Patents by Inventor Hiroshi Arii

Hiroshi Arii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4204246
    Abstract: In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.
    Type: Grant
    Filed: May 8, 1978
    Date of Patent: May 20, 1980
    Assignee: Sony Corporation
    Inventors: Hiroshi Arii, Hirohito Kawada, Takashi Yoshida, Chiaki Nonaka
  • Patent number: 4120019
    Abstract: In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.
    Type: Grant
    Filed: February 7, 1977
    Date of Patent: October 10, 1978
    Assignee: Sony Corporation
    Inventors: Hiroshi Arii, Hirohito Kawada, Takashi Yoshida, Chiaki Nonaka