Patents by Inventor Hiroshi AMIOKA

Hiroshi AMIOKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240025111
    Abstract: A manufacturing method of a three-dimensional object includes: a solidified layer forming step of repeating a material layer forming step and a solidification step and laminating a solidified layer; a manufacturing condition setting step of setting an irradiation condition and a division width; an irradiation area determining step of determining an irradiation area for each divided layer obtained by dividing a three-dimensional shape; a dividing step of dividing the irradiation area by the division width along a division direction and forming a divided area; and a scan line setting step of setting a raster scan line within the divided area. A laser beam is scanned along a scan path including the raster scan line. A direction obtained by horizontally rotating the division direction of the irradiation area in a target divided layer is taken as the division direction in the divided layer directly above the target divided layer.
    Type: Application
    Filed: July 10, 2023
    Publication date: January 25, 2024
    Applicant: Sodick Co., Ltd.
    Inventor: Hiroshi AMIOKA
  • Patent number: 11806786
    Abstract: A stress controlled layer is constituted to include a compressive stress applied part that is a region to which a compressive stress is applied and a compressive stress non-applied part that is a region different from the compressive stress applied part. In a solidifying step, scanning of a laser beam or an electron beam is performed while a scanning direction for the compressive stress applied part is different from a scanning direction for the compressive stress non-applied part such that the compressive stress applied part expands further than the compressive stress non-applied part or the compressive stress non-applied part shrinks compared with the compressive stress applied part based on a relationship between the scanning direction and an expansion quantity or a shrinkage quantity at a time of temperature change or at a time of heat treatment.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: November 7, 2023
    Assignee: Sodick Co., Ltd.
    Inventors: Ichiro Araie, Toshio Kaji, Tatsuro Hayakawa, Hiroshi Amioka, Atsushi Hirota
  • Publication number: 20220395908
    Abstract: A stress controlled layer is constituted to include a compressive stress applied part that is a region to which a compressive stress is applied and a compressive stress non-applied part that is a region different from the compressive stress applied part. In a solidifying step, scanning of a laser beam or an electron beam is performed while a scanning direction for the compressive stress applied part is different from a scanning direction for the compressive stress non-applied part such that the compressive stress applied part expands further than the compressive stress non-applied part or the compressive stress non-applied part shrinks compared with the compressive stress applied part based on a relationship between the scanning direction and an expansion quantity or a shrinkage quantity at a time of temperature change or at a time of heat treatment.
    Type: Application
    Filed: June 6, 2022
    Publication date: December 15, 2022
    Applicant: Sodick Co., Ltd.
    Inventors: Ichiro ARAIE, Toshio KAJI, Tatsuro HAYAKAWA, Hiroshi AMIOKA, Atsushi HIROTA
  • Patent number: 11014164
    Abstract: A lamination molding apparatus, includes a material layer former to form a material layer; a first emitter to form a solidified layer by irradiating the material layer with a first beam; and a thermal adjuster to adjust a temperature of at least a portion of the solidified layer to at least one of a predetermined first temperature and a predetermined second temperature. The temperature of at least the portion of the solidified layer is adjusted to the first temperature, and then to the second temperature. When the first temperature is referred to as T1, the second temperature is referred to as T2, a martensite start temperature of the solidified layer is referred to as Ms, and a martensite finish temperature of the solidified layer is referred to as Mf, all of the following relations of T1?Mf, T1>T2, and T2?Ms are satisfied.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: May 25, 2021
    Assignee: Sodick Co., Ltd.
    Inventors: Ichiro Araie, Kazufumi Nambu, Atsushi Hirota, Hiroshi Amioka, Shuji Okazaki
  • Publication number: 20190061001
    Abstract: A lamination molding apparatus, includes a material layer former to form a material layer; a first emitter to form a solidified layer by irradiating the material layer with a first beam; and a thermal adjuster to adjust a temperature of at least a portion of the solidified layer to at least one of a predetermined first temperature and a predetermined second temperature. The temperature of at least the portion of the solidified layer is adjusted to the first temperature, and then to the second temperature. When the first temperature is referred to as T1, the second temperature is referred to as T2, a martensite start temperature of the solidified layer is referred to as Ms, and a martensite finish temperature of the solidified layer is referred to as Mf, all of the following relations of T1?Mf, T1>T2, and T2?Ms are satisfied.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 28, 2019
    Applicant: Sodick Co., Ltd.
    Inventors: Ichiro ARAIE, Kazufumi NAMBU, Atsushi HIROTA, Hiroshi AMIOKA, Shuji OKAZAKI