Abstract: A magnetoresistance effect element having a free magnetic layer is provided. The free magnetic layer is formed in a laminate including a fixed magnetization layer having a fixed magnetization direction, a non-magnetic layer formed on the fixed magnetization layer, a first ferromagnetic layer, a non-magnetic metallic layer formed on the first ferromagnetic layer, and a second ferromagnetic layer formed on the non-magnetic metallic layer. The free magnetic layer includes magnetic recording regions, and in each region, the first ferromagnetic layer and the second ferromagnetic layer are coupled such that their magnetization directions are anti-parallel with each other, and one of the magnetic recording regions is opposite to the fixed magnetization layer with the non-magnetic layer therebetween.

Abstract: The magnetoresistive effect element comprises a pinned magnetic layer 16 having a multilayered synthetic antiferromagnet (SAF) structure, a nonmagnetic spacer layer 18 formed on the pinned magnetic layer 16, a free magnetic layer 20 formed on the nonmagnetic spacer layer 18 and formed of a single ferromagnetic layer, a nonmagnetic spacer layer 22 formed on the free magnetic layer 20, and a pinned magnetic layer 24 of a multilayered SAF structure formed on the nonmagnetic spacer layer 22, wherein a magnetization direction of the ferromagnetic layer 16c of the pinned magnetic layer 16, which is nearest the free magnetic layer 20, and a magnetization direction of the ferromagnetic layer 24a of the pinned magnetic layer 24, which is nearest the free magnetic layer 20, are opposite to each other.

Abstract: The magnetic memory device comprises a recording layer 70 formed linearly over a substrate 10 and having a plurality of pinning sites 52 for restricting the motion of domain walls 50 formed at a prescribed pitch and having the regions between the plural pinning sites 52 as recording bits 72. The recording layer 70 includes a first recording layer portion 46 and a second recording layer portion 68, and the second recording layer portion 68 is positioned above the first recording layer portion 46 and has one end connected to one end of the first recording layer portion 46. The second recording layer portion 68 is formed above the first recording layer portion 46, and the end of the second recording layer portion 68 is connected to one end of the first recording layer portion 46, whereby the space required to form the recording layer 70 can be small.

Abstract: An electrode, an antiferromagnetic film, a ferromagnetic film, a nonmagnetic film, a ferromagnetic film, a tunnel insulating film, a ferromagnetic film, a first Ta film, a Ru film, and a second Ta film are formed in sequence on a substrate. The thickness of the second Ta film is about 0.5 nm. The second Ta film is naturally oxidized after being formed. Then, heat treatment to improve the characteristic of a TMR film is performed. The temperature of this heat treatment is approximately from 200° C. to 300° C. In a conventional manufacturing method, film peeling occurs in this heat treatment, and accompanying this, defects such as occurrence of holes and wrinkles further occur, but in the present method, such an occurrence of defects is prevented since the Ta film is formed at the uppermost surface. Subsequently, the Ta film and so on are patterned.

Abstract: The magnetic memory device includes a magnetic shield film 48, and a magnetoresistive effect element 62 formed over the magnetic shield film 48 and including a magnetic layer 52, a non-magnetic layer 54 and a magnetic layer 56, in which a magnetization direction of the first magnetic layer or the second magnetic layer is reversed by spin injection, and a second magnetic shield film 68 formed over the side wall of the magnetoresistive effect element 62. Thus, the arrival of the leakage magnetic field from the interconnection near the magnetoresistive effect element 62 can be effectively prevented.

Abstract: The magnetic memory device comprises a magnetoresistive effect element 54 including a magnetic layer 42 having a magnetization direction pinned in a first direction, a non-magnetic layer 50 formed on the magnetic layer 42, and a magnetic layer 52 formed on the non-magnetic layer 50 and having a first magnetic domain magnetized in a first direction and a second magnetic domain magnetized in a second direction opposite to the first direction; and a write current applying circuit for flowing a write current in the second magnetic layer 52 in the first direction or the second direction to shift a magnetic domain wall between the first magnetic domain and the second magnetic domain to control a magnetization direction of a part of the magnetic layer 52, opposed to the magnetic layer 42.

Abstract: The magnetoresistive effect element comprises a pinned magnetic layer 16 having a multilayered synthetic antiferromagnet (SAF) structure, a nonmagnetic spacer layer 18 formed on the pinned magnetic layer 16, a free magnetic layer 20 formed on the nonmagnetic spacer layer 18 and formed of a single ferromagnetic layer, a nonmagnetic spacer layer 22 formed on the free magnetic layer 20, and a pinned magnetic layer 24 of a multilayered SAF structure formed on the nonmagnetic spacer layer 22, wherein a magnetization direction of the ferromagnetic layer 16c of the pinned magnetic layer 16, which is nearest the free magnetic layer 20, and a magnetization direction of the ferromagnetic layer 24a of the pinned magnetic layer 24, which is nearest the free magnetic layer 20, are opposite to each other.

Abstract: A ferromagnetic tunnel junction is disclosed. The ferromagnetic tunnel junction includes a pinned magnetic layer, a tunnel insulating film formed on the pinned magnetic layer, and a free magnetic multilayer body formed on the tunnel insulating film. The free magnetic multilayer body includes a first free magnetic layer, a diffusion barrier layer, and a second free magnetic layer stacked in this order on the tunnel insulating film. The first free magnetic layer and the second free magnetic layer are ferromagnetically coupled with each other. The diffusion barrier layer inhibits the additive element contained in the first free magnetic layer from diffusing into the second free magnetic layer.

Abstract: The magnetoresistive effect element comprises a first ferromagnetic layer 50, a nonmagnetic layer 52 formed on the first ferromagnetic layer 50, a second ferromagnetic layer 54 formed on the nonmagnetic layer 52, and a sidewall insulating film 64 formed on the side wall of the second ferromagnetic layer 54. The end of the first ferromagnetic layer 50 is aligned with the end of the sidewall insulating film 64. Whereby the disalignment between the first ferromagnetic layer and the second ferromagnetic layer can be prevented.

Abstract: A semiconductor manufacturing apparatus includes: a disk-shaped holding part for holding a semiconductor substrate with its fist surface; a rotation shaft having an end placed at a second surface of the holding part; a rotatable terminal provided at the other end of the rotation shaft and rotating with the holding part; a fixed terminal for applying current or a voltage to the semiconductor substrate through the rotatable terminal, the fixed terminal being in contact with the rotatable terminal to form a sliding surface perpendicularly to the rotation shaft and electrically connected to a power supply; and a sensor part for detecting a rotational state of the rotation shaft. Protection means for protecting the sensor part against fine particles produced at an interface between the fixed terminal and the rotatable terminal is provided between the sliding surface and the holding part.

Abstract: A dielectric film forming method includes forming on a surface of underlie substance a film of an oxide dielectric material including lead or bismuth, treating a surface of the oxide dielectric film with solution of nitric acid, and crystallizing the oxide dielectric film by annealing the film to obtain an oxide dielectric film. This provides a method of forming a dielectric film with good dielectric characteristics.

Abstract: The present invention relates to a method of manufacturing a semiconductor device including steps of fabricating a capacitor. In a semiconductor device having a capacitor, the capacitor includes a lower electrode, a dielectric oxide film formed on the lower electrode, and an upper electrode formed the dielectric oxide film and formed of at least platinum in which oxygen is contained at a concentration of more than 1×1020 atoms/cm3. Accordingly, peeling of the upper electrode can be prevented and electric characteristics of the capacitor can be improved.

Abstract: A dielectric film forming method includes forming on a surface of underlie substance a film of an oxide dielectric material including lead or bismuth, treating a surface of the oxide dielectric film with solution of nitric acid, and crystallizing the oxide dielectric film by annealing the film to obtain an oxide dielectric film. This provides a method of forming a dielectric film with good dielectric characteristics.

Abstract: There is disclosed a water-soluble vitamin composition which containing about 90 to 99.8% by weight of a water-soluble vitamin, a polymer binder and at least one additive selected from the group consisting of monosaccharides, disaccharides, sugar alcohols, dextrin and organic acids, which can provide a tablet having high mechanical strength (hardness) with less compression problem and easy disintegration, upon compression. A process for producing the composition is also disclosed.

Abstract: An apparatus for coating vertically extending wires with paint in which the temperature of a paint bath is accurately maintained and temperature variations within the bath are largely eliminated so as to provide constant coating characteristics. Vertically extending coating chambers are provided having relatively small cross-sectional areas so that heat generated by an adjacent heating element is spread evenly throughout the paint bath. A coating die is disposed at the top of each chamber. A discharge element is provided near the coating die and a paint receiving pool is stationed to receive the paint discharged through the outlet. The paint pool is in fluid communication with the bottom portion of each of the chambers.