Patents by Inventor Hiroshi Atsumi

Hiroshi Atsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10442982
    Abstract: To deliver surfactants or tracers to underground oil fields, inorganic encapsulated surfactant nanoparticles or microparticles that are stable for several weeks under high temperature and high salt conditions can be used.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: October 15, 2019
    Assignee: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Angela M. Belcher, Nurxat Nuraje, Yu Lei, Hiroshi Atsumi, Xunpei Liu
  • Publication number: 20160340569
    Abstract: To deliver surfactants or tracers to underground oil fields, inorganic encapsulated surfactant nanoparticles or microparticles that are stable for several weeks under high temperature and high salt conditions can be used.
    Type: Application
    Filed: May 20, 2016
    Publication date: November 24, 2016
    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Angela M. Belcher, Nurxat Nuraje, Yu Lei, Hiroshi Atsumi, Xunpei Liu
  • Patent number: 7674978
    Abstract: A wire harness includes a conductive member configured to connect electric members to each other for electric conduction; a covering member configured to enclose and cover the conductive member, the covering member being formed of a first insulating material; and a retaining member configured to enclose the covering member so as to define a space between the covering member and the retaining member, the retaining member being formed of a second insulating material.
    Type: Grant
    Filed: August 2, 2006
    Date of Patent: March 9, 2010
    Assignee: Sony Corporation
    Inventors: Seiichi Tsunoda, Hiroshi Atsumi
  • Publication number: 20070081113
    Abstract: A wire harness includes a conductive member configured to connect electric members to each other for electric conduction; a covering member configured to enclose and cover the conductive member, the covering member being formed of a first insulating material; and a retaining member configured to enclose the covering member so as to define a space between the covering member and the retaining member, the retaining member being formed of a second insulating material.
    Type: Application
    Filed: August 2, 2006
    Publication date: April 12, 2007
    Applicant: Sony Corporation
    Inventors: Seiichi Tsunoda, Hiroshi Atsumi