layer 30.

Abstract: A solid polymer electrolyte membrane and a catalytic layer are properly assembled even when the solid polymer electrolyte membrane and an ion exchange resin in the catalytic layer are formed of different materials. In a fuel cell, a solid polymer electrolyte membrane 20 is provided with a first solid polymer electrolyte membrane 200, and second solid polymer electrolyte membranes 202 and 204 provided at respective sides thereof. The second solid polymer electrolyte membranes 202 and 204 are formed of the same material as the ion exchange resin (not shown) included in a catalytic layer 26 and a catalytic layer 30.

Abstract: There is provided a copper foil with an insulating adhesive which is excellent in that an insulating adhesive layer has low dieletric constant, low dieletric loss tangent and high adhering force at a normal temperature and a high temperature, and steps for manufacturing a multilayer printed circuit board can be shortened due to the presence of a copper foil on which a circuit can be formed by etching or the like. An insulating adhesive composition containing as an essential component an organic compound having at least two alkenyl groups having the reactivity with a SiH group in one molecule, and a silicon compound containing at least two SiH groups in one molecule and a copper foil are incorporated.

Abstract: A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.

Abstract: A novel heat-fusible copolymer possessing a combination of excellent properties, including mechanical strength, resistivity against radioactive rays, chemical resistance, low temperature stability, thermal resistance, processabilty, adhesiveness, thermal fusible adhesive stability, and simultaneously satisfying requirements relating to low hygroscopic characteristic and stable dielectric constant. Also, a powder, film, laminated film, laminated insulating material, and article, such as electronic modules and capacitors, made from a thermoplastic polyimide resin composed mainly of the copolymer and suitable for use as electronic components and materials for electronic circuit components. The copolymer possesses a glass transition temperature of 100.degree. C. to 250.degree. C., a hygroscopic degree of 1 or less, and a dielectric rate of 3 or less, and has the following formula: ##STR1## wherein Ar.sub.1 represents a quadrivalent organic radical, Ar.sub.

Abstract: The invention solves a problem of that sufficient adhesive intensity to satisfy recent demand for high adhesive property cannot be obtained by conventional surface treatment, and provides a method of improving adhesive property of polyimide film and achieving distinctly improved effect of adhesive property. The invention further provides novel polyimide film having improved adhesive property.

Abstract: The object of the invention is to solve a problem of bending of laminate caused by hardening contraction of epoxy resin that has been a subject in laminate used conventional epoxy resinous composition in laminate of two or more than two layers used for electric and electronic parts, and to provide a novel laminate obtaining excellent adhesive property and heat resistant property, and exhibiting no bending. The inventive laminate achieving the above object comprises laminating at least the following two components (a) and (b): (a) resin composition comprising thermosetting resin composed of imide carbonate synthesized by reacting cyanate resin and compound which containing at least 1 or more than 1 phenolic hydroxyl, and epoxy resin (b) heat resistant resin obtaining glass transition temperature of 150.degree. C. or more than 150.degree. C. and thermal expansion coefficient of 0.4 to 3.8.times.10.sup.-5 cm/cm/.degree.C. at the temperature of 20.degree. (ordinary temperature) to 150.degree. C.

Abstract: The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.

Abstract: The present invention provides an improved grade of polyimide containing an organic phosphorus compound, a film composed thereof and a method of making the aforementioned film. According to the present invention, it is possible to obtain a polyimide film improved in mechanical strength.

Abstract: Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.

Abstract: A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

Abstract: A process for producing a flexible printed circuit board comprising a metallic foil and a polyimide is provided, which comprises coating a metallic foil with a resin solution prepared by adding a tertiary amino compound to a solution of a polyamic acid (a polyimide precursor) represented by the following general formula (I): ##STR1## followed by the imidization thereof, the amount of said tertiary amino compound added to the solution being 10 to 50 parts by weight per 100 parts by weight of solid polyamic acid contained in said resin solution. According to the present invention, a flexible printed circuit board which is free from curling, wrinkling and warping, and which has excellent heat resistance, electrical characteristics and mechanical properties is provided with a simplified production process.

Abstract: The present invention provides a copolyimide characterized in that the copolyimide contains units represented by formulas (I) and (II) ##STR1## (wherein R.sub.0 represents an aromatic tetracarboxylic residue). The polyimide has excellent thermal dimensional stability, and can be fabricated by using conventional inexpensive materials.

Abstract: Disclosed is a film of polyimide having repeating units of formula (1) and a birefringence (.DELTA.n) of at least 0.13: ##STR1## wherein R.sup.1 is an aromatic group having a valency of 4, at carbon atoms constituting the aromatic ring, and R.sup.2 is an aromatic group having a valency of 2, at carbon atoms constituting the aromatic ring. This polyimide film exhibits good thermal dimensional stability.

Abstract: A process for manufacturing a polymer includes the first step of reacting a solution of one of two starting materials in an organic solvent with the other material in the form of a powder, and the second step of reacting a solution of the reaction product of the first step in an organic solvent with a solution of the other material in an organic solvent. The process preferably includes one or both of two additional steps, i.e. filtering the reaction product of the first step, and degassing the reaction product of the second step by stirring it at a reduced pressure. An apparatus for carrying out the process is also disclosed. This invention makes it possible to produce a polymer of high and uniform quality having a final viscosity controlled within a certain range and not containing foreign matter or bubbles.

Abstract: Disclosed is a process for continuously mixing two liquid components, whose one liquid component is a two-liquid curing type resin which comprises continuously supplying one liquid component under stirring into a mixing container and pouring the other liquid component into said container by pushing open a needle forcibly provided to a check valve, the improvement wherein said needle is pushed open with a non-curing liquid, thereafter, a curing liquid is poured into said mixing container. According to the present invention, when, for example, a polyamide acid and a curing agent are caused to mix and react with each other, a transparent polyimide mixed uniformly is obtained and high quality molded articles of polyimide are provided therefrom.

Abstract: A polyimide copolymer having a repeating unit of formula (I): ##STR1## wherein each of R.sub.1 and R.sub.2 is independently ##STR2## and R.sub.1 and R.sub.2 are different from each other, R.sub.0 is an aromatic group having a valency of 4, and m is a positive integer. The polyimide copolymer is excellent in heat resistance, mechanical properties (e.g., tensile elongation) and thermal dimensional stability.

Abstract: A new polyimide film which contains 30 to 800 ppm of titanium based on the weight of the film, and a process for producing a new polyimide film which comprises introducing an organic titanium compound substance into the film-forming polyimide resin prior to the casting step. This process enables one to control the film surface forming process and improve directly the adhesive properties of the film.

Abstract: A heat resistant resin composition comprising a, polyamide imide resin having carboxyl groups and modified with an N-methylolated methacryl- or acryl- amide compound and, when desired, further with a bismaleimide compound. The composition has improved properties over conventional polyamide imide resins. When the composition is used, for example, in the form of a film for printed circuit boards, the film has improved heat resistance and enhanced flexural strength and is capable of withstanding soldering baths at high temperatures.