Patents by Inventor Hirose Suzuki

Hirose Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932723
    Abstract: To provide 3,4-epoxycyclohexylmethyl methacrylate that is highly pure and that is useful as a raw material for functional materials or optical members having excellent transparency and heat resistance. An alicyclic epoxy compound product having a purity of 3,4-epoxycyclohexylmethyl methacrylate of 98.0 wt. % or greater and a total content of a compound represented by Formula (a) below and a compound represented by Formula (b) below of 1.3 wt. % or less. This alicyclic epoxy compound product preferably has a Hazen color number of 25 or less.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: March 19, 2024
    Assignee: DAICEL CORPORATION
    Inventors: Hirose Suzuki, Yoshito Nakai
  • Patent number: 11505640
    Abstract: Provided is an alicyclic epoxy compound product used in applications for forming a cured product excellent in heat resistance and transparency. The alicyclic epoxy compound product according to an embodiment of the present invention includes 3,4-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, a purity of which is of not less than 98.5 wt. %, and each content of a compound represented by Formula (a) below, a compound represented by Formula (b) below, a compound represented by Formula (c) below, and a compound represented by Formula (d) below is not greater than 0.5 wt. %.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: November 22, 2022
    Assignee: DAICEL CORPORATION
    Inventors: Hirose Suzuki, Yoshito Nakai
  • Publication number: 20220259372
    Abstract: Provided is a curable composition that forms a fiber-reinforced composite material having excellent heat resistance. The curable composition of the present disclosure includes a compound (1), a compound (2), and a Lewis acid catalyst, the compound (1) being represented by Formula (1), the compound (2) being represented by Formula (2), and the weight ratio of the content of the compound (1) to the content of the compound (2) is from 10/90 to 40/60. The Lewis acid catalyst is preferably a catalyst of a base and a Lewis acid, and particularly preferably is a complex formed by the Lewis acid and an amine. The Lewis acid is represented by Formula (3): MXn (3), where M represents a metal atom selected from B, Al, Fe, Sn, Si, Zn, and Ti, X represents a halogen atom, and n indicates an oxidation number of the metal atom.
    Type: Application
    Filed: July 14, 2020
    Publication date: August 18, 2022
    Applicant: DAICEL CORPORATION
    Inventors: Takuya OSAKA, Hirose SUZUKI
  • Publication number: 20220089808
    Abstract: To provide 3,4-epoxycyclohexylmethyl methacrylate that is highly pure and that is useful as a raw material for functional materials or optical members having excellent transparency and heat resistance. An alicyclic epoxy compound product having a purity of 3,4-epoxycyclohexylmethyl methacrylate of 98.0 wt. % or greater and a total content of a compound represented by Formula (a) below and a compound represented by Formula (b) below of 1.3 wt. % or less. This alicyclic epoxy compound product preferably has a Hazen color number of 25 or less.
    Type: Application
    Filed: December 24, 2019
    Publication date: March 24, 2022
    Applicant: DAICEL CORPORATION
    Inventors: Hirose SUZUKI, Yoshito NAKAI
  • Publication number: 20210189058
    Abstract: Provided is an alicyclic epoxy compound product used in applications for forming a cured product excellent in heat resistance and transparency. The alicyclic epoxy compound product according to an embodiment of the present invention includes 3,4-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, a purity of which is of not less than 98.5 wt. %, and each content of a compound represented by Formula (a) below, a compound represented by Formula (b) below, a compound represented by Formula (c) below, and a compound represented by Formula (d) below is not greater than 0.5 wt. %.
    Type: Application
    Filed: January 8, 2019
    Publication date: June 24, 2021
    Applicant: DAICEL CORPORATION
    Inventors: Hirose SUZUKI, Yoshito NAKAI
  • Publication number: 20150041846
    Abstract: Provided is a curable epoxy resin composition capable of forming a cured product that has heat resistance, light resistance, and thermal shock resistance at high levels and particularly offers excellent reflow resistance after moisture absorption. The curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by Formula (1), a curing agent (C), and a curing accelerator (D). The composition includes methylnorbornane-2,3-dicarboxylic anhydride as an essential component of the curing agent (C) and has a succinic anhydride content of 0.4 percent by weight or less based on the total amount of the curing agent (C): wherein R1 and R2 are identical or different and each represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.
    Type: Application
    Filed: March 21, 2013
    Publication date: February 12, 2015
    Applicant: DAICEL CORPORATION
    Inventor: Hirose Suzuki
  • Publication number: 20120321993
    Abstract: The process for producing a proton conductive polymer electrolyte membrane of the present invention includes the steps of: irradiating resin fine particles with radiation; graft-polymerizing a vinyl monomer having a sulfonic acid group precursor and a vinyl monomer having a carbonyl group equivalent with the resin fine particles in a solid-liquid two-phase system to obtain a finely particulate graft polymer; preparing a casting solution of a polymer having a phosphoric acid group or a phosphonic acid group and the graft polymer, and forming a cast membrane from this solution; drying the cast membrane to obtain a film; converting the sulfonic acid group precursor into a sulfonic acid group; and forming a crosslinked structure between the carbonyl group equivalents. In the solid-liquid two-phase system, a liquid phase includes the vinyl monomers and a solvent for the monomers, and a solid phase includes the resin fine particles.
    Type: Application
    Filed: November 16, 2011
    Publication date: December 20, 2012
    Applicants: JAPAN ATOMIC ENERGY AGENCY, NITTO DENKO CORPORATION
    Inventors: Hideyuki Emori, Hirose Suzuki, Masaharu Asano, Yasunari Maekawa