Patents by Inventor Hiroshi Akitomo

Hiroshi Akitomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10774240
    Abstract: A silicone rubber composition for textile coating is disclosed. The silicone rubber composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25° C. of from 100 to 1000000 mPa·s; (B) an organopolysiloxane represented by an average unit formula described herein; (C) a hydrosilylation catalyst; (D) a reinforcing silica fine powder; (E) an organotitanium compound and/or an organozirconium compound; and (F) an alkoxysilane having an epoxy group and/or an alkoxysilane having a methacryl group or an acryl group. The silicone rubber composition generally reduces formation and/or expansion of openings even when a large tension is applied to a textile coated with the silicone rubber composition. A silicone rubber-coated textile and method of formation are also disclosed.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: September 15, 2020
    Assignee: Dow Toray Co., Ltd.
    Inventors: Hiroshi Akitomo, Tsugio Nozoe
  • Publication number: 20190092969
    Abstract: A silicone rubber composition for textile coating is disclosed. The silicone rubber composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25° C. of from 100 to 1000000 mPa·s; (B) an organopolysiloxane represented by an average unit formula described herein; (C) a hydrosilylation catalyst; (D) a reinforcing silica fine powder; (E) an organotitanium compound and/or an organozirconium compound; and (F) an alkoxysilane having an epoxy group and/or an alkoxysilane having a methacryl group or an acryl group. The silicone rubber composition generally reduces formation and/or expansion of openings even when a large tension is applied to a textile coated with the silicone rubber composition. A silicone rubber-coated textile and method of formation are also disclosed.
    Type: Application
    Filed: February 28, 2017
    Publication date: March 28, 2019
    Applicant: Dow Corning Toray Co., Ltd.
    Inventors: Hiroshi AKITOMO, Tsugio NOZOE
  • Publication number: 20150228372
    Abstract: A conductive sponge-forming liquid silicone rubber composition comprises: (A) an alkenyl group-containing polydiorganosiloxane; (B) a polyorganosiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a conductive filler; (D) a mixture of water and an inorganic thickener; (E) an emulsifier; (F) a hydrosilylation reaction catalyst; and (G) a curing retarder. A conductive silicone sponge can be obtained by crosslinking and curing the conductive sponge-forming liquid silicone rubber. The conductive silicone rubber sponge generally has fine, uniform continuous porosity and electrical resistance with low voltage dependence.
    Type: Application
    Filed: September 4, 2013
    Publication date: August 13, 2015
    Applicant: DOW CORNING TORAY CO., LTD.
    Inventors: Hiroshi Akitomo, Masakazu Irie, Hidetoshi Kurusu
  • Patent number: 8859693
    Abstract: A curable silicone composition comprises (A) (A-1) a dialkylpolysiloxane that has at least two alkenyl groups in each molecule and a viscosity of at least 1,000 mPa·s to not more than 50,000 mPa·s and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R12R2SiO1/2 unit, and R13SiO1/2 unit wherein R1 is alkyl and R2 is alkenyl and that contains the alkenyl group in the range from at least 0.5 mass % to less than 3.5 mass %; (B) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms; and (C) a hydrosilylation reaction catalyst. The curable composition provides a highly transparent cured silicone material that has a hardness in the range from at least 30 to not more than 80, a parallel light transmittance at 25° C. of at least 90%, and a parallel light transmittance at 200° C. that is at least 99% of the parallel light transmittance at 25° C.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: October 14, 2014
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Chiichiro Hasegawa, Makoto Yoshitake, Hiroshi Akitomo
  • Patent number: 8853332
    Abstract: A curable silicone composition comprises (A) (A-1) an alkenyl-containing dialkylpolysiloxane and a viscosity of at least 1,000 mPa·s to not more than 20,000 mPa·s and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R12R2SiO1/2 unit, and R13SiO1/2 unit wherein R1 is alkyl and R2 is alkenyl, that contains from 2.5 to 5.0 mass % alkenyl group, and that has a ratio for the total number of moles of R12R2SiO1/2 and R13SiO1/2 units to 1 mole of the SiO4/2 unit in the range from 0.70 to 1.10; (B) an organopolysiloxane that contains at least 0.9 mass % silicon-bonded hydrogen; and (C) a hydrosilylation reaction catalyst. The curable composition provides a bending-tolerant and highly transparent cured silicone material that has a hardness in the range from 80 to 95, and a parallel light transmittance at 200° C. of a value that is at least 99% of the parallel light transmittance at 25° C.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: October 7, 2014
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Chiichiro Hasegawa, Makoto Yoshitake, Hiroshi Akitomo
  • Patent number: 8691910
    Abstract: A curable silicone composition comprising: an alkenyl-containing organopolysiloxane (A) that contains: a dialkylpolysiloxane (A-1) having on average at least 2 alkenyl groups in one molecule having a 25° C. viscosity in the range of 5,000 to 35,000 mPa·s, and a alkenyl-containing organopolysiloxane resin (A-2) consisting of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units (where R1 designates alkyl groups with 1 to 10 carbon atoms, and R2 designates alkenyl groups) with the content of alkenyl groups ranging from 3.5 to 5.0 mass %, and with the ratio of the sum of the mole numbers of the R12R2SiO1/2 units and R13SiO1/2 units to 1 mole of the SiO4/2 units in the range from 0.5 to 1.4; an organopolysiloxane (B), wherein silicon-bonded hydrogen atoms are in an amount of at least 0.7 mass %; and a hydrosilylation catalyst (C). The composition is capable of forming a flex-resistant highly transparent cured silicone product with non-tacky surface.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: April 8, 2014
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Chiichiro Hasegawa, Makoto Yoshitake, Hiroshi Akitomo
  • Publication number: 20110294950
    Abstract: A curable silicone composition comprises (A) (A-1) a dialkylpolysiloxane that has at least two alkenyl groups in each molecule and a viscosity of at least 1,000 mPa·s to not more than 50,000 mPa·s and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R12R2SiO1/2 unit, and R13SiO1/2 unit wherein R1 is alkyl and R2 is alkenyl and that contains the alkenyl group in the range from at least 0.5 mass % to less than 3.5 mass %; (B) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms; and (C) a hydrosilylation reaction catalyst. The curable composition provides a highly transparent cured silicone material that has a hardness in the range from at least 30 to not more than 80, a parallel light transmittance at 25° C. of at least 90%, and a parallel light transmittance at 200° C. that is at least 99% of the parallel light transmittance at 25° C.
    Type: Application
    Filed: January 29, 2010
    Publication date: December 1, 2011
    Inventors: Chiichiro Hasegawa, Makoto Yoshtake, Hiroshi Akitomo
  • Publication number: 20110288246
    Abstract: A curable silicone composition comprises (A) (A-1) an alkenyl-containing dialkylpolysiloxane and a viscosity of at least 1,000 mPa·s to not more than 20,000 mPa·s and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R12R2SiO1/2 unit, and R13SiO1/2 unit wherein R1 is alkyl and R2 is alkenyl, that contains from 2.5 to 5.0 mass % alkenyl group, and that has a ratio for the total number of moles of R12R2SiO1/2 and R13SiO1/2 units to 1 mole of the SiO4/2 unit in the range from 0.70 to 1.10; (B) an organopolysiloxane that contains at least 0.9 mass % silicon-bonded hydrogen; and (C) a hydrosilylation reaction catalyst. The curable composition provides a bending-tolerant and highly transparent cured silicone material that has a hardness in the range from 80 to 95, and a parallel light transmittance at 200° C. of a value that is at least 99% of the parallel light transmittance at 25° C.
    Type: Application
    Filed: January 29, 2010
    Publication date: November 24, 2011
    Inventors: Chiichiro Hasegawa, Makoto Yoshitake, Hiroshi Akitomo
  • Publication number: 20110077344
    Abstract: A curable silicone composition comprising: an alkenyl-containing organopolysiloxane (A) that contains: a dialkylpolysiloxane (A-1) having on average at least 2 alkenyl groups in one molecule having a 25° C. viscosity in the range of 5,000 to 35,000 mPa·s, and a alkenyl-containing organopolysiloxane resin (A-2) consisting of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units (where R1 designates alkyl groups with 1 to 10 carbon atoms, and R2 designates alkenyl groups) with the content of alkenyl groups ranging from 3.5 to 5.0 mass %, and with the ratio of the sum of the mole numbers of the R12R2SiO1/2 units and R13SiO1/2 units to 1 mole of the SiO4/2 units in the range from 0.5 to 1.4; an organopolysiloxane (B), wherein silicon-bonded hydrogen atoms are in an amount of at least 0.7 mass %; and a hydrosilylation catalyst (C). The composition is capable of forming a flex-resistant highly transparent cured silicone product with non-tacky surface.
    Type: Application
    Filed: July 30, 2008
    Publication date: March 31, 2011
    Inventors: Chiichiro Hasegawa, Makoto Yoshitake, Hiroshi Akitomo
  • Patent number: 7347835
    Abstract: The present invention provides a production process for obtaining a pad base for endermism capable of administering a drug in the skin without vibration. One side end of a thin metal wire is immersed in a solution containing a synthetic resin raw material in a lengthwise direction, the synthetic resin raw material solution adheres to a periphery of the thin metal wire, the synthetic resin raw material solution is hardened and then the thin metal wire is pulled out. The resulting minute needle is a hollow tubular body and the outer wall thereof is thickened toward the bottom. The minute needle is installed upright on the skin side of a patch base, and a drug in the hollow portion of the minute needle is injected in the skin and can be provided for endermism.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: March 25, 2008
    Assignee: Medrx Co., Ltd.
    Inventors: Shinya Maenosono, Yasushi Suzuki, Hiroshi Akitomo, Hidetoshi Hamamoto, Masaki Ishibashi
  • Publication number: 20070100072
    Abstract: A silicone rubber composition exhibiting superior adhesive properties with respect to organic resins it comes into contact with during its cure, while at the same time possessing superior mold release properties with respect to metal dies used for its molding, contains: (A) a polyorganosiloxane having at least two silicon-bonded alkenyl groups per molecule; (B) a polyorganosiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) an alkylene glycol ester of diacrylic acid or an alkylene glycol ester of dimethacrylic acid having the formula (1), wherein R1 is hydrogen or a methyl group, R2 represents an alkylene group, and n has a value of 1-10; and (D) a platinum catalyst.
    Type: Application
    Filed: July 19, 2004
    Publication date: May 3, 2007
    Inventors: Hiroshi Akitomo, Richard Cole, Michael Lutz, Stephen Swanson, Hyung Yang
  • Publication number: 20060163215
    Abstract: According to a conventional MicroPatch method, a drug is administrated by stinging the skin with a solid-core needle, and broadening a gap between the needle and the skin by vibration with a vibrator. Consequently, the object of the present invention is to provide a pad base for endermism capable of administrating a drug in the skin without vibration, and to provide a production process capable of easily obtaining the pad base. One side end of the thin metal wire is immersed in a solution containing a synthetic resin raw material in a lengthwise direction, the synthetic resin raw material solution adheres to a periphery of the thin metal wire, the synthetic resin raw material solution is hardened and then the thin metal wire is pulled out. There is obtained the minute needle 1 which is installed upright on the skin side of a patch base 2, wherein the minute needle is a hollow tubular body and the outer wall thereof is thickened toward the bottom.
    Type: Application
    Filed: June 10, 2004
    Publication date: July 27, 2006
    Inventors: Shinya Maenosono, Yasushi Suzuki, Hiroshi Akitomo, Hidetoshi Hamamoto, Masaki Ishibashi
  • Publication number: 20060127465
    Abstract: The object of the present invention is to provide a pad base for endermism which hardly causes bad influence on organism even if a needle fractures in the skin and remains in the MicroPatch method. It is the pad base for endermism in which a minute needle 1 is installed upright on the skin side of a patch base 2 for skin. The minute needle 1 is formed from a biodegradable resin and is composed so as to be able to be injected an administering drug in a hollow center of an axle portion (a hollow portion 3). Even if the injection needle fractures and remains in the skin, the minute needle 1 is decomposed in vivo because it is made of a biodegradable resin; therefore, there is little bad influence is to organism.
    Type: Application
    Filed: June 10, 2004
    Publication date: June 15, 2006
    Inventors: Shinya Maenosono, Yasushi Suzuki, Hiroshi Akitomo, Hidetoshi Hamamoto, Masaki Ishibashi
  • Patent number: 5861449
    Abstract: The introduction of a clay-like organopolysiloxane composition that is highly qualified for application as a clay-like material for manual arts and crafts and handicrafts (children's modelling clay, handicraft clay, etc.) and that does not deteriorate with time, is highly workable, is freely deformable by the application of low stresses, and, once formed, can preserve its shape while in the quiescent state.
    Type: Grant
    Filed: May 12, 1993
    Date of Patent: January 19, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroshi Akitomo, Tsugio Nozoe
  • Patent number: 5391336
    Abstract: A method for fabricating foam gaskets is characterized in that during the separate transport and subsequent mixing in an enclosed chamber of the base and curing agent portions of a two part foamable and curable organosiloxane composition an inert gas is injected in the amount of from 1 to 50 mL per 100 g of the total curable organosiloxane composition. The gas is injected into either the base portion, the curing agent or during or immediately after mixing of the two portions, and the resultant foamable composition is then extruded from a nozzle onto the seal region of the substrate and cured while foaming.
    Type: Grant
    Filed: December 23, 1993
    Date of Patent: February 21, 1995
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroshi Akitomo, Tsugio Nozoe, Hideo Shinmi
  • Patent number: 5153244
    Abstract: The compression set values of elastomers prepared from organosiloxane compositions that cure by a platinum-catalyzed hydrosilylation reaction are substantially reduced by the presence in said compositions of a phthalocyanine compound or a metal derivative of such a compound, where the metal is copper, nickel, cobalt or iron.
    Type: Grant
    Filed: October 19, 1990
    Date of Patent: October 6, 1992
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Hiroshi Akitomo, Akito Nakamura