Patents by Inventor Hiroshi Akutsu

Hiroshi Akutsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder ball container
    Patent number: 6352153
    Abstract: A cylindrical container with a bottom has an opening in which a projection is installed, the projection having a shape which will not deform solder balls when inserted into a packed layer of solder balls within the container. Its shape is such that its cross section has a streamlined or inverted conical shape, or it is cylindrical with a tip having a semi-spherical or inverted conical shape. Blackening, electrical charging, and deformation of solder balls packed in the container can be prevented during transport.
    Type: Grant
    Filed: March 23, 2000
    Date of Patent: March 5, 2002
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Fumio Ohashi, Takashi Hori, Michio Iguchi, Hiroshi Akutsu, Takashi Narita, Takeshi Nikaido